TE Connectivity (Netherlands)

not Available.

Ever emerging applications in handheld multimedia devices such as mobile phones, laptop computers, portable video games and digital cameras requiring increased screen resolutions are driving higher aggregate bitrates between host processor and display(s) enabling services such as mobile video conferencing, video on demand and TV broadcasting. Larger displays and smaller phones require complex mechanical 3D hinge configurations striving to combine maximum functionality with compact building volumes. Conventional galvanic interconnections such as Micro-Coax and FPC carrying parallel digital data between host processor and display module may produce Electromagnetic Interference (EMI) and bandwidth limitations caused by small cable size and tight cable bends. To reduce the number of signals through a hinge, the mobile phone industry, organized in the MIPI (Mobile Industry Processor Interface) alliance, is currently defining an electrical interface transmitting serialized digital data at speeds >1Gbps. This interface allows for electrical or optical interconnects. Above 1Gbps optical links may offer a cost effective alternative because of their flexibility, increased bandwidth and immunity to EMI. This paper describes the development of optical links for handheld communication devices. A cable assembly based on a special Plastic Optical Fiber (POF) selected for its mechanical durability is terminated with a small form factor molded lens assembly which interfaces between an 850nm VCSEL transmitter and a receiving device on the printed circuit board of the display module. A statistical approach based on a Lean Design For Six Sigma (LDFSS) roadmap for new product development tries to find an optimum link definition which will be robust and low cost meeting the power consumption requirements appropriate for battery operated systems.

The demand of telecom operators for a 15 year lifetime of their systems is imposing a big challenge on component manufacturers. It means that also for optical connectors - which are used in large numbers in DWDM systems - the wear-out region must not be reached even after 25 years. However, how can it be shown that a connector will live for more than 25 years? Different approaches are possible: Collection of field data can supply information on the statistical failure rates at operating temperature. Accelerated aging tests (often simply called reliability tests) try to simulate aging under defined conditions. Our focus is on the reliability qualification according to the PAS (publicly available specification) IEC 62005-9-2 which is based on the co-work of Siemens with the connector manufacturers and assemblers Corning, Diamond, Huber+Suhner, Molex and TycoElectronics. This standard should now be overworked with the help of the results of the first common testing program which has recently been carried out by the Siemens ICN "Center for Quality Engineering".