- Conference Article
- 10.1109/impact63555.2024.10818939
Driving Efficiency and Reliability in AI Hardware: Leading Edge Pulse Plating Solutions for Uniform Copper Deposition
- Oct 22, 2024
- Mustafa Özkýk + 5 more +5
The rapid expansion of the artificial intelligence (AI) market has created an urgent demand for innovative and efficient solutions in the manufacturing of integrated circuit (IC) substrates. A critical aspect of IC-substrate production is electrolytic copper plating, essential for ensuring electrical conductivity, reliability, and overall performance of the circuits. Traditional copper plating techniques often face challenges in achieving uniform deposition and adequate copper thickness in through-holes, which are crucial for high-performance AI applications. This paper explores recent advancements in electrolytic copper plating technologies, focusing on the application of pulse plating in vertical conveyorized equipment to address these challenges and deliver superior results.
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