A novel time-domain in-memory computing unit using STT-MRAM

Due to the memory wall in conventional Von-Neumann computer architectures, the limited bandwidth between processors and memories has become one of the most critical bottlenecks to improve system performance. With the emerging of non-volatile memories, the computing-in-memory (CIM) paradigm has regained interest to tackle the issue at the architecture level. CIM can effectively alleviate the stress on the limitted bandwidth by performing logic operations within memories. However, CIMs are not yet studied carefully at the circuit level, and even its reliability and performance. In this paper, we proposed a CIM implementation: dual reference (DualRef) scheme at the circuit level within STT-MRAM (Spin Transfer Torque Magnetic Random Access Memory) array. Simulations were carried out to verify the functionality and assess the reliability and performance of DualRef scheme in terms of operation error rate, sensing margin, operation delay and dynamic energy consumption. Simulation results validate DualRef scheme and reveal that it is reliable to perform bitwise logic opertions within STT-MRAM while the TMR (Tunnel Magnetoresistance Ratio) varying between 100% and 300% and supply voltage Vdd varying from 0.9V to 1.2V. This work provides a robust circuitry scheme and design space to effectively implement CIM in STT-MRAM.

Spin transfer torque magnetic random access memory (STT-MRAM) is an emerging memory technology which exhibits nonvolatility, high density, high endurance, and nano-second read and write times. These characteristics make STT-MRAM suitable for last-level cache and other embedded applications. The STT-MRAM bit-cell consists of a magnetic tunnel junction (MTJ) which is composed of two ferromagnetic layers (free and fixed layers) and one insulating layer in between. As STT-MRAM arrays become denser to meet cost and requirements of high performance computing, the distance between adjacent MTJ bits reduces. This aggravates the magnetic coupling from free and fixed layer of one MTJ bit to its neighbors. Even though magnetic coupling is expected to become stronger as MTJ scales down, its impacts on static and dynamic properties on MTJ is relatively unexplored. In this paper, we present a model of the magnetic field coupling in high-density MTJ arrays for three different types of MTJ stacks and evaluate the effect of magnetic field induced coupling on static and dynamic properties. Lastly, we show how process induced variations in MTJ characteristics affect the magnitude of magnetic coupling and their effect on the electrical characteristics of the STT-RAM arrays.

Spin transfer torque magnetic random access memory (STT-MRAM) is a promising candidate for next generation memory as it is non-volatile, fast, and has unlimited endurance. Another important aspect of STT-MRAM is that its core component, the nanoscale magnetic tunneling junction (MTJ), is thought to be radiation hard, making it attractive for space and nuclear technology applications. However, studies on the effects of ionizing radiation on the STT-MRAM writing process are lacking for MTJs with perpendicular magnetic anisotropy (pMTJs) required for scalable applications. Particularly, the question of the impact of extreme total ionizing dose on perpendicular magnetic anisotropy, which plays a crucial role on thermal stability and critical writing current, remains open. Here we report measurements of the impact of high doses of gamma and neutron radiation on nanoscale pMTJs used in STT-MRAM. We characterize the tunneling magnetoresistance, the magnetic field switching, and the current-induced switching before and after irradiation. Our results demonstrate that all these key properties of nanoscale MTJs relevant to STT-MRAM applications are robust against ionizing radiation. Additionally, we perform experiments on thermally driven stochastic switching in the gamma ray environment. These results indicate that nanoscale MTJs are promising building blocks for radiation-hard non-von Neumann computing.

The read reliability of spin-transfer torque magnetic random access memory (STT-MRAM) is greatly hindered by a low sensing margin as a result of a small tunneling magneto-resistance ratio (TMR). Although the new generation of perpendicular anisotropy spin-orbit torque (SOT)-MRAM offers faster access speed and longer lifetime than STT-MRAM, its read performance is not improved or even deteriorated because of the additional resistance of SOT channel in the read path. In this letter, we propose two novel cell structures of SOT-MRAM, which consist of one/two transistors, two diodes, and two magnetic tunnel junctions (1T2D2MTJ/2T2D2MTJ) on a shared U-shaped anti-ferromagnet layer, enabling a self-referencing scheme. Thanks to the bent current channel, the opposite direction of the SOT current below the free layers can one-step switch different data states in compatibility with the existing fabrication process of SOT-MRAM. Combined with the 28 nm tech node and Verilog-A MTJ compact model, the simulation results show that our proposed MRAM cell significantly improves sensing margin and bit error rate over the conventional 2T1M cell, which is expected to become a high read performance solution.

The single event upset hardened design of spin transfer torque magnetic random access memory read circuits at 40 nm technology

The switching current density in a bit of spin transfer torque magnetic random access memory (STT-MRAM) has to be <;1 MA/cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> for realistic application. The STT-MRAM using CoFeB magnetic tunnel junctions (MTJs) with perpendicular anisotropy are possible to match this target. In this paper, the switching properties in this system are investigated by a micromagnetic model. To simulate the perpendicular and in-plane hysteresis loops correctly, inhomogeneity of the perpendicular interfacial anisotropy constant K is introduced to the free layer of the MTJ. The calculated resistance versus applied current density curves of the bits are highly asymmetric, which agrees with experiment. The critical switching currents have dispersion due to the inhomogeneity of K. In addition, the simulation confirms the nucleation-type reversal process, and the reversal time decreases with increasing applied current.

The Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) has been identified, by the International Technology Roadmap for Semiconductors (ITRS), as one of the most promising emerging technology. Different works handled the retention and reliability of STT-MRAM. However, to the best of our knowledge, the impact of a pulsed laser beam on STT-MRAM reliability and security has not been investigated so far as proposed in this paper. Since STT-MRAM are Back-end Of Line devices, we exposed the bit cells from the front-side to a 1064 nm wavelength laser pulse. The devices are electrically characterized (switching conditions between the two logical states) before and after the laser irradiation. The main result of this study is the demonstration of a resistance switching from Anti-Parallel (AP) to Parallel (P) state after the laser irradiation. That is how data integrity was altered by this irradiation, flipping the bit stored in this memory.

Spin transfer torque magnetic random access memory (STT-MRAM) is one of the most promising new non-volatile memory technologies. Recently, STT-MRAM has become popular as a DRAM alternative in main memories particularly for tablets and palmtop computers in part due to its non-volatile properties and potential for improved device scalability. However, STT-MRAM is well known for its asymmetric access properties and considerable attention has been applied to the device, circuit, and architecture designs to mitigate its write energy concerns. In this work, we propose a new method to reduce the write energy consumption using a combination of pulse width scaling and error correction coding schemes for STT-MRAM main memories. The introduced methodology works by dynamically adjusting the pulse width based on the compressibility of the written data. We evaluate the efficiency of the proposed method on Android applications. Experimental results show an average improvement of more than 10% in the write energy consumption, in addition to the 46% reduction achieved by compression.

Because tetragonal structured MnGa alloy has intrinsic (not interface induced) giant perpendicular magnetic anisotropy (PMA), ultra-low damping constant and high spin polarization, it is predicted to be a kind of suitable magnetic electrode candidate in the perpendicular magnetic tunnel junction (p-MTJ) for high density spin transfer torque magnetic random access memory (STT-MRAM) applications. However, p-MTJs with both bottom and top MnGa electrodes have not been achieved yet, since high quality perpendicular magnetic MnGa films can hardly be obtained on the MgO barrier due to large lattice mismatch and surface energy difference between them. Here, a MnGa-based fully p-MTJ with the structure of MnGa/Co2MnSi/MgO/Co2MnSi/MnGa is investigated. As a result, the multilayer is with high crystalline quality, and both the top and bottom MnGa electrodes show well PMA. Meanwhile, a distinct tunneling magnetoresistance (TMR) ratio of 65% at 10 K is achieved. Ultrathin Co2MnSi films are used to optimize the interface quality between MnGa and MgO barrier. A strong antiferromagnetic coupling in MnGa/Co2MnSi bilayer is confirmed with the interfacial exchange coupling constant of −5erg/cm2. This work proposes a novel p-MTJ structure for the future STT-MRAM progress.

This paper presents Cryo-SIMPLY, a reliable smart material implication (SIMPLY) operating at cryogenic conditions (77 K). The assessment considers SIMPLY schemes based on spin-transfer torque magnetic random access memory (STT-MRAM) technology with single-barrier magnetic tunnel junction (SMTJ) and double-barrier magnetic tunnel junction (DMTJ). Our study relies on a temperature-aware macrospin-based Verilog-A compact model for MTJ devices and a 65 nm commercial process design kit (PDK) calibrated down to 77 K under silicon measurements. The DMTJ-based SIMPLY demonstrates a significant improvement in read margin at 77 K, overcoming the conventional SIMPLY scheme at room temperature (300 K) by approximately 2.3 X. When implementing logic operations with the SIMPLY scheme operating at 77 K, the DMTJ-based scheme assures energy savings of about 69%, as compared to its SMTJ-based counterpart operating at 77 K. Overall, our results prove that the SIMPLY scheme at cryogenic conditions is a promising solution for reliable and energy-efficient logic-in-memory (LIM) architectures.

Due to the leakage power of CMOS-based memory, Nonvolatile magnetic memory is considered a strong candidate to replace the CMOS-based memory. Spin transfer torque magnetic random access memory (STT-MRAM) is one of the most promising candidates, but it still has many shortcomings related to the write operation. Compared to STT-MRAM, spin orbit torque magnetic random access memory (SOT-MRAM) is the next generation of nonvolatile magnetic memory because of its relatively good performance and low power. Although SOT-MRAM has various advantages over STT-MRAM, a significant reduction in write power is required to meet the power level of CMOS-based memory. In this paper, we present a low power SOT-MRAM cell configuration using the dual write operation. By writing on two cells simultaneously, write energy can be reduced depending on data patterns. Compared to the conventional 2T-1MTJ SOT-MRAM, the proposed SOT-MRAM cell with the dual write scheme reduces the write energy by 26.3% on average.

A new class of spin-transfer torque magnetic random access memory (STT-MRAM) is discussed, in which writing is achieved using thermally initiated magnonic current pulses as an alternative to conventional electric current pulses. The magnonic pulses are used to destabilize the magnetic free layer from its initial direction, and are followed immediately by a bipolar electric current exerting conventional spin-transfer torque on the free layer. The combination of thermal and electric currents greatly reduces switching errors, and simultaneously reduces the electric switching current density by more than an order of magnitude as compared to conventional STT-MRAM. The energy efficiency of several possible electro-thermal circuit designs have been analyzed numerically. As compared to STT-MRAM with perpendicular magnetic anisotropy, magnonic STT-MRAM reduces the overall switching energy by almost 80%. Furthermore, the lower electric current density allows the use of thicker tunnel barriers, which should result in higher tunneling magneto-resistance and improved tunnel barrier reliability. The combination of lower power, improved reliability, higher integration density, and larger read margin make magnonic STT-MRAM a promising choice for future non-volatile storage.

Spin Transfer Torque Magnetic Random Access Memory (STT-MRAM) is an emerging non-volatile memory technology, as a leading candidate to replace conventional on-chip memories due to its various advantages such as high density, non-volatility, scalability, high endurance and CMOS compatibility. However, read and write operations in STT-MRAM are extremely vulnerable to manufacturing variations. In particular, the read operation is becoming more susceptible to failures since the read timing and read-disturb failures have conflicting requirements of read period. To overcome this issue, we propose a technique to reduce the read period without sacrificing the target reliability requirements. The reduced read period, in turn, results in improved read performance and reduced read-disturb rates. The results show that using this technique, the read period can be reduced by 50%, and the read-disturb probability by 51%.

Spin-transfer torque magnetic random access memory (STT-RAM) technology has emerged as a potential replacement of SRAM in cache design, especially for building large-scale and energy-efficient last level caches. Compared with single-level cell (SLC), multi-level cell (MLC) STT-RAM is expected to double cache capacity and increase system performance. However, the two-step read/write access schemes incur considerable energy consumption and performance degradation. In this paper, we propose two techniques using data compression to optimize MLC STT-RAM cache design. The first technique tries to compress a cache line and fit it into only the soft-bit region of the cells, so that reading or writing this cache line takes only one step which is fast and energy-efficient. We introduce a second technique to increase the cache capacity by enabling the left hard-bit region to store another compressed cache line, which can improve the system performance for memory intensive workloads. The experimental results show that, compared with a conventional MLC STT-RAM last level cache design, our overhead minimized technique reduces the dynamic energy consumption by 38.2% on average with the same system performance, and our capacity augmented technique boosts the system performance by 6.1% with 19.2% dynamic energy saving on average, across the evaluated multi-programmed benchmarks.

In the era of big data, massive data requires processing efficiently. However, the limited data bandwidth between the memory and the processor in conventional computer systems could not meet the requirement of data transferring. Computing in-memory has been considered an effective solution to address this problem. In this paper, based on the spin transfer torque-magnetic random access memory (STT-MRAM), a computing in-memory architecture with as few peripheral circuits as possible is proposed. This computing in-memory architecture gives the specific reference cell so that two rows in one array can be activated simultaneously to perform bitwise logic operations, such as OR/NOR and AND/NAND. In addition, with technology scaling down, STT-MRAM suffers from high sensitivity to process variation, which results in more device mismatch in a sense circuit. Additionally, the negative bias temperature instability (NBTI) seriously affects the life of PMOS transistors used in a sense circuit. In this paper, a high-reliability sense amplifier for computing in-memory with STT-MRAM is proposed. By using two self-enabled switching transistors, the proposed sense amplifier not only can decrease the NBTI effect on PMOS transistors but also can achieve a low sensing error rate. Using a CMOS 40[Formula: see text]nm design-kit and an accurate compact model of the STT magnetic tunnel junction (MTJ), mixed transient and statistical simulations have been present to demonstrate the functionality and performance of the proposed circuits.