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  • https://doi.org/10.1109/iccnea53019.2021.00038Copy DOI Icon

A Defect Detection Method Based on Improved Mask R-CNN for Wafer Maps

  • Sep 1, 2021
  • Yang Li +1 more
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Abstract

Pattern recognition of defects in wafer drawing is very important to determine the root cause of production defects, which can provide insights for the production improvement of wafer plants. In wafer manufacturing process, there will be mixed defects, detection of mixed defects is much more complex. Deep learning method has become a good choice to solve the problem of complex pattern recognition. In this paper, an improved Mask R-CNN model for wafer defect map is proposed. The ability of small target recognition is improved by fusing residual network and feature pyramid network, and the target feature can be fully extracted in the shallow model, so that the efficiency of feature extraction is improved. Secondly, an improved non-maximum suppression (NMS) algorithm is added to solve the error detection problem caused by traditional algorithms. The experimental results show that the improved Mask R-CNN model is superior to the conventional model, and has better recognition effect for small targets and shallow models. Secondly, the improved NMS algorithm is added to improve the detection precision.

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