Milacron (United States)

An Indonesia manufacturing company producing Airbus wing parts experienced losses of more than $100,000 in 2017. The production of A 380 wing parts contributed to 73% of the total losses, and 37% came from parts production of A 350 and A 320. The study focused on the most significant contribution losses of A 380 wing parts that is Drive Rib 1. This paper aims at examining the root cause of the loss in A 380-Program, solving the root cause by proposing the alternative solution, and improving the performance in A 380 Program. By conducting the interview and archival data, the data were analyzed employing Root Cause Analysis (RCA) to discover the root cause of problems. Low reliability of the production machine (DGAL Cincinnati Milacron) was identified as a root cause indicated by Overall Equipment Effectiveness (OEE) at 50.3% used since the 1980s. According to Total Productive Maintenance (TPM), this study proposes three alternative business solutions (autonomous maintenance, quality maintenance, and machine replacement). By considering the results of OEE and Analytical Hierarchy Process (AHP) with three criteria (cost, benefit, and implementation), the problem-solution proposes two approaches, namely conducting the autonomous maintenance with an improvement of OEE about 7% for the short term period and organizing the machine replacement with a significant OEE improvement about 17.1%.

Python interface to Epics Channel Access

The objective of the study was to investigate size-selective concentrations of airborne particles and endotoxin in metalworking fluid (MWF) environments. The experiments were conducted under two conditions: (1) MWF collected in the field was aerosolized with a laboratory-scale simulator (MWF simulator) in the laboratory; and (2) MWFs were aerosolized during routine field operations. All experiments included size-selective measurement of airborne concentrations of particle numbers and endotoxin mass using an electrical low-pressure impactor. During field sampling, the total microbial and endotoxin concentrations in the air were also measured with a BioSampler, and the mass concentration of MWF mists was measured with a photometer. Airborne particle concentrations were highest in the fine particle size ranges in the areas affected by MWFs. Relatively high concentrations of endotoxin were detected at particle size below 0.39 μm, which is smaller than the size of intact bacterial cells. The total microbial and endotoxin analysis revealed high microbial contamination in one sampling site although the total particle mass was not elevated. It was concluded that MWF sites can be contaminated with high concentrations of fine particles, and these fine particles may contain microbial components, such as endotoxin. The results call for the size-selective measurement of particles and endotoxin for more comprehensive exposure assessment in MWF facilities.

ABSTRACT The percentage use of passive components on typical products is very high when compared to other types of components. The industry trends for the shrinking real estate, and increasing density is forcing challenges to reduce the component sizes and increasing the number of I/O's. The passive components are rapidly decreasing in sizes from 0805 to 0603 to 0402 to 0201 to so on (see area and aspect ratios in Table 1). The product characteristics include smaller, lighter, faster, flexible, available, reliable, and cheaper, which dictates the industry trends. Most of these attractions in the products mean challenges in the handling e.g. 0201 construction and 2 nd level assembly. The size of 0201 has become so small that it makes it a little difficult for the traditional inspection technologies to assess the quality of 0201 solder joints. The smaller size of the component not only poses challenges to assess its solder joint quality but the robust solder joint formation becomes challenging as well. Human intuitions primarily impact the inferences, therefore the challenges faced with 0402 are major factors but with larger exponents to compute the 0201 assembly complexity. The paradoxical 0402 characteristics have associated numerous fear factors with 0201 to pronounce them notorious ones. Typically it is said that missed opportunity is a misfortune, whereas the optimum use of the opportunity is a fortune. Opportunities looked from a pessimistic angle become the fear factors whereas looking with optimistic angles provides multiple ways to achieve robust solutions. There are numerous opportunities in the 0201 process, which can be optimized to achieve a robust process. Some of the opportunities associated with 0201 are PCB pad design, stencil design, assembly process parameters, and handling. This paper shows results and highlights the importance of the structured methods, which can provide magic solutions to the fear factors associated with 0201 assembly.

ABSTRACT During the last few years, the Solectron Technical Center has conducted a series of CSP board level manufacturing assessment studies on the self-centering effect during reflow and rework, component placement accuracy requirement, and the effects of pad design and surface finishes. Based on the results of these studies, a standard CSP assembly procedure was established. This procedure is being deployed to all Solectron manufacturing sites and is used to assess each site's CSP assembly readiness. This deployment strategy allows the corporate technology group to assess the technical capability of all Solectron sites to fulfill our commitment to enforce common process on the global basis. This paper will describe the methodology used for the deployment of the CSP assembly process. A test vehicle optimized by incorporating all the findings from the studies on pad geometry, solder volume, and surface finish was designed to assess the reliability of CSP after SMT assembly and rework processes. A series of analyses was performed on the test vehicle including the use of the mechanical deflection system designed by IBM to study the reliability of solder joints. Correlation between fatigue resistance, crack pattern, and their impact on the reliability of solder joints were also established. Stress and displacement under external thermal and mechanical fields were simulated. Finite element method was used to analyze the Von Mises stress and strain energy distributions. The impact of package standoff, die size, and DNP on the fatigue resistance and reliability of solder will be discussed.

COLT, or continuous look through, is a Xetron signal processing technique for the extraction of a weak signal of interest (SOI) in the presence of a larger interfering (I) signal. The process is successful even when the SOI is entirely contained within the spectral bandwidth of the interferer. In addition, unlike common phase cancellation techniques, COLT does not require a separate sample of the interferer. Extraction under these conditions is not achievable with standard linear frequency selective filter networks. The COLT processor therefore enables the excision of desired signals from jamming energy in real time. Successful extraction of the SOI will result even with the input SOI/I ratio as high as -80 dB. Limitations on COLT performance are imposed only by the dynamic range of the host system or propagation anomalies in the communication channel. This paper details COLT's extraction capabilities and provides performance data for various tactical communication applications. >

Several advanced applications of industrial robots in the areas of material handling, welding, and assembly were described. Emphasis was placed on potential improvements that could be made in these application areas through the use of acoustic sensors to gain additional information about the processes and working environment of the industrial robot. The objective of this paper was to stimulate future innovative work in the application of acoustic sensors and sensing systems to industrial robots.