Analysis of Coupling Between Two Bent Transmission Lines by a Circuit-Concept Approach

Analysis of field coupling and emissions from printed circuit boards (PCBs) is important for assessment of the immunity of the PCB to external radiation. Immunity of electronic systems is now tightly regulated in consumer markets. This paper presents a procedure for the analysis of susceptibility of PCBs. The procedure identifies a finite set of source and field points to increase the efficiency of the numerical testing. Reciprocity is used to decrease the number of external source locations that need to be used in the field coupling analysis through performing a radiation analysis. The numerical analysis of the PCB is performed using the Method of Moments (MoM). Numerical examples for the application of method are included. Further examples of the overall procedure will be presented.

The rapid development of information and communication technologies has driven the rapid growth of data traffic and the large requirement of high-speed optical transceiver modules. Usually, optical subassemblies through flexible printed circuit boards (PCBs) connect with the hard PCBs to compose as optical transceiver modules. Because of the impedance mismatch of connection between flexible PCB and hard PCB, the operation bandwidth of the module can be limited. In this paper, the design of connection between flexible PCB and hard PCB in optical subassembly modules will be investigated for increasing the operation speed of the module. First, the transmission bandwidth of flexible PCB is analyzed. High-frequency performances of three transmission line structures, micro-strip line, grounded coplanar waveguide, and top ground micro-strip line, are investigated in flexible PCB. High-frequency performances of flexible PCB with different bending types are also investigated. The flexible PCB has been verified to be suitable to use in 25 Gb/s applications. Next, the high-speed transmission performance is analyzed through the connection between flexible PCB and hard PCB, because the impedance mismatch usually occurs at the connection. The ground pads are added near the signal line of flexible PCB, and the ground pads are connected to the ground layer in PCB through ground vias. The anti-pad in hard PCB is added under the signal solder pad. The dip of S21 response can be eliminated by the optimized ground pad. The impedance mismatch can be reduced by the optimized anti-pad, the impedance increases from 40-Ω to 49-Ω at the connection between flexible PCB and hard PCB, and the transmission bandwidth can increase from 16.5 GHz to 23.5 GHz. TO-46 header is a common and low-cost packaging solution for DFB laser and photodiodes. The connection between flexible PCB and TO-46 header is also investigated. While the connection has a gap, the dip of frequency response will occur at lower frequency. While the connection is very close, the bandwidth can be larger than 25 GHz. The flexible PCB, hard PCB, and TO-46 header are combined together, and the 23 GHz transmission bandwidth can be obtained. The 25 Gb/s transmission eye diagram is also measured, and the eye height, rise time, fall time, and Q-factor are 268.14 mV, 13.78 ps, 13.56 ps, and 8.76, respectively. The combined flexible PCB, hard PCB, and TO-46 header are verified to be suitable to apply in 25 Gb/s optical subassembly modules, and will be able to be used in 100G Ethernet.

A new planar microwave sensor for fat-measuring of meat based on SRR and periodic EBG structures

In this paper, the stochastic electromagnetic field coupling to bent transmission lines above a conductive ground plane is investigated experimentally. A special focus lies on the radiation losses due to the bend. The measurements were performed in a reverberation chamber. Different bend angles of the transmission line were measured and the radiation losses were analyzed.

<div class="section abstract"><div class="htmlview paragraph">High currents flowing through various traces of a printed circuit boards (PCB) causes thermal run away and PCB warpage due to the occurrence of high heat density. The present study discusses on steady state thermal analysis performed in a PCB kept inside an enclosure. Thermal analysis allows PCB designer to quickly move and confirm the component’s placement by examining the temperature plots predicted on the PCB surface. A PCB particularly designed for automated manual transmission (AMT) application employed in Ashok Leyland electric vehicle (EV) trucks is used for this present study. The performed simulations are preliminary level and carried out with commercially available software Altair Simlab ElectroFlo 2022.3. Simlab is a PCB level EDA (Electronic Design Automation) software suite used for design and analysis, and thus helps in minimizing the development cycles. The power dissipation for each and every component and the component analysis power level plays a significant role in deciding the temperature at various components in the PCB. The temperature at various locations of the PCB and enclosure is predicted and compared with some benchmark values presently available and measured at the vehicle level. A good agreement is observed between both the predicted and measured values. Here, the objective is to detect these thermal issues at the initial design level itself, so as to improve reliability of the controller.</div></div>

Bulk current injection (BCI) test is adopted as an immunity testing method for automotive electronic equipment. In this letter, an analytical method for obtaining the terminal output of the transmission line excited by using the BCI probe is proposed. The test setup is analytically solved by using a circuit concept approach because it is considered to be a transmission line externally excited by an electromagnetic field. To confirm the validity of the proposed method, a single-ended transmission line loaded with the BCI probe is considered as an example. The comparison with the analytical solution and our experimental results shows a good agreement.

This paper deals with the radiation loss of bent transmission lines in order to determine the most optimal design for a bent line from the standpoint of radiation loss. We have used the method of moments (MoM) for a numerical analysis on the radiation for different structures of bent lines and we have found that the simplest right-angle bend is the best with the least radiation loss. This theoretical expectation was confirmed experimentally.

A new type of lowpass filter with an ultra‐wide stopband, sharp transition and compact size is proposed. To reduce the circuit size, a bended transmission line is adopted in the stepped impedance resonators. To achieve a sharp roll‐off, a pendulum‐shaped resonator is implemented in the filter. The transition band is from 1.30 to 1.45 GHz with −3 and −20 dB, respectively. The stopband with an attenuation level better than 20 dB is from 1.45 up to 23.4 GHz, hence an ultra‐wide stopband with 18th‐harmonic suppression is achieved. Furthermore, the proposed filter exhibits an extremely small size of 0.09λg × 0.11λg where λg is the guided wavelength at the cutoff frequency.

A symmetrical compact microstrip lowpass filter (LPF) with ultra‐wide rejection band and low voltage standing wave ratio (VSWR) using a novel structure of stepped impedance and butterfly‐shaped resonators is presented and fabricated. The LPF has a 3 dB cut‐off frequency at 1.513 GHz. The series structure of the butterfly‐shaped resonators result in a high roll‐off rate of 187.8 dB/GHz. By generating multiple transmission zeros, a wide stopband (with 35 dB rejection degree) is achieved. To reach a small circuit, the bended transmission line is properly utilised. Moreover, 171% relative stopband bandwidth and dimensions of 0.087 λ g × 0.157 λ g ( λ g is the guided wavelength at 1.513 GHz) are other specifications of this LPF. In addition, an acceptable match is obtained between the simulated and measured responses. In the end, the LPF achieves a high figure‐of‐merit of 82288.

The frequency at the peak of electromagnetic radiation from a PCB (Printed Circuit Board) as a result of ground bounce is considered predictable from the frequency characteristics of the input impedance between the power supply and ground layer (below called the PCB impedance). However, the relationship is largely unknown. In this paper, the electromagnetic radiation of the PCB and the frequency spectrum of the PCB impedance are analyzed by the FDTD (Finite‐Difference Time‐Domain) method and their relational mechanism is studied by comparison with the measured values. It is found that the peak of the electromagnetic radiation appears at the frequency where the PCB is a minimum if the PCB is excited by a voltage source with an internal resistance sufficiently smaller than the PCB impedance, and that this peak is shifted toward the frequency at which the PCB impedance becomes a maximum if the internal resistance is increased. The radiation power ratio derived from the resistive components (called the resonant resistances) at two frequencies where the PCB impedance is maximum and minimum (resonant frequencies) mostly agrees with the ratio of the squares of the radiated electric field. Hence, the radiation peak frequencies of the PCB are determined both by the internal resistance of the excitation source and the resonant resistance of the PCB impedance. © 2004 Wiley Periodicals, Inc. Electron Comm Jpn Pt 1, 87(11): 30–38, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/ecja.10209

The research object in the work is the printed circuit boards (PCB) Production technological process using the additive technology of photopolymer 3D printing. The existing problem is that the manufacturing process of single-sided and double-sided PCBs, simple in technology, from the third to the fifth accuracy class, requires the use of a large amount of consumables and technological equipment. In turn, this affects the cost of the product. The research subject is models and methods for manufacturing PCB using photopolymer 3D printing. In order to reduce the cost of materials: film or aerosol photoresist, as well as reduce the number of technological operations, applying photoresist and for the manufacture of PCBs stencils, it is proposed to use photopolymer 3D printing technologies for the manufacture of PCBs. The paper analyzes the costs of Plexiwire Resin Basic Orange Transparen photopolymer resin for the manufacture of single-sided PCBs and calculates the cost of the consumable (resin) compared to the costs of dry film photoresist. 60 % cost of consumables (photopolymer resin) compared to dry film photoresist for making single-sided PCBs. The work is aimed at determining the dependence of the geometric dimensions of the PСВs topology and the consumption of photopolymer resin on the technological parameters of photopolymer exposure. A regression correlation model of the dependence of resin consumption on exposure parameters has been developed and correlation coefficients have been calculated. It has been established that with an increase in the exposure time of the photopolymer resin, the consumption of the photopolymer resin increases and the deviation of the geometric dimensions of the PCBs topology increases, which in turn negatively affects the quality of the product. Therefore, using the obtained regression model, it is possible to calculate the influence of parameters on the PCB topology and reduce the deviation of conductor sizes and resin consumption.

<span>The rapid progress of technology has imposed significant challenges on Printed Circuit Boards (PCB) designers. Once of those challenges is to satisfy the electromagnetic compatibility (EMC) compliance requirements. For that reason, EMC compliance must be considered earlier at the design stage for time and cost savings. Conventionally, full wave simulation is employed to check whether the designed PCB meets EMC standards or not. However, this method is not a suitable option since it requires intensive computational time and thus increasing the unit cost. This paper describes novel analytical models for estimating the radiated emissions (RE) of PCB. These models can be used to help the circuit designer to modify their circuit based on the maximum allowable RE comparing to the relevant EMC-RE standard limit. Although there are many RE sources on PCB, this paper focuses on the significant source of RE on PCB; namely PCB-traces. The trace geometry, termination impedance, dielectric type, etc. can be specified based on the maximum allowable emissions. The proposed models were verified by comparing the results of the proposed models with both simulation and experimental results. Good agreements were obtained between the analytically computed results and simulation/measurement results with accuracy of ±3dB.</span>

Warpage of multi-layered printed circuit boards (PCB) during the reflow process is a serious problem which affects the reliability of solder ball connections between the PCB and the mounted semi-conductor packages in electronic devices. It is essential to predict the warpage of the PCB accurately; however, the complicated copper patterns in multi-layered PCBs render a full modeling analysis impossible due to the excessive computing time required. To overcome this problem, we have developed analytical equations of three Cu patterns (line, square, and grid) for the application of thermo-mechanical properties simply by equivalent modeling of Cu patterns. In the proposed equations, the effect of thermo-viscoelastic properties as well as the influence of surrounding layers such as woven glass fabric/BT (bismaleimide triazine), composite laminate (BT core), and photoimageable solder resist (PSR) were considered. To verify the developed equations, vibration tests based on the wave propagation approach were performed at various temperatures. Good agreement was observed between the equivalent model and the experimental results.

This paper discusses a new route optimization for inspecting printed circuit boards (PCBs). In inspections of PCBs, a number of PCBs arrayed on a plane are tested by a probe in some order or sequence. Since the length of an inspection route depends on the order or sequence that the probe visits and tests each of PCBs, the finding of best visiting order or sequence is quite important in order to reduce the PCB inspection time. Recently, due to the miniaturization of PCBs, the procedure of “alignment” has become necessary before the electrical test, which means that there is a precedence constraint between alignment and test. This paper models a PCB inspection route optimization problem with alignment operations as a class of pickup and delivery traveling salesman problem (PDTSP) which is a mixed 0–1 integer programming problem. An efficient heuristic algorithm is proposed to solve the problem with a practical computational time. The proposed algorithm is installed into real PCB inspection machines that have been widely used in the world. Cost reduction effects for PCB inspection factories are discussed.

One aspect of the electromagnetic compatibility (EMC) analysis of RF circuitry is the accurate modeling of the coupling between printed transmission lines. Correct modeling of this coupling is essential because unwanted noise voltages can be substantial and create adverse effects on sensitive components. Recently, the development of composite right-/left-handed transmission lines (CRLHTLs) has received considerable attention due to the unique propagation characteristics. Because of this increase in applications, CRLHTLs are being implemented in RF systems with other printed circuitry, such as microstrip transmission lines, in very close proximity. In many of these instances, the coupling may not be intentional. To study this interaction between CRLHTLs and other printed circuitry from an EMC point of view, this paper presents derived analytical expressions for computing the nearand far-end voltage coupling between right-handed (printed microstrip transmission lines) and CRLHTLs. More specifically, these expressions are used to determine the nearand far-end voltages weakly coupled to the CRLHTL when the conventional microstrip right-handed transmission line is driven with a source and terminated with a load. These expressions are then used to illustrate how the induced voltages on the CRLHTL can be reduced by the capacitance and inductance values that support left-handed propagation. This can be a useful alternative to conventional shielding. Furthermore, design guidelines and tradeoffs are presented on the layout of CRLHTL near other printed transmission lines. The expressions derived in this paper are validated with simulations and measurements.