Agent Grid Based Enterprise Application Integration

The traditional integration scheme has some disadvantages, such as complexity, high coupling degree of each system and large modification to the original system. The system integration platform is the combination of software and hardware, and it is the bridge and intermediary between various systems. Application system integration is realized through the integration platform, which forms a topology between the integration platform and each application system. Information interaction between systems is achieved through messaging. The medical supervision system should be set up. Development of a medical information management system includes integrated framework of medical security management system, dispute assessment system and protocol disposal system.

Moore's law of transistor scaling over the past few decades warrant a paradigm shift in packaging and integration methodologies. Silicon interconnect fabric (Si-IF) technology is a wafer-scale, fine pitch, package less, heterogeneous integration platform that enables high package density by supporting dielet assembly at fine spacing. In Si-IF technology, bare dielets are assembled on a prewired silicon wafer using thermal compression bonding (TCB) at a small inter-dielet spacing ( $\leqslant 100 \mu \mathrm{m}$ ) using fine pitch die-wafer interconnects ( $\leqslant 10 \mu \mathrm{m}$ ). This enables Si-IF technology to support high power systems on a wafer. A novel high-power delivery architecture enabling 40–60 kW power delivery to a 300 mm wafer is outlined. Prototype results for power delivery are presented.

Most of the service innovation in e‐government initiatives has been initially focused on making a digital version of an equivalent physical service, followed by creating new services through either adopting new business models or overhauling existing infrastructures. The former approach uses variants of e‐commerce business models to drive service innovation whereas the latter entails changes to the backend for driving system efficiency and integration, which later serve for reorganising and improving service provision. Each approach presents a different way of assembling services, infrastructures, people and business models. The ramifications of each assemblage to service innovation are less understood. This paper seeks to examine the intended and unintended consequences of these two contrasting approaches inductively and deductively. Our findings show that a frontend approach enables quick improvements and enacts a variety of structures, with each structure inscribing a set of new path‐dependent routines in the infrastructures. In the backend approach it took longer to introduce new services. Yet the services were of a higher quality and required less modification in the long run. Quantitative analyses confirmed these findings. We attributed the alignment advantage of backend approach to better interdepartmental collaboration organised around a technology platform for system and service integration, concentrating resources on a coherent rather than a diverse set of business models. This approach realigns practices and routines and technology internally, whereas the explorative, diverse use of business models in the frontend approach for service innovation is less sustainable.

This paper proposes a portable three-dimensional (3D) heterogeneous system integration platform with reusable sockets, namely, morphing package Cube (MorPACK Cube). The architecture of MorPACK Cube platform achieves the features of miniaturization and portability without a carrier board. Our proposed MorPACK Cube integrates accelerometer sensor, gyroscope sensor and electronic compasses sensor and then exhibits on Andriod platform through Bluetooth wireless communication. Furthermore, we develop an Mobile APP, namely SigView, to display and analysis the collected data from these sensors. The proposed MorPACK Cube is used for sensor applications to demonstrate the effectiveness, compared with the total area 434cm2 obtained by implementing MorPACK Cube platform with a carrier board, the results show that there are 91.14% area cost reduced by the MorPACK Cube platform without a carrier board. Besides, around 60% performance improvement of operation frequency can be benefited from the 3D-stacking technique.

Continual advances in modern technologies make it feasible to build intelligent independent living spaces for the elderly and disabled. In the past few years, various sensors and medical devices have been commercially available for home healthcare applications, but still there is a lack of effort on integrating heterogeneous commercial off-the-shelf (COTS) sensors from various vendors to collect data and provide more flexibility in product selection for customers. In order to address this issue, this paper presents a heterogeneous sensors integration platform for independent living spaces. The proposed platform, which is based on Apache Thrift, can accomplish the tasks of data collection, organization, and storage through cross-language services. A prototype system has been implemented and integrated into an independent living space monitoring system to validate the proposed approach.

The rapid advancement of the thin-film lithium niobate (LiNbO3) platform has established it as a premier choice for high-performance photonics integrated circuits. However, the scalability and cost-efficiency of this platform are hindered by the reliance on chip-level fabrication and integration for passive and active components, necessitating a robust wafer-level LiNbO3 heterogeneous integration platform. Despite its critical role in enabling ultrahigh-speed optical interconnects, as well as optical mmWave/THz sensing and communication, the realization of ultrahigh-speed photodiodes and optical coherent receivers on the LiNbO₃ platform remains an unresolved challenge. This is primarily due to the challenges associated with the large-scale integration of direct-bandgap materials. To address these challenges, we have developed a scalable, high-speed InP-LiNbO₃ wafer-level heterogeneous integration platform. This platform facilitates the fabrication of ultrahigh-speed photodiodes with a bandwidth of 140 GHz, capable of receiving high-quality 100-Gbaud pulse amplitude modulation (PAM4) signals. Moreover, we demonstrate a seven-channel, single-polarization I–Q coherent receiver chip with an aggregate receiving capacity of 3.584 Tbit s-1. This coherent receiver exhibits a balanced detection bandwidth of 60 GHz and a common mode rejection ratio (CMRR) exceeding 20 dB. It achieves receiving capacities of 600 Gbit s-1 λ-1 with a 100-Gbaud 64-QAM signal and 512 Gbit s-1 λ-1 with a 128-Gbaud 16-QAM signal. Furthermore, energy consumption as low as 9.6 fJ bit-1 and 13.5 fJ bit-1 is achieved for 200 Gbit s-1 and 400 Gbit s-1 capacities, respectively. Our work provides a viable pathway toward enabling Pbps hyperscale data center interconnects, as well as optical mmWave/THz sensing and communication.

Compared with simulation technology, the prominent feature of digital twin technology is its complex interaction ability with the external information, which enables the digital twin function of the physical objects through complex interaction. Therefore, a complete digital twin system is formed, and the digital twin model can truly and effectively play its role. To achieve this, it is necessary to establish data interfaces that effectively connect with external information, physical field calculations, the visual displays, etc., to realize the system integration of digital twin models and verify their engineering feasibility. This article analyzes the functional requirements of the system integration, designs its functional framework, constructs functional modules of physical hardware layer, twin model layer, and human-computer interaction layer, and realizes the integration of valve side bushing digital twin model system with data exchange capability, data transmission capability, and coordination between various functional modules. Among generated parameters, E-field strength inside 220kV reduced ratio bushing is controlled within 3kV/mm, and the composite insulator umbrella skirt is installed outside the core. Total length of the bushing is 2465mm, the length of the bushing tail is 810mm, and the length of the hollow composite insulator is 1250mm.

The European Union (EU) legislative framework related to air quality, together with national legislation and relevant declarations of the United Nations (UN), requires an integrated approach concerning air quality management (AQM), and accessibility of related information for the citizens. In the present paper, the main requirements of this legislative framework are discussed and main air quality management and information system characteristics are drawn. The use of information technologies is recommended for the construction of such systems. The World Wide Web (WWW) is considered a suitable platform for system development and integration and at the same time as a medium for communication and information dissemination.

Interoperability in today’s healthcare world is big challenge. Although a number of standards have been developed in this domain yet the realization is still a key challenge. Health Level 7 (HL7) is an information exchange standard which formulates specifications for interoperable communication. HL7 V3 uses Messaging Infrastructure (MI)for the communication but it cannot provide flexible communication environment. It is required to have end-to-end sessions and business scenarios from real healthcare environment. Service Oriented Architecture (SOA) provides a platform for system development and integration in order to achieve the main goal of interoperability along with flexibility. In HL7 V3, the communication between systems takes place using process artifacts (application roles, interactions, trigger events and information models). SOA based HL7 V3infrastructure consists of application roles as services that are responsible for the interaction between communicating entities. Our system provides services that have business perspectives in terms of capturing healthcare business workflows. The work in this paper is based on the HL7 V3specifications and also uses certain guidelines of Healthcare Service Specification Project (HSSP).

Over the past two decades, 3D techniques combined with heterogeneous integration, combining different functions and materials, have emerged as a key enabler for overcoming the physical and scaling limits of traditional 2D integration. These approaches are now expanding across multiple domains, including CMOS, memories, photonics, imagers, and RF systems, with the aim of delivering next-generation integrated systems for advanced computing (AI), analog/RF, and imaging applications. In this presentation, we will explore the fundamental techniques, recent advancements, and some challenges associated with achieving integration. Special emphasis will be placed on the role of hybrid bonding and sequential 3D integration schemes, as well as their implications for energy efficiency, device performance, and system-level innovations.3D integration has transitioned from a niche research area to a cornerstone technology in microelectronics, driven by its potential to address high density interconnect and traditional 2D scaling bottlenecks for several applications and enable heterogeneous integration at unprecedented scales. At the heart of this technological evolution are advanced schemes such as wafer thinning, Through-Silicon Vias (TSVs), hybrid bonding, and sequential 3D integration techniques. These techniques have been pivotal in shrinking the interconnect length, reducing latency, and enhancing data bandwidth in computing systems. In parallel, developments in wafer-to-wafer, die-to-wafer, and chiplet integration are enabling the seamless merging of diverse materials enabling functionalities such as logic, memory, photonics, and RF. Compact form factors are achieved enabling to boost performances of the most demanding applications such as Artificial Intelligence or Tb/s transceiver applications [1].Recent studies highlight significant progress in hybrid bonding technology, which achieves high-density interconnects at the submicron scale, thereby optimizing power delivery and thermal management in stacked devices [2]. Meanwhile, sequential 3D integration [3][4] where layers of transistors are fabricated sequentially on the same substrate, is emerging as a game-changing paradigm. It promises ultra-high-density integration with minimal parasitics, creating new opportunities for energy-efficient and high-performance systems. Several applications are foreseen including C-FETS, memories and imagers [5] .Photonic interconnects will enter in next generation 3D IC integration, addressing challenges in data bandwidth, power consumption and signal integrity and enabling photonic interposers for next generation of components for data centers and communication systems [7]. Similarly, RF [8] and analog domains [9] benefit from 3D stacking by improving front-end module integration with specific materials (III-V, HR, ...), leading to enhanced performance and higher frequencies.Despite these achievements, significant challenges remain. Thermal dissipation is a critical bottleneck [10] , particularly in densely 3D stacked architectures where hotspots can severely impact reliability and performance. Moreover, the mechanical stresses induced during bonding and processing can affect device yield and long-term stability. Our recent work in advanced thermal management and stress engineering underscores the need for interdisciplinary approaches to address these challenges. Solutions such as microfluidic cooling, novel materials for thermal interface layers and specific bonding technologies are being actively explored. Furthermore, while heterogeneous integration is currently feasible at the wafer scale—such as wafer-to-wafer hybrid bonding, which is already in mass production—expanding application fields will require advancements in die-to-wafer integration techniques.Looking ahead, the convergence of 3D integration with emerging paradigms such as neuromorphic computing, quantum technologies, multispectral and smart imagers, and advanced packaging promises to redefine system design at all levels. The synergy between 3D technologies and heterogeneous integration of advanced materials, such as 2D semiconductors, III-V, ferroelectric or oxide semiconductor [11] materials, further expands the horizon for innovation.In conclusion, 3D integration has proven to be a transformative force in microelectronics, offering pathways to overcome traditional limitations and unlock new performance dimensions. Intensive researches worldwide continues contribute to push the boundaries of what is possible, paving the way for smarter, more efficient, and highly integrated systems.

The development of Low-Density Fan-Out (LDFO), formerly Wafer Level Fan-Out (WLFO), platforms to encompass the requirements of potential new markets and applications such as the Internet of Things (IoT) is crucial to maintain LDFO as the leading Fan-Out technology. This drives the development of a new set of capabilities in the current standard LDFO process flow to break through the existing technology boundaries. One of the most widely discussed advantages of LDFO packaging is heterogeneous high-density system integration in a package. LDFO System in Package (LDFO SiP) integrates active dies, passive components and even already-packaged components using other packaging technologies. This heterogeneous integration is based on a wide range of different geometries and materials placed inside the LDFOSiP with high accuracy. Ultimately, heterogeneous integration will be fundamental to achieve new levels of miniaturization. However, multi-die solutions face several challenges such as bare-die availability, passives integration, antenna integration, low power budget, test complexity and reliability. Package research and development (R &D) must overcome all of these issues to build a product with high volume manufacturability. The wafer level SiP (WLSiP) technology required to enable the new features and processes needs to be ready for high volume manufacturing of new products at high yield and reasonable cost. This paper presents the approaches used to effectively enable LDFO SiPs (WLSiPs): 1. A pre-formed vias solution is employed to connect front to back side of the package, including development for high accuracy via bar placement. 2. A wafer front-side to back-side redistribution layer (RDL) alignment solution was developed. 3. Space requirement reduction between components to achieve the smallest possible package. 4. Miniaturized Bluetooth antenna integration in the RDL. 5. Creation of a stacking concept (vertical connections to create a modular system that enables easy addition of new features to the final product).Inside the package (excluding the area reserved for the antenna), components are densely packed: several sensors, power management components, radio communication and all required passives are incorporated into a single WLSiP. Connecting all these features to create a component that works by connecting only a single battery required implementing a double sided, multi-layer RDL, while maintaining the ability to create a 3D solution by stacking vertical connections for several other solutions. The result is an approach that easily adapts the system to a variety of customers' needs. The work done is part of the collaborative COMPETE2020-PT2020 funding program under “IoTiP-Internet of Thing in Package” project n°017763, Projetos de I &DT Empresas em CoPromoção. LDFO, LDFO SiP, Fan-Out WLP, WLSiP, SiP, Multi-Chip-Package, Antenna-in-Package, Package-on-Package, Through Mold Via, TMV®, TPV.

The intelligent revenue operations platform integrates artificial intelligence, natural language processing, and machine learning to transform fragmented business processes into cohesive, automated workflows. This platform addresses critical challenges in lead management, quote-to-cash processes, and compliance requirements by implementing autonomous company research, intelligent classification algorithms, and adaptive workflow automation. Upon identifying a new lead, the system performs comprehensive research across multiple sources, conducts sophisticated profile analysis, determines appropriate industry classifications, and evaluates transaction behaviors—all without manual intervention. The architecture extends through the entire revenue lifecycle, automating quoting, contract generation, order processing, and revenue recognition while maintaining regulatory compliance. Implementation experiences across SaaS and manufacturing industries demonstrate significant efficiency improvements, enhanced decision-making capabilities, and measurable financial benefits. The system's modular design and integration methodology enable adaptation to diverse organizational contexts while addressing data quality, system integration, and change management challenges

this paper analyzes the problems of heterogeneous databases in a distance education system. It provides a heterogeneous database integration model based on XML and design and develop a heterogeneous database integration platform based on this model. Thus, it provides a unified standard and effective tool for teaching resource description and management in distance education.

In this paper, the latest developments of high performance SiGe BiCMOS technologies with additional WLP technology modules are demonstrated. The combination of HBTs with fmax values beyond 700 GHz together with WLP technology modules such as interposer, Through-Silicon Vias (TSVs) and wafer bonding techniques are explained. Both silicon interposer substrates with embedded TSVs together with a novel Al-Al wafer bonding integration technique are realized to provide a high performance and low-cost FOWLP platform for 3D heterogeneous integration.

State-of-the-art silicon interposer technology of chip-on-wafer-on-substrate (CoWoS) containing the second-generation high bandwidth memory (HBM) has been applied for the first time in fabricating high-performance wafer-level system-in-package. An ultralarge Si interposer up to 1200mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> made by a two-mask stitching process is used to form the basis of the second-generation CoWoS (CoWoS-2) to accommodate chips of logic and memory and achieve the highest possible performance. Yield challenges associated with the high warpage of such a large heterogeneous system are resolved to achieve high package yield. Compared to alternative interposer integration approaches such as chip-on-substrate, CoWoS offers more competitive design rule which results in better power consumption, transmission loss, and eye diagram. CoWoS-2 has positioned itself as a flexible 3-D IC platform for logic-memory heterogeneous integration between logic system-on-chip and HBM for various high-performance computing applications.