Universal Scientific Industrial (China)

Automated component polarity detection in Surface Mount Technology (SMT) is critical for quality control, but traditional methods are labor-intensive. To address this, we propose the Hybrid Orthogonal Attention Model (HOAM), a novel dual-branch network designed for high-precision polarity classification. HOAM integrates Multi-Head Self-Attention for fine-grained local features and an EfficientNetV2 backbone for global context. The model effectively utilizes an orthogonal fusion mechanism to ensure complementary feature representation, while Sub-Center ArcFace loss enhances robustness. We evaluated HOAM on a real-world SMT dataset. Experimental results show that our model achieves excellent performance, with prediction confidence scores consistently above 0.9 for correct polarities and below 0.7 for incorrect ones. Compared to traditional methods, HOAM reduces preprocessing time by over 90% while maintaining high accuracy, offering a powerful solution to enhance manufacturing yield and efficiency.

In previous studies, SFIS and SAP data have been used to present SMT OEE, achieving global standardization of factory data standards. Excel data is pushed monthly through automated reporting systems, but only the previous month’s data can be sent at a fixed time each month, which is not conducive to on-site management and timely improvement. This upgrade utilizes Azure Analysis Services (AAS) for big data modeling and preprocessing and uses Power BI to connect AAS models to generate interactive OEE dashboards. Users can set their own conditions to view reports at any time, as well as analyze the root cause of OEE anomalies independently. They can quickly seek improvement and provide accurate historical data for quotation.

Markov Regime-Switching (MRS) models are widely used for modeling equity return time series. Yet standard MRS models may inadequately capture the mean reversion behavior of long-term equity returns and exhibit unstable parameter estimation due to their reliance on normality assumptions within each regime. These limitations in model adequacy can compromise the accuracy of risk exposure measurements for invested assets. To address these issues, we propose a constrained robust MRS (CRMRS) model, which integrates an order restriction and sparse constraints on regime means and transition probabilities to better capture mean reversion while employing a general ρ-based least favorable distribution to improve distributional flexibility across regimes. We assess the method's performance through finite-sample simulations under various scenarios in the presence or absence of atypical values. Furthermore, we empirically validate the improvements in model adequacy and risk exposure measurement using monthly returns from the S&P/TSX Composite Index, the benchmark for Canadian equity performance, where S&P and TSX stand for Standard & Poor's and the Toronto Stock Exchange, respectively. Our findings demonstrate that the proposed CRMRS-Huber produces stable parameter estimates and superior approximations of higher-order moments, such as skewness and kurtosis, and provides balanced intermediate risk evaluation across all cases.

Ports were important water and land transportation hubs. Intelligence, automation, networking, and platformization were the future development trends of ports. The the requirement of real-time monitoring the health status of port machinery was particularly important. A technology was proposed to achieve dynamic monitoring and analysis of key parameters for port lifting machinery. A structure based on the 5G network was designed to finish multi-channel data acquisition, on-line data analysis, massive data transmission, deep data mining, device fault diagnosis and health management. The preprocessing algorithms were used to obtain the valid data and the preliminary assessment of machinery health status were obtained through edge computing. A serial of fault models were stored in the remote server which would provide auxiliary analysis and decision-making. The dynamic monitoring and analysis equipment was produced and the experiments on the port lifting machinery was conducted. The results showed that the technology could accurately identify the port machinery faults and provide warning messages according to the proposed discrimination criteria. Thus the safety risks of port lifting machinery operations would be reduced and the intelligence level of the port would be improved effectively.

O uso cada vez maior de tecnologias digitais acabou por criar um usurio que incorporou caractersticas desse ambiente aos seus anseios. Estamos falando de um usurio que busca por produtos velozes, de fcil acesso e consumo rpido. Embora essa descrio possa gerar a iluso de que esse usurio tem um apego menor a esses produtos, o que se constata que ele anseia por consumir esse mesmo produto em diversos formatos e gneros. O que antes era satisfeito por uma publicao impressa, hoje aparece sustentado por uma multiplicidade de derivados em diversos gneros (cinema, animao, objetos licenciados, entre outros). O novo usurio de histrias em quadrinhos levou a uma adaptao dos meios tradicionais de produo de quadrinhos para os suportes digitais e encontrou nas webtoons, publicaes coreanas criadas dentro de plataformas digitais, um produto que atende bem suas demandas. O presente trabalho busca apresentar como as webtoons adaptaram questes formais tradicionais no mundo dos quadrinhos e quais inovaes agregam a

Fine pitch(≦0.5mm) BGAs were assembled on many kinds of products for many years, such as Smart Handheld Device, Mobile Phone, Network Device, Notebook main board, etc. Normally the BGA defects are solder joint bridge, solder joint open, and BGA solder joint crack during assembly process. Regarding the solder joint crack, most of cases are caused by external force, such as assembly operation, board testing operation, or unmatched mechanical parts assembly. In our case, we found the BGA solder joint crack is not the same root cause as mentioned above. When we got the two defect PDA (Personal Digital Assistant) devices, we did the FA (Failure Analysis) as usual. The first step, we did the functional test and X-ray analysis again to find the failure symptom. The device could work normally again in functional test by pressing the top of CPU (BGA package). We also performed CSA (Cross Section Analysis) and dye and pry test to realize the defect is BGA solder joint crack. Regarding the result, we suspected that the crack might not be caused by external force due to the crack did not locate at the corner or outer row of BGA. But we still can't identify which process or operation to cause the defect. At the same time, we had sorted more same defect boards from our stock. We determined this is not the single case. So, we had three directions to analyze. For material, we had performed push test, CSA and EDS (Energy Dispersive Spectrometer) to verify the solder ball due to the solder crack was at BGA package side. For process, we had conducted two experiments to find out the suspected station and operation. From our experiment result, we had two conclusions. One is the defect could not be eliminated by changing the reflow parameters or the type of reflow oven, the other is the defect occurred in 2nd side SMT process. So, to change the process sequence would be the short-term solution to prevent the defect happen again before we find out the root cause. We also found the defects located at some specific points from our experiment result. Then we focused on the relationship between crack locations and PCB design and found that every crack solder joint has buried via beneath it. It means the buried via is the major cause of solder joint crack during SMT process. So, we had analyzed the structure and filling material of buried via of HDI (High Density Interconnect) PCB. We found the different CTE (Coefficient of Thermal Expansion) between PCB and buried via filling material would caused thermal stress remain around the BGA solder joint by CAE (Computer- Aided Engineering) simulation. When the fine pitch BGA solder joint was proceeded into 2nd side SMT reflow, the thermal stress will split the BGA solder joint. So, how to eliminate the thermal stress will be the solution for BGA solder joint split. Referring to the article for more details discussed.

When the process parameters are not known, we present an approach for establishing X control limits that enables the practitioner to begin monitoring the process means at an earlier stage other than the usual approach. The proposed control limits can be constructed easily through student’s t-distribution and are close to any specific percentile of run length distribution of the true limits, even when only a few initial subgroups are available. Performances of the proposed approach are studied by Monte Carlo simulation. The simulation results show that the proposed control limits perform similarly to the true limits even when the limits are estimated from a small number of initial subgroups .

The rapid proliferation of the Internet has allowed many firms to use this new technology to run Web‐based electronic stores to expand their markets and to enhance the operational performance. Therefore, it is interesting to investigate why electronic commerce benefits some industries more than others, and what factors affect the impact of using e‐Stores on performance in different industries. This paper reports findings on the effect of industrial characteristics, as portrayed by product information content and information intensity of the value chain, and e‐commerce models on firm performance. The results indicate that both industrial characteristics and e‐commerce models have significant effects on firm performance. Among the industrial characteristics, information content of the product and information intensity of the value chain have been found to have a significant impact on firm performances.

The conformations of a number of isomeric 2,3,4-trisubstituted tetrahydrothiophenes were determined by means of angular and temperature dependences of the vicinal proton-proton spin-spin coupling constants (SSCC).