Shellcase (Israel)

ABSTRACT The fast-growing market of portable consumer electronics worldwide has created the need for miniaturization and cost effectiveness of its components. The aim is to get smaller products with more functionality packed into them. Memories, image sensors, integrated passives, ASICs, digital and analog devices are only part of the many types of components found in portable electronics. Minimizing the types of packages for these devices will make SMT process and board design simpler and cheaper. The paper will describe these trends and market needs and compare some of the existing solutions. An example of Wafer Level CSP will be discussed. The paper will show how such technology can answer market needs, by offering the same package for a wide range of applications, with high reliability performance, small footprint and standard SMT assembly.