- Conference Article
9
- 10.1117/12.855027
A 3D chip architecture for optical sensing and concurrent processing
- Apr 30, 2010
- Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
- Ángel Rodríguez-Vázquez + 9 more +9
This paper presents an architecture for the implementation of vision chips in 3-D integration technologies. This architecture employs the multi-functional pixel concept to achieve full parallel processing of the information and hence high processing speed. The top layer includes an array of optical sensors which are parallel-connected to the second layer, consisting of an array of mixed-signal read-out and pre-processing cells. Multiplexing is employed so that each mixedsignal cell handles several optical sensors. The two remaining layer are respectively a memory (used to store different multi-scale images obtained at the mixed-signal layer) and an array of digital processors. A prototype of this architecture has been implemented in a FDSOI CMOS-3D technology with Through-Silicon-Vias of 5μm x 5μm pitch. © 2010 Copyright SPIE - The International Society for Optical Engineering.
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