- Conference Article
- 10.23919/panpacific70217.2026.11413877
Reliability of Cu-Wrap and Braided CGAs for Extreme Cold Applications
- Feb 02, 2026
- Reza Ghaffarian + 1 more +1
This paper presents the thermal cycling reliability of two types of 1657 I/O ceramic column grid array (CGA) assemblies subjected to sequential thermal cycling. It includes a newly developed CGA with braided columns in comparison with a standard copper-wrapped column version. CGA packages are widely used for high-reliability (HR) electronics applications. The daisy-chain CGA packages were assembled onto inversed paired daisy-chain printed circuit boards, primarily using vapor phase reflow, with two assemblies completed using a rework station. The paper first compares the material and mechanical characteristics of the two column types, including pull and bending fatigue strengths. Following visual inspection of peripheral columns and daisy chain verifications, all CGA assemblies were subjected to sequential thermal cycling to determine cycles-to-failures (CTFs). Cycling was performed between <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$-55^{\circ} \mathrm{C}$</tex> and <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$+125^{\circ} \mathrm{C}$</tex> for 200 cycles. Subsequently, the cold-side temperature was reduced to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$-100^{\circ} \mathrm{C}$</tex> to evaluate the effect of extreme cold temperature on solder-joint failure mechanisms and reliability. Daisy-chain continuity was verified after 200 cycles within the <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$-100^{\circ} \mathrm{C}$</tex> to <tex xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">$+125^{\circ} \mathrm{C}$</tex> range. Results of thermal cycling and inspections are presented with failures identified either due to workmanship issues or wear out mechanisms for the two CGA types. Failure locations were established via five-zone daisy-chain patterns to determine CTF dependency on the distance from the neutral point (DNP) and to identify potential shifts in failure mechanisms under extreme cold cycling conditions.
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