High-Performance Thermal Management System and Thermal Prediction Model of High-Power LEDs Based on Spray Cooling
The light-emitting diodes (LEDs) are used widely around the world which have long life and are eco-friendly.In the past few decades, LEDs has made major breakthroughs in materials, packaging, and design.LEDs are developing in the direction of miniaturization and integration to meet the different occasions.At the same time, the heating problem of LEDs has become increasingly prominent.The heating power of high-power LEDs accounts for 60%-70% of the input electrical power due to the nonradiative recombination with the multiple quantum well layer and the light confinement within the LEDs packaging, which will cause sharply temperature rising of LEDs [1][2].High temperature will cause luminous flux degradation, wavelength drift, lifetime reduction, and even irreversible damage to the LEDs.Therefore, thermal management and thermal prediction for high-power LEDs are very important which ensure the stable operation of LEDs.At present, the cooling of LEDs is achieved by forced air cooling and liquid cooling.However, forced air cooling is usually bulky and noisy, and the low heat dissipation efficiency of forced air convection limits its application.Therefore, high-performance liquidcoolant-based thermal management technology is a competitive choice for LEDs due to its high heat dissipation efficiency.Spray cooling is a promising liquid-coolant-based thermal management technology for high-heat-flux electronic devices [3][4].It has the advantages of high critical heat flux (CHF), uniform surface temperature distribution, low surface overheating, and less working fluid demand.In the past, a large number of researchers conducted experiments and simulations on it.Although many of studies have shown that spray cooling is an effective way to dissipate heat from electronic devices with high heat flux, there are relatively few researches on spray cooling for LEDs, especially for high-power LEDs [5-6], which are not enough to provide guide for designing and application.In this work, a spray cooling system is proposed and it is used to verify the feasibility, advancement, and effectiveness of spray cooling on high-power LEDs of which the nominal power is 100 W. At the same time, in order to accurately explore the temperature distribution of LEDs, a model predictive inverse method is proposed and carried out.The results show that as the flow rate increases, the LEDs backside substrate temperature and target surface temperature will decrease, and the average heat transfer coefficient of the target surface will increase.The maximum heat transfer coefficient is as high as 26400 W/m 2 K.The Sauter mean diameter is one of the most important parameters of spray cooling.In this work, it is found that under the condition of high pressure drop and high flow rate, the Sauter mean diameter is smaller, which will enhance heat dissipation.At the same time, it is also discovered that as long as the proper thermal management is carried out, the LEDs can work normally when it exceeds 2.5 times of the nominal power.Three-dimensional simulation effectively supplements the experimental results, confirming that the closer to the junction point, the more uneven the temperature distribution.And spray cooling can keep the temperature of the LEDs chip below the temperature of destruction.Moreover, the prediction algorithm enables efficient estimation of the future temperature field of LEDs and early measures to prevent it from damage.According to the research results, spray cooling has been proven as an effective method for the thermal management of highpower LEDs.The design of the spray cooling system and prediction model may aid in solving the dilemma of overheating electronics.
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