AU Optronics (Taiwan)

Plant-derived exosome-like extracellular vesicles (PELVs) have recently emerged as novel bioactive materials. Although members of the Orchidaceae family have been reported to possess various biological activities and are widely used as cosmetic ingredients, no studies to date have investigated exosome-like extracellular vesicles derived from Phalaenopsis species. In the present study, we report for the first time a novel exosome-like extracellular vesicles preparation isolated from Phalaenopsis aphrodite (called Exorigin® OR) and characterize its physical and biological properties. The purified vesicles exhibited a spherical shape surrounded by a bilayered membrane with an average particle size of approximately 98 nm and expressed a CD9 marker. Fluorescent labeling with BODIPY TR indicated that Exorigin® OR can be internalized by cells. In in vitro assays, Exorigin® OR alleviated hydrogen peroxide-induced damage in keratinocytes and inhibited melanin production in melanocytes, possibly associated with the downregulation of Tyrp1 expression as shown by qPCR analysis. Moreover, reconstructed human epidermis and cornea-like epithelium models demonstrated that Exorigin® OR is non-irritant. Collectively, these findings suggest that Exorigin® OR represent a promising and safe bioactive ingredient for promoting skin health in cosmeceutical applications.

Conventional simulation methods for waveguide augmented reality (AR) displays rely on CPU-based commercial software and precomputed bidirectional scattering distribution function (BSDF) data, which are computationally expensive and inefficient for large-scale design optimization. To overcome this limitation, we developed a fast and open-source GPU-based ray-tracing algorithm that performs parallel computation using a look-up table (LUT) constructed from rigorous coupled-wave analysis (RCWA) results. A full-color diffractive waveguide design is used as the validation model, and the simulated results closely match those obtained from LightTools using BSDF input. Benchmark tests show that the proposed GPU algorithm achieves 7.63 × 106 rays/s on an NVIDIA RTX 4080, representing a 57× speed improvement compared with an Intel Core i7-12700 K CPU. System performance is further analyzed in terms of efficiency, color uniformity, FoV uniformity, and eyebox uniformity. These results demonstrate that the proposed algorithm provides accurate optical predictions while significantly reducing the computation time, enabling rapid and scalable evaluation of diffractive waveguide-based AR displays.

A high-speed traveling-wave (TW) electroabsorption modulator laser (EML) using a ridge-type waveguide and low-dielectric-constant BCB cladding structure has been demonstrated to promote impedance matching in TWEAM. 500 hm termination on TWEAM with >10dBm optical power, >60GHz bandwidth, 100 Gbps PAM4 eye diagram has been shown.

The demand for high-power, high-density VCSEL light sources in applications such as space, artificial intelligence, silicon photonics, and autonomous vehicles is steadily increasing. VCSEL chips are epitaxially grown on GaAs substrates and then packaged by attaching them to a mounting bracket using high-temperature-resistant adhesives. This issue limits the VCSEL’s output power, and restricts its application range. We propose first removing the VCSEL epitaxial layer from the GaAs substrate and transferring it to a CuW substrate. The VCSEL chip is then mounted on an AlN substrate using a metal eutectic bonding technique. The results indicate that bonding 36 VCSELs with a wavelength of 840 nm to CuW chips and mounting them onto an AlN substrate to form an array achieved voltage of 8.59 V and a driving current of 18 A. The output optical power reached 57.68 W, with a reduced packaging thermal resistance of 0.232 K/W.

This paper presents a "Comprehensive Waste Risk Management Process" in response to fluctuations in the waste disposal market. Focused on AUO's facilities in Taiwan, the process encompasses planning, production, storage, and disposal phases to manage risks. The platform provides early warnings and real‐time data to ensure waste management risks remain controllable.

The utilization of large‐sized active matrix reflective cholesteric liquid crystal (ChLC) technology in outdoor public information displays (PID) has gained significant attention. This technology leverages the unique optical properties of ChLC to enhance visibility and reduce power consumption. ChLC technology operates without the necessity of backlight, relying instead on ambient light for image presentation. Its bistable characteristics ensure that energy is only consumed during image updates, thus providing significant energy efficiency. In applications for outdoor PID, the incorporation of wide‐temperature materials, combined with active matrix, has successfully led to the development of the world's largest 32‐inch full‐color ChLC reflective display. Active matrix ChLC displays can achieve large sizes, rapid page transitions, ultra‐low power consumption, and high picture quality, making them one of the most promising technologies currently available.

Antenna on display (AoD) for user equipment (UE) is attractive but faces challenges in implementation. Key factors impacting the AoD implementation are examined in this article. To illustrate the basic behaviors and demonstrate its feasibility, a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1\times 4$ </tex-math></inline-formula> optically invisible antenna array is designed, fabricated, and implemented on a display panel at a 5G millimeter-wave (mm-wave) frequency band of 28 GHz. Metal mesh is used as a conductor in the antenna design to provide a high transmittance of around 88%. Novel dummy metal grids of electromagnetic (EM) transparency are added around antennas to increase the optical invisibility of AoD. Moreover, an mm-wave beamforming board and a feeding network on a flexible printed circuit (FPC) board are implemented to emulate the actual scenario for the AoD design. The maximum antenna gain of 7.36 dBi for a <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$1\times 4$ </tex-math></inline-formula> optically invisible antenna array has been achieved with the scanning range between ±30°.

The advancement of light-emitting diode (LED) packaging technology has been driven by the increasing demand for high-performing and compact lighting solutions. Traditional packaging methods, such as chip-on-board technology and surface-mount technology, face challenges in meeting the demands for high input/output density and effective thermal management. This scenario has led to the adoption of advanced packaging technologies, including wafer-level packaging (WLP) and fan-out (FO) technology, which offer advantages such as improved surface flatness, reduced dielectric loss, and cost-effectiveness. This study presents a novel FO-LED architecture with a redistribution layer (RDL)-first design to achieve high density and thin form factors. A 3-D finite element analysis (FEA) model that incorporates equivalent material properties for the RDL and Cu pillar bumps is developed to analyze the warpage behavior induced during the FO-LED assembly fabrication process. The model’s validity is confirmed by comparing simulation results with experimental measurements obtained at various stages of FO-LED fabrication. A parametric study is conducted to evaluate the impact of four control factors—Young’s modulus of polyimide (PI), coefficient of thermal expansion (CTE) of PI, RDL thickness, and curing temperature—on warpage performance. The findings highlight that the warpage in the FO-LED is significantly affected by the CTE mismatch between the RDL, the LED, and the silicon substrate, with the properties of the PI material playing a crucial role. These insights offer valuable guidance for the design and optimization of robust FO-LED packages.