3D Glass Solutions (United States)

ABSTRACT There is a gap in hydrological and water data in New Mexico, a state known for its arid to semi‐arid climate. The lack of access to these data presents a challenge to effective water management. The Dynamic Statewide Water Budget (DSWB) model represents an effort to apply water balance and system dynamics methodologies to estimate and quantify water budget components and to provide an accessible online tool for hydrological and water data in New Mexico. This paper highlights the model and presents the analysis and evaluation of the dynamic behaviour of selected hydrological variables in relation to climate change and drought, using data obtained from the model. The online DSWB interactive tool was also reviewed and evaluated for its role in providing hydrological data characterisation and demonstrating modelled results that compare multiple variables and scenarios across different spatial scales. The model performance was evaluated against measured and published data using several statistical indicators, including the correlation coefficient (0.95), root mean square error (8.24 kAF/year), Nash–Sutcliffe efficiency (0.84), performance index (0.96), coefficient of residual mass (0.04), index of agreement (0.92), mean absolute error (6.82 kAF/year), and mean absolute relative error (14.39%). All these metrics indicate satisfactory model performance. The findings indicate a decline in runoff from snowmelt and significant variability in surface water inflow due to climate change. They also demonstrate an interrelated relationship between drought conditions, surface water inflow, and groundwater storage, highlighting the interconnected dynamics among them. Drought further affects evaporation rates from reservoirs, while declining surface water availability leads to increased groundwater pumping to meet irrigation demand, emphasising the reliance on groundwater during drought periods. Groundwater storage has also been steadily decreasing, especially in regions that depend on fossil aquifers receiving little to no recharge. Overall, the model results indicate acceptable levels of accuracy and reliability, making it a useful tool for water management by providing hydrological estimates and predictions, as well as identifying key trends in water conditions. The DSWB model reflects a serious effort and promising attempt to fill existing knowledge gaps related to the water budget and provides a practical framework that can be utilised to improve water resource management in New Mexico. This model may also pave the way for developing additional water budget models based on the same methodology in other arid and semi‐arid regions around the world with hydrological data limitations.

This work presents a manufacturing platform for the vertically stacking of glass substrates with heterogeneously integrated surface mount devices for advanced RF systems-inpackage, including the design, fabrication, and assembly of a true 3D Heterogeneously Integrated vertically assembled half-duplex <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$6-12 \text{GHz}$</tex> Tx-Rx module using 4 stacked glass layers with 14 embedded components. The half-duplex RF system performance are excellent in three assembled modules as designed and simulated and measured.

The push for higher communications frequencies, greater system integration, and smaller space imparts many unique challenges on RF and packaging engineers in the development of next generation cellular products for 5G, WiFi 6, Military, and other applications. Traditional materials, such as LTCC, organic laminates, and silicon face major limitations to dramatically improve system size, weight, and performance (SWAP). Photosensitive Glass-Ceramics (PSG) have gained a lot of attention as a next generation RF and RF packaging substrate for their ability to simultaneously solve these two important challenges. In this paper the authors will present on our work using PSG for RF and RF packaging solutions. We will share (1) the advantages of using PSG for advanced RF packages, and (2) our work demonstrating glass as an RF substrate integrating discrete components and embedded die for passive RF filters, and (3) our work towards building vertically stacked glass packages for advanced RF systems-in-package (SiP). The described work presents a manufacturing platform for the production of vertically stacked glass substrates with integrated high Quality Factor passive devices, such as inductors and capacitors, and heterogeneously integrated surface mount devices for advanced RF systems-in-package. The presented material demonstrates a production and assembly process for the manufacturing of advanced systems. In this paper, we present design, production, assembly considerations that impact size, weight, and performance (SWAP) metrics for a variety of product definitions and multiple simulation vs. product testing to demonstrate a reliable design to product flow.

Abstract In this work, a novel series of oxyfluoride glasses‐ceramics (GCs) is developed by enhancing the phase separation through the substitution of LaF3 for La2O3. The thus‐derived GCs exhibit a remarkable 2700‐fold increase in up‐conversion (UC) luminescence of Er3+ ions compared to the precursor glass. From the 19F Nuclear Magnetic Resonance analysis, this enhancement is attributed to the structural disorder‐to‐order transition in the fluoride‐rich phase. Upon isothermal heat treatment, the translucent GCs transform into transparent ones, making UC luminescence even stronger. The enhanced UC luminescence leads to strong temperature‐sensing ability of the studied glasses. The nano‐micro phase separation is clarified by atomistic simulations and scanning electron microscopy. This study implies that phase separation engineering is a powerful way to achieve superior photonic performances.

Glass is being evaluated for several high frequency RF applications due to its insulative properties. Part sizes and critical dimensions can be significantly reduced without risking interaction between lines. Concerns arise in regard to using glass in high power, thermal, applications due to the fact that it is a poor conductor of heat. 3D Glass Solutions (3DGS) has a unique in-glass process that helps to circumnavigate this issue. Unique via shapes, with small diameters, can be placed very near one another to allow for the creation of high aspect ratio designs and a high density via array. By adding surface metallization, heat spreaders, heat sinks and sub-mounts can be created in small package sizes for the bulk cooling of electronic devices. Additionally, signal lines and circuit routings can be placed directly within and on the surface of a microfluidic chiller in order to increase and/or transport heat to different areas of the product. A pressurized cooling fluid can be pushed through the chiller, while still protecting the electronic signal I/O’s within the part. This provides a positive outlook for small electronic cooling devices integrated into a single or multi-layer part alleviating concerns for negative thermal implications within the RF realm.

A distributed system with interchangeable constraints for studying skillful human movements via haptic displays is presented. A unified interface provides easy linking of various physical models with 2D and 3D static spatial constraints, and the graphical contents related to the models as well. The motion analysis is based on the data recorded by system’s History Unit with a frequency of 100Hz. Theoretical and experimental kinematic profiles are compared for several cases of basic reaching rest-to-rest tasks: curve-constrained motions with different curvatures, flexible object control, and cooperative two-arm movements. The experimental patterns exhibit the best agreement with the optimal control models based on jerk and force-change minimization criteria.

Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility needs in consumer electronics. Furthermore, IC packaging is widely seen as a method to prolong Moore's law. Historically, silicon has been the material of interest for interposer materials given its prevalence in IC production, but it presents many technical and costs hurdles. In contrast, glass interposer technology presents a low cost alternative, yet attempts at producing advanced through glass vias (TGVs) arrays using traditional methods, such as laser ablation, have inherent process flaws, such as reduced interposer mechanical strength and debris sputtering among others. In this extended abstract we present 3D Glass Solutions' efforts in using our proprietary APEX™ Glass ceramic to create various interposer technologies. This extended abstract will present on the production of large arrays of 10 micron diameter TGVs, with 20 micron center-to-center pitch, in 100 micron thick APEX™ Glass ceramic and the comparisons of wet etching of APEX™ Glass vs. laser ablation.

The most singular focus of the electronics industry during the last 50 years has been to miniaturize ICs by miniaturization of transistors and on-chip interconnections. Two major problems are foreseen with this approach; (1) electrical leakage and (2) the lack of improved electrical performance beyond 16nm. As a result, the industry is transitioning from the current SOC-based approach to a through-silicon-via (TSV) based 3D IC-stacked approach. However, a major challenge remains; these 3D ICs need to be interconnected to other ICs with a much higher number of I/Os than are available with current ceramic or organic interposers. While silicon interposers currently in development can provide these high I/Os, they cannot do so at low enough cost. In this extended abstract, 3D Glass Solutions, a division of Life BioScience, Inc., presents our efforts in glass interposer microfabrication. Glass interposers possess many advantages over silicon interposers including: cost, production time, and scale. 3D Glass Solution’s APEX™ Glass ceramic is a photo-sensitive material used to create high density arrays of through glass vias (TGVs) using three simple processing steps: exposure, baking, and etching. To date, we have been successful in producing large arrays of 12 micron diameter TGVs, with 14 micron center-to-center pitch, in 125 micron thick APEX™ Glass ceramic. This extended abstract covers (1) on our efforts producing high aspect ratio TGVs in ultra thin (75–250 micron) APEX™ Glass ceramic wafers, (2) maximum TGV aspect ratios, and (3) TGV fidelity and limits of manufacturing.