Wintek (Taiwan)

A novel contact resistance model for the flat panel display (FPD) packaging based on the within layer parallel and between layers series resistance concepts is proposed in this research. The FJ2530 anisotropic conductive films (ACF) by Sony Inc., containing the currently smallest 3 μm conductive particles, was used to conduct experiments to verify the accuracy of the proposed model. The calculated chip-on-glass (COG) packaging resistance using the proposed model is 0.165 Ω. It is found that a gold bump with 0.162 Ω resistance play a major role in the overall resistance. Although the predicted resistance using the proposed model is only one third of the experimentally measured value a threefold improvement is obtained compared to existing models.