Boschman Technologies (Netherlands)

ABSTRACTIntroductionLiving with a suicidal relative impacts multiple life aspects. However, it is not known how religious beliefs and meaning‐making influence relatives' experiences.AimThis study aimed to develop a theoretical framework to understand the role of religion in the experiences of Christian relatives living with a suicidal loved one.MethodsA constructivist grounded theory study was conducted, adhering to the COREQ checklist. Fifteen interviews were conducted with seventeen Christian relatives of suicidal individuals.ResultsFour themes emerged—acceptance of suicidality, seeking and experiencing God's help, surrendering to God, and religion's influence on relationships—forming a framework on how relatives' religious convictions about suicide and the intensity of their personal relationship with God influenced to what extent religion was helpful or harmful.DiscussionChristian faith provided peace of mind and support to relatives who had a personal relationship with God and believed their loved one would go to heaven. Relatives who believed their loved one would go to hell due to suicide and lacked a relationship with God experienced guilt and fear, making them vulnerable to harm from religion.Implications for PracticeEducational institutions and policymakers should specifically empower nurses to discuss spiritual issues when supporting relatives of suicidal individuals.Relevance StatementThis study offers valuable insight into the role of religious beliefs and meaning‐making influencing the experiences of Christian relatives living with a suicidal loved one. It highlights religion‘s role in their coping processes. The findings equip mental health nurses with a deeper understanding of religious coping strategies, enabling them to provide better support to relatives. Integrating spirituality/religion into support allows nurses to respond more holistically to relatives‘ needs, potentially improving their well‐being and resilience. Spiritual care is a part of nursing, but nurses feel unprepared. It is recommended that education and policy focus on nurses to better support relatives.

To meet the reliability demands of high-temperature electronic packaging, this study investigates Cu– Ag composite materials fabricated via pressureless sintering. The mechanical and interfacial evolution behavior under 175 °C thermal aging was systematically analyzed. Shear strength was evaluated across multiple time points, and representative samples were characterized using SEM and EDS. The results reveal a typical three-stage behavior of densification–stabilization–degradation during aging. Progressive Cu–Ag interdiffusion was observed at the interface, and oxygen segregation became evident in later stages, potentially affecting microstructural stability. This study provides theoretical guidance for interfacial design and long-term reliability optimization of pressureless sintered interconnect materials.

An approach for optimal control of the interface between water and ferrofluid in a 2-D two-phase flow is proposed in the presence of a magnetic field generated by a matrix of driving electromagnets. First, a model combining Navier-Stokes equations and level set methods is developed. Since it is very computationally demanding, an approximate black-box model based on neural networks replacing the original model is constructed for the purpose of control design. In particular, one-hidden-layer feedforward neural networks with a different number of neurons are trained to predict the water-ferrofluid behavior with accuracy. Then, optimal control based on such black-box models is addressed by selecting the currents flowing in the electromagnets that minimize a cost function given by the symmetric difference between the desired shape and the actual interface separating water and ferrofluid. Numerical results based on both simulation and experimental data collected on the field showcase the effectiveness of the proposed approach.

Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received much attention in attaching power dies due to its superior high-temperature reliability. This paper investigated the sintering properties of nanosilver film in double-side sintered power packages. X-ray diffraction results revealed that the size of nanosilver particles increased after pressure-free sintering. Compared with the pressure-free sintered nanosilver particles, the 5-MPa sintered particles showed a higher density. When increasing sintering pressure from 5 to 30 MPa, the shear strength of the sintered package increased from 8.71 to 86.26 MPa. When sintering at pressures below 20 MPa, the fracture areas are mainly located between the sintered Ag layer and the surface metallization layer on the fast recovery diode (FRD) die. The fracture occurs through the FRD die and the metallization layer on the bottom molybdenum substrate when sintering at 30 MPa.

This article shows the fabrication process and packaging of through polymer optical vias (TPOV). The TPOV enables encapsulation and packaging of silicon photonic systems using film assisted molding (FAM) and the creation of micron-sized through polymer optical vias. The optical vias are lithographically defined in thick film photoresist (~300 μm) and parallel processed on substrate level. Placing and connecting optical windows on individual chips using pick & place is a difficult and time-consuming process because of the stringent requirements on alignment accuracy, cost and throughput. In this work we provide a solution to this problem by combining microfabrication technology with backend film assisted molding technology for a new packaging approach for the integration of optical windows. As feasibility study we show through polymer optical windows on optical encoder Si photodiode arrays. The resulting microstructures are transparent in the spectrum of interest and hence serve as optical windows towards the substrate. Furthermore, our results show that the high aspect ratio (5:1) micro structure windows can be achieved and protected using FAMtechnology. The optical through package windows are accurately defined (±5 μm accuracy due to mask limitations) and can significantly improve the throughput. The total process time of a single wafer with up to 1260 chips and 20160 windows, including lamination, exposure and development, would approximately take 1-1.5 hours.

Photonic devices like Optical transceivers, Solar cells, LED's (Light Emitting Diodes) etc, have been developed for high speed data communication, power generation and light sources. Photonics include, among others, emission, transmission, switching and sensing of light. GaAs and GaNi are examples of semiconductor materials used to create diodes, able to generate light. Different types of diodes can be made to generate light in the spectrum ranging from Ultra Violet via visible to Infra Red light. VCSEL's (Vertical Cavity Surface Emitting Laser diodes) can be used for data transmission via thin glass fiber cables and operate mainly at wave lengths around 850 nm. Photo diodes are used as light sensors and are able to receive data in the form of light pulses or modulated light. A photo diode is sensitive for photons striking the diode surface also known as the photo electric effect. When used for environment lightening, LED's can generate light in a variety of colors in the visible spectrum. Solar cells are light sensitive diodes used in a Photo Voltaic mode and able to convert sun light into electric energy. In most of these applications the diodes require a lens because the light is diffracted and a lens must be used to collimate the light. Due to their application and operating environment these diodes require a different assembly and packaging approach compared to conventional semiconductor devices. The focus of APC (Advanced Packaging Center) is on package design, process development for assembly and encapsulation of these types of devices and the generation of samples and low volume production quantities. The choice of package concept, lens parameters, assembly and encapsulation materials are of utmost importance for the functioning and reliability of the devices. For example the design of optical transceivers requires the package design to be such that no cross talk can take place between transmitter and receiver and the glass fiber cables can be connected in a reliable way. To limit transmission losses, the assembly process requires high precision lens shapes and accurate placement of transmitter / receiver chips towards their lens centers. Encapsulation material properties like adhesion, transmittance, refractive index, CTE should be taken into account. Photonic devices are often subjected to extreme environments of radiation and heat and have to full fill a life time expectancy of 10 to 20 years.

To meet the needs of ambient intelligence and the mimaturization of electronics, a MEMS/sensor package with exposed windows needs access to the environment. This presents a challenge for MEMS or sensor packaging/encapsulation. The exposed die and MEMS/sensor are brittle and can not withstand large stresses. By clamping a film around the chip's functional area, the surface of the chip is protected by film and the MEMS/sensors exposed window will be bleed and flash free. Relative to steel clamping force, the clamping force when using soft film is dramatically decreased. Film Assisted Molding (FAM) technology can meet the packaging demands of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the advanced MEMS microsystems with low cost and excellent performance. Tiny exposed windows can be directly realized in the mold cap with film assisted transfer molding technology. This technology can be adopted to thru-mold vias for Package on Package (PoP) applications. Film assisted technology also opens the opportunity of wafer level transfer molding with an exposed window. The increasing demand for light emitting diodes (LEDs) has been driven by many applications, including communications, signage and large power solid state lighting (SSL). The LED encapsulation can be implemented by film assisted molding technology in die, package and module level. High power Solid state lighting (SSL) is a new promising lighting technology based the brightness light emetting diode (LED), which is promising to replace the conventional light sources for its economic and environmental saving. The encapsulation of SSL at die and module level is a challenge with low costs and high efficiency thermal management.

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and sensor. A MEMS/sensor package needs access to environment via open windows, which is a challenge for MEMS or sensor packaging/encapsulation. An exposed window is needed to access to the environment for encapsulated MEMS package like gas and liquid sensors. Generally, the exposed die and MEMS/sensor are brittle and can not stand large stress. By clamping the film around the chip's functional area, the surface of the chip is protected from the compound and will be bleed and flash free. Comparing to steel clamping, the clamping force can decrease dramatically with soft film conpensation. Boschman Film Assisted Molding (FAM) technology can meet the packaging demand of the MEMS and sensor functional opening area. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS microsystem with low cost and excellent performance.