The use of nanoparticles in semiconductor industrial applications has increased significantly due to the continuously decreasing linewidth. When used in a Chemical Mechanical Polishing/Planarization (CMP) process, the particle size distribution (PSD) of the “working” particles in CMP slurries strongly influences the efficacy of the planarization process. The techniques presently used to determine the PSD typically only measure relative particle concentrations and often presume the shape of the distribution. A new approach uniquely combining proven techniques used for counting and sizing aerosol PSDs has been developed to measure both particle size and number concentration in highly concentrated liquid suspensions. To utilize high-precision, aerosol-based measurement methods, these colloidal samples must first be aerosolized. Several established techniques have been employed to aerosolize colloidal particles; however, these methods are sensitive to sample purity, require extensive method development, or are unstable over long periods for monitoring size distributions of CMP slurries. This work presents a new method for analyzing nanoparticle size distributions for particle within the size range of 5 to 500 nm that couples a newly developed colloidal nanoparticle aerosolization device to an aerosol size classifying instrumentation based on electrical mobility characterization [1], along with particle data from a number of production slurries using this method.