Plasmatreat (Germany)

Traditionally, wet chemistry processes and vacuum-based gaseous plasmas have been used for the preparation of surfaces and production of functional coatings used in electronics packaging. While these methods have been widely used and accepted in industry, there is always a need for high throughput, lower cost, vacuum-free processes that can produce thin coatings that enhance the performance and longevity of the devices. This talk will provide a step-by-step introduction to the critical steps involved in the preparation of the materials used in power electronics packaging and demonstrate the effect of atmospheric-pressure based plasmas on improving their quality. Starting from the base substrate, results showing the effect of air plasmas on the cleaning and activation of FR4 board materials will be discussed, while the removal of copper oxides from Cu substrates using nitrogen/hydrogen plasmas will be presented. Moving to the next level, the deposition of functional nanocoatings having a thickness range between 15nm and 2µm, produces adhesion promoting layers to epoxy mold compounds (EMC) and electromagnetic interference (EMI) blocking coatings. The organo-silicon chemical structure of the coatings provides improved mechanical hardness, thermal, and electrical insulation compared to pure polymer coatings such as acrylics, without requiring the application of thick layers. Data from the characterization and functional testing of these coatings will be shown, revealing the potential for their use in high volume manufacturing in the electronics industry.

Abstract Osseointegration is highly desirable for implants used for bone replacement. Polyetheretherketone (PEEK) is an attractive material due to its characteristics such as high biocompatibility and Young's modulus similar to human bones. However, PEEK is bioinert, meaning cells do not adhere and proliferate on its surface. This problem is addressed in this study, with the goal of enhancing osseointegration of additively manufactured PEEK. The influences of surface modifications and porous structures on cellular behavior were assessed by wettability and in vitro tests with subclone of the human osteosarcoma cell line‐2 osteoblasts. Overall, the combination of surface modification, type of plasma process used, atmospheric pressure versus vacuum‐based, and surface structuring, especially gyroid structures, improve the cellular proliferation on PEEK. Therefore, its ability to enhance osseointegration is highly promising.

Copper is one of the most commonly used metals in the electronics industry. For example, it is extensively used as a lead frame material in integrated circuit packaging due to its superior thermal and electrical conductivity and low production cost. However, the formation of a native oxide on the surface along with the presence of organic contaminants hinder wire bond strength. The work presented here will focus on a novel approach to remove copper and other oxide layers using a nitrogen/hydrogen (95%/5%) gas plasma chemistry that does not require a vacuum environment. The processes are run at temperature conditions lower than 200°C, and at speed up to 150 mm/s which make the technology attractive for industrial upscaling. Results from the elemental analysis using scanning electron microscopy (EDS-SEM) of the plasma-treated versus as-received copper surfaces will be presented. Also, a brief analysis of the gas plasma-surface interactions, process parameters leading to oxide reduction of various metals (Cu, Sn) and equipment details will be discussed. Aside from improving wire bond strength to lead frames and pads, plasmas can be used to improve die attachment to various metal solder materials for flip chip and other electronic applications.

RESUMEN. Introducción: la tos es una respuesta fisiológica de protección de la vía aérea, produce aerosoles que se identifican por imagen y alcanza una velocidad de hasta ocho metros por segundo. La extubación produce tos, hipertensión, taquicardia, apnea y laringoespasmo, existen métodos para minimizar su aparición. Debido a la pandemia de COVID-19 se han utilizado como profilaxis del reflejo tusígeno, la lidocaína intravenosa y el bloqueo del nervio laríngeo superior. El objetivo fue compararlos en la inhibición de la tos. Material y métodos: se seleccionaron pacientes entre 18-60 años, cirugía electiva con anestesia general balanceada, ASA 1-3, con intubación menor a tres horas. Se aleatorizó un total de 90 pacientes, 45 en cada grupo, se eliminó un total de 10 pacientes por presentar inestabilidad hemodinámica al final de la cirugía o por no administrar dosis intravenosa de lidocaína en el tiempo establecido. Resultados: no hubo diferencia estadísticamente significativa en el número de pacientes que presentaron tos en ambos grupos (13 vs 10, p = 0.4684), de éstos se obtuvo una diferencia estadísticamente significativa en el número de decibeles a favor del grupo de bloqueo (75.6 vs 67, p < 0.001). Conclusiones: el bloqueo (selectivo) presenta menos aerolización que la lidocaína intravenosa en la extubación.

Scientific Research Question: wilate® is a double virus inactivated VWF/FVIII concentrate with a physiological 1:1 ratio of FVIII:VWF. In 2012, a non-interventional study (NIS) was started. In this study Wilate-STATE we are aiming to confirm consistency of efficacy and safety data of wilate® used in routine clinical practice with previous study data.

Newly-formed synaptic vesicles (SVs) are rapidly acidified by vacuolar adenosine triphosphatases (vATPases), generating a proton electrochemical gradient that drives neurotransmitter loading. Clathrin-mediated endocytosis is needed for the formation of new SVs, yet it is unclear when endocytosed vesicles acidify and refill at the synapse. Here, we isolated clathrin-coated vesicles (CCVs) from mouse brain to measure their acidification directly at the single vesicle level. We observed that the ATP-induced acidification of CCVs was strikingly reduced in comparison to SVs. Remarkably, when the coat was removed from CCVs, uncoated vesicles regained ATP-dependent acidification, demonstrating that CCVs contain the functional vATPase, yet its function is inhibited by the clathrin coat. Considering the known structures of the vATPase and clathrin coat, we propose a model in which the formation of the coat surrounds the vATPase and blocks its activity. Such inhibition is likely fundamental for the proper timing of SV refilling.

This article is based on a question of a colleague from North America how coagulation could be triggered between a donor's arm and a fistula needle during plasma donation (synonymous with donor plasmapheresis). The technique of venipuncture and citrate anticoagulation are described. Uncommon and rare problems such as prolonged bleeding, scarring, and thrombosis in plasma donors are discussed. If venous puncture and citrate: blood flow ratio at 1:16 are correctly performed, however, there will be no anticoagulation abnormalities due to plasma donation.