Nordson (United States)

ABSTRACT On-demand webinar originally hosted by SMTA Ontario Chapter Technical Presentation: This presentation will show you how to recognize certain defects, such as HIP, QFN opens, cracks and fractures and many more using high resolution X-Ray. Biography: John Travis is the Sales Manager for Nordson Test & Inspection and is responsible for sales and X-Ray applications for the Northeast region. He has many years of experience with various applications and inspection techniques using digital x-ray imaging. He brings over 30 years of experience in the electronics industry and has been involved in application engineering and the sales of X-Ray inspection equipment for the last 20 years. John Travis On Demand Webinar

ABSTRACT Acoustic micro imaging (AMI) uses high frequency ultrasound (5 to 500 MHz) to image the internal features of samples. Ultrasound is sensitive to variations in the elastic properties of materials and is particularly sensitive to locating air gaps. X-Ray uses short wavelength electromagnetic radiation capable of penetrating most materials to look for discontinuities such as voids in solder bonds. One method may be better for the detection of specific defect types. For instance very thin gaps (delaminations) in a plastic encapsulated package are readily detected using AMI. However, they can be overlooked using X-Ray unless the device is viewed at the correct angle. Another method may be better for accessing the area of interest in the sample through certain types of materials. In plastic encapsulated parts, evaluation of wire bonds is limited using AMI as lower frequencies that have lower resolution are required to penetrate the molding compound. X-Ray however readily penetrates the molding material to provide high resolution images of the bond wires. X-Ray also has the advantage of allowing for rotation of the viewing angle. Although there is overlap of applications between AMI and X-Ray imaging, in some cases one technology can provide information that the other cannot. The examples in this paper will demonstrate how both analysis methods, used together, can provide a more comprehensive evaluation of devices or materials.

In a flip chip BGA package, thermal interface materials (TIMs) are applied for thermal management between the die and the heat spreader or between the heat spreader and the heat sink to conduct the heat generated in the die during component operation. Without a thermal interface, the die will overheat and the components will not function properly. Advanced microelectronics packaging demands high and dynamic standards of its supplier industries in relation to speed, precision and flexibility. For example, the demands on functionality, power density and performance of the components within a die are largely enhanced along with TIM requirements for higher heat resistance. Manufacturers are being asked to apply TIMs on more dies in more complicated geometries and to dispense them during any packaging process. This brings increased challenges for TIM dispensing equipment, such as the ability to handle abrasive and dry TIMs at a high throughput while maintaining precision and repeatability. A high-precision, high-throughput TIM dispensing process has been developed to fill the gap between the traditional slower dispensing of simple patterns and the challenges from emerging package designs. This process is being used in flip chip BGA production lines in package applications from consumer electronics to automotive products. These production lines are in full 24/7 operation with each dispensing system running at 240 units per hour (uph) for audio-video consumer electronics, 360 uph for CPUs/GPUs on smart phones and 750 uph for automobile control panels and computation servers. In this new dispensing system, the valve can be tightly controlled to achieve high dispensing accuracy at fast speeds. The dispense pattern and route can be modified at no cost, in minutes, and during any step in the design or the assembly stage. Shapes that can be dispensed include dots, lines, boxes and circles with fine height and edge definitions of 25micron and 45micron. The process can cover a wide range of pattern dimensions between 0.5mm and 100mm at flow rates of 30–370 mg/sec at a repeatability of 3–15% three sigma. Even TIM that has viscosity as high as 1500kcPs with a heavy load of large and coarse particles such as metals, ceramic and glass beads can be dispensed using this equipment and process. New equipment and processes are under development to further push the limit on higher throughput and precision, increased flexibility and material dispensability.

ABSTRACT Package on Package (PoP) components offer a low cost, high performance solution for stacking of a logic device with memory. There are a number of challenges in the final assembly at the Electronic Manufacturing Services (EMS) facility. An assembly process has been developed for a Bond Via Array (BVA) PoP package having 14mm x 14mm body size with a topside memory module and a bottom logic module. In this PoP design, the solder ball interconnects between the top memory module and bottom logic module has 5 outer rows having 1020 I/O with a 0.24 mm pitch. The solder ball interconnects between the bottom logic module and the PCB is a patterned array having 916 I/O with a 0.4mm pitch. A special focus on this work was the optimization of the stacking process of the memory solder balls to make good interconnections to the BVA wires protruding from the bottom logic package. Topics covered for process evaluation will be vision systems, yield, package alignment and placement, voiding and major-defect identification such as bridging, opens-insufficient solder. Process issues related to solder volume, substrate coplanarity and x-ray inspection techniques will be presented. Finally design recommendations, reliability data and rework techniques will be reviewed.

Anaerobic fluid has been used as an industrial adhesive to seal or bond metal components for both large and small scales. Its use has recently extended to micro-electronics packaging. This novel application brings challenges to the dispensing process due to part handling at micro-scale dimensions and high production throughput. Most high-precision dispensers have fluid paths that are constructed of metal components to ensure product robustness and enable dimensional precision of micro-scale parts. This is incompatible with anaerobic adhesives which cure in the absence of oxygen and utilize metal ions as the catalyst. Furthermore curing accelerates with smaller gaps. A non-contact jetting solution has been developed and applied in production environment to dispense anaerobic adhesives with precise volume control, at high speed, and in continuous operation. Dispensing can be optimized to include a range of hardware dimensions, component surfaces, fluid handling, and process control.

The thermal effects on manifold temperature uniformity and output flow uniformity are important for polymer extrusion die design. Lin and Jaluria (Lin and Jaluria, Polym. Eng. Sci., 37, 1582 (1997)) has carried out a numerical study on conjugate heat transfer for extrusion polymer flow under the assumption that the die body surface is in uniform temperature or heat transfer coefficient. In this study, we have solved the non‐uniform body surface temperature as part of the simulation solutions based on heat flux boundary conditions (including radiation and convection heat transfer). The body temperature is computed in conjugated with the melt polymer flow with non‐linear viscous shear heating effect. The relative tough thermal conditions are set to test uniformity of the temperature distribution on the manifold wall. We also give the results of the heat transfer effect on the flow velocity distribution. POLYM. ENG. SCI., 54:682–694, 2014. © 2013 Society of Plastics Engineers

Basic electrostatic principles are discussed. Their applications to powder, with special requirements for inorganic porcelain enamel powder, are explained

ABSTRACT Conformal coatings have long been used to protect printed circuit boards in harsh environments in the automotive and military industries. Conformal coating has been traditionally applied with a number of techniques, including nonatomized film coating, non-atomized swirl patterns, atomized spray, and needle dispensing. Each of these techniques has their own strengths and weaknesses associated with edge definition, film thickness, and material compatibility. As board density increases and new surface mount components are finding their way into harsh environments, traditional technologies limit the speed and/or precision required to apply materials. There are even new requirements for precision application of conformal coating materials to electronics packaging that are beyond the capabilities of traditional technologies and techniques. The application of jetting technology expands the capability of conformal coating equipment with standard materials. Used alone or in conjunction with conventional technology, jetting can provide higher levels of precision, repeatability and than current methods. This paper explains jet coating technology and gives case studies where jetting can improve quality and productivity.

A new type of microwave multiport antenna switch is presented, which performs high power selective switching into N-output ports using an N-way power divider, N-microwave phase shifters and an N-way RF combining network. This new switch configuration exhibits low insertion loss and demonstrates high system integrity because it overcomes the traditional catastrophic system failure should one active switching element, i.e., one phase shifter, fail. In addition, it is more resistant to degradation of cross coupling and VSWR, during switch failure. >