MicroXact (United States)

ABSTRACTResistive memory materials and devices (often called memristors) are an area of intense research, with metal/metal oxide/metal resistive elements a prominent example of such devices. Electroforming (the formation of a conductive filament in the metal oxide layer) represents one of the often necessary steps of resistive memory device fabrication that results in large and poorly controlled variability in device performance. In this contribution we present a numerical investigation of the electroforming process. In our model, drift and Ficks and Soret diffusion processes are responsible for movement of vacancies in the oxide material. Simulations predict filament formation and qualitatively agreed with a reduction of the forming voltage in structures with a top electrode. The forming and switching results of the study are compared with numerical simulations and show a possible pathway toward more repeatable and controllable resistive memory devices.

not Available.

ABSTRACTWe propose using macroporous silicon as an ultra-high aspect ratio scaffolding for epitaxially grown thermoelectric materials, so that thin films can be shaped into materials thick enough for practical devices. The self-limiting nature of atomic layer deposition (ALD) makes it an ideal growth technique for this substrate, as uniform thickness can be obtained at all points inside the macroporous structure, and we demonstrate successful deposition of antimony telluride on pore walls using ALD. Extension of this work to telluride superlattices should enable fabrication of thermoelectric devices with figures of merit (ZT) in excess of 2. Characterization of the thermoelectric and other properties of ALD grown telluride on silicon is ongoing.