Enervana Technologies (United States)

Cu-based, single- and double-layered, microchannel heat exchangers (MHEs) were fabricated and assembled. Comparative measurements on liquid flow characteristics and heat transfer performance were conducted on these devices. Results were compared at the individual microchannel level as well as at the device level. The present results demonstrate that double-layered MHEs exhibit similar heat transfer performance while suffering a much lower pressure drop penalty compared to single-layered MHEs. Another Cu-based, double-layered, liquid–liquid counter-flow MHE was fabricated, assembled and tested. Results show that a low-volume, multilayered, high-performance, liquid-to-liquid MHE is achievable following the manufacturing protocols of the present double-layered, liquid–liquid counter-flow MHE.

Titanium boride thin films were deposited at low temperatures by balanced magnetron sputtering and inductively coupled plasma (ICP) assisted balanced magnetron sputtering. The chemical composition, surface morphology, structure, and mechanical properties of titanium boride thin films were characterized by X-ray photoelectron spectroscopy, scanning electron microscopy (SEM), transmission electron microscopy, and instrumented nanoindentation. As compared to titanium boride films deposited by balanced magnetron sputtering, the increase in plasma density surrounding the substrate surface during film growth afforded by the ICP assist causes significant film densification and mechanical property improvement. The morphology of titanium boride thin films deposited onto microscale non-flat Ta substrates and their effectiveness as barrier coatings for microscale compression molding of Al was characterized by focused ion beam sectioning and SEM. The present results show the potential of low-temperature deposited, conformal, titanium boride thin films for engineering surfaces of microscale mold inserts for microscale pattern replication in reactive metals by compression molding.