Chapter 40 - Liquid Crystal Polymer

The relationship between the microstructure and corresponding mechanical properties developed during injection molding of blends containing a liquid crystalline polymer (LCP) as the minor component and an engineering polymer system has been studied. A wholly aromatic copolyester LCP (Vectra A950) was melt blended at different compositions with a thermoplastic matrix consisting of a commercial compatibilized blend of polyamide-6 and ABS (Triax 1180). These blends were prepared under two different sets of injection molding conditions. In the first case, a higher melt temperature, higher barrel temperature, lower injection pressure, lower mold temperature, and shorter residence time in the mold were used during injection molding, as compared with the second case. The mechanical properties of the blends were superior to those of the base polymer. In the second case, the resulting injection-molded specimens had a distinct skin–core morphology where elongated fibrils of LCP constituted the skin layer. The mechanical properties of the blends processed under the second set of processing conditions were superior to those of the first, though the trends in both cases were the same. To study the effects of process variables the 15% LCP blend and the second set of processing conditions were taken as the base. Samples were injection-molded by varying one parameter at a time. It was seen that the properties of the blend were increased by maintaining a lower barrel temperature, greater injection pressure, lower injection speed, higher mold temperature, and a greater residence time in the heated mold. Thus it was found that the processing conditions played a vital role in determining the mechanical properties and morphology of the polyblends. © 1996 John Wiley & Sons, Inc.

New cladding process has been developed by means of a Surface Activated Bonding (SAB) technique. In this process, Surfaces of materials to be bonded are immediately cleaned, activated by Ar ion sputter etching, and rolled with low distortion at room temperature in vacuum [1]. It is found that this process is available not only for cladding metals but also for laminating polymer film on metal without any adhesives. We have already reported copper (Cu) clad laminating (CCL) materials using Liquid Crystal Polymer (LCP) and showed its possibility by means of the SAB [2-5]. Interface of the LCP/Cu produced by the SAB was flat and smooth when comparing to that by conventional method. Therefore, the laminated material showed high electric property and excellent etching property [4,5]. In this study, it was investigated that the transition of chemical bonding state around interface between Cu foil and LCP film after heat treatment. It has been already reported that interface of Cu side was oxidized by heat treatment [2]. The XPS analysis showed that the ratio of C=O bonding on the LCP film side also interface increased with an increase in heat treatment temperature. So it was revealed that the heat treatment at high temperatures oxidize not only the Cu interface formed by Cu foil and sputtered Cu, hut also the LCP film side interface. We also have reported that Cu sputtering on the LCP film before laminating improved bonding strength [4,5]. However in heat-resistant test, the bonding strength significantly decreased because of oxidization around the interface and of softening of Cu foil due to re-crystallization. To improve the heat resistance, we used Cu-O.O2%Zr alloy foil having high re-crystallization temperature and sputtered Cu-Ni alloy or Ni-Cr alloy on LCP Tim instead of Cu sputtering. The improved materials also showed high frequency property and good etching property.

ABSTRACTWe have developed flexible, polymer-based electrodes for potential medical applications including neural recording and stimulation. Using various combinations of liquid crystal polymer (LCP) substrates, implantable grade silicone and polyimide, we have developed and tested several prototype multi-layer polymer electrodes. We report here on two specific electrodes. In the first case, a multilayer electrode consisting of high-melt temperature liquid crystal polymer (LCP) material with patterned electrodes of sputter deposited and plated gold, laminated together with a lower-melt temperature LCP was produced. Iridium oxide was deposited on the exposed electrode sites to facilitate effective charge transfer for neural stimulation. The electrode was designed for acute implantation in a cat cochlea and contained 12 contacts, with a pitch of 200 microns. The small contact spacing allowed testing of electric field focusing techniques both in vitro and in vivo. We subjected the electrodes to electrical and mechanical tests to assess potential suitability as a long-term biomedical implant. Chronic electrical leakage testing indicated higher than desired ionic permeability of the low and high temperature LCP interface. In a second case we produced a mock circuit using high-melt LCP and medical grade low durometer silicone in place of the low-melt LCP as the interlayer adhesive. Mechanical and electrical testing of the hybrid design indicated the potential to fabricate cochlear electrodes containing up to 72 contacts with a footprint and mechanical performance similar or better than current commercially available cochlear implant arrays (containing up to 24 elements). Multi-layer polymer electrode technology offers the opportunity to create new electrodes with higher numbers of channels, offering improved performance in neural stimulation applications including cochlear implants, retinal arrays, deep brain stimulators and paraplegic remobilization devices.

A novel approach is presented to 3D print vacuum–tight polymer components using liquid crystal polymers (LCPs). Vacuum–tight components are essential for gas storage and passive heat transfer, but traditional polymer 3D printing methods often suffer from poor interfaces between layers and high free volume, compromising vacuum integrity. By harnessing the unique properties of LCPs, including low free volume and low melt viscosity, highly ordered domains are achieved through nematic alignment of polymer chains. Critical gas–barrier properties are demonstrated, even in thin, single–print line–walled samples ranging from 0.8 to 1.6 mm. A 200 mm evacuated thermosiphon is successfully printed, which exhibits a thermal resistance of up to 2.18 K/W and an effective thermal conductivity of up to 28 W/mK at 60 °C. These values represent a significant increase compared to the base LCP material. Furthermore, the geometric freedom, enabled by 3D printing through the fabrication of complex–shaped thermosiphons, is showcased. The authors study highlights the potential of LCPs as high–performance materials for 3D printing vacuum–tight components with intricate geometries, opening new avenues for functional design. An application of integrating 3D printed thermosiphons as selective heat transfer components in building envelopes is presented, contributing to greenhouse gas emissions mitigation in the construction sector.

Power electronic systems have become a key component in the efficient generation, distribution, storage, and use of energy. This increasingly places power electronic systems in harsh environments under elevated stress conditions where, in many cases, their reliable operation is now mission critical. The semiconductor material conventionally used, silicon, possesses limited capability for high temperature applications due to its small bandgap. Power electronic components based on wide bandgap (WBG) semiconductors, such as SiC and GaN, can be operated reliably at higher temperatures. Furthermore, WBG devices have higher breakdown voltages and switching frequencies, rendering them more ideal switches and rectifiers for highefficiency as well as low-volume and low-weight systems. Yet, new packaging concepts are required to make use of the high temperature capability of power electronic systems based on WBG semiconductor devices. In this paper, a summary of the progress in the development and commercialization of wide bandgap power components and power electronic systems is given. The properties of SiC and GaN components are compared to those based on silicon. The shortcomings of conventional power electronic packaging technologies are analyzed, and alternatives introduced and compared. An overview of research is given on Transient Liquid Phase Sintering (TLPS), a promising interconnect technology for the manufacturing of WBG and high temperature power electronic systems. TLPS is a liquid-assisted sintering process during which a low melting temperature constituent melts, surrounds, and diffuses in a high melting temperature constituent. Intermetallic compounds with high melting temperatures are formed by liquid-solid diffusion. Interconnect systems can be processed at low temperatures but are capable of operating at the high melting temperatures of the intermetallic compound. Different process approaches are contrasted and material systems compared. Latest results of research on paste-based low temperature TLPS are presented. The pastes assessed are based on the Cu-Sn and Ni-Sn material systems. It is shown that joints formed by TLPS remain strong up to 600°C and exhibit softening temperatures far higher than conventional interconnect technologies. They show minimum creep and possess very limited voiding. The process does not require an inert or reducing atmosphere or vacuum and is compatible with standard reflow soldering equipment. It shows good wettability to common metallizations such as Cu, Ni, Ag, and ENIG. This attach technology shows the potential to enable reliable operation of wide bandgap power electronic systems under high stress conditions.

Carbon fiber reinforced polyether ether ketone (PEEK/CF) composites feature diverse advantages and have been applied in various fields. However, the high melt viscosity of PEEK leads to their poor processing performance and affects their practical applications. Here a liquid crystal polymer (LCP) was introduced into a PEEK/CF system as a new strategy to address the aforementioned issues. Bearing aromatic rings on the main chains, LCP can strongly interact with PEEK by pi–pi interaction, which alters the crystallization behaviour and facilitates processing of PEEK/CF, eventually improving its mechanical performance. As a result, a high crystallinity (37.37%), a decreased equilibrium torque (8.902 Nm), and a high tensile strength (230.97 MPa) are realized with 5 wt% LCP. The current approach offers a new solution to simultaneously promote processing and mechanical performance of PEEK/CF and other polymer-based composites.

Improvement of fly ash fusion characteristics by adding metallurgical slag at high temperature for production of continuous fiber

The pre-experiment of the present study revealed that polyurethane (PU) synthesized using poly (hexamethylene carbonate) glycol (PHC) has high melt viscosity and is difficult to process. Therefore, poly (trimethylene carbonate) glycol (PTC) was employed to synthesize a PU product with low melt viscosity. First, four types of thermoplastic polyurethane (TPU) were formed through one-step solvent-free synthesis. TPU is presented in the format “TPU-X-Y,” with X representing the polyol (PTC or PHC, around 1000 molecular weight) and Y the chain extender (1,3-propane diol [PDO] or 1,4-butane diol [BDO]) used. The TPU was synthesized using a fixed molar ratio of (isocyanate):(polyol):(chain extender) = 2:1:1 and compared. The results indicated that chain entanglement often occurred among the long carbon chains of PHC. The synthesized TPU employed a property of PTC, namely converting polarity into reverse polarity in high temperatures, to resolve the high melt viscosity of TPU of the PHC series, which causes processing difficulties. The synthesized TPU-PTC-PDO exhibited favorable molecular arrangements. Given its polarity, TPU-PTC-PDO has outstanding tensile properties (strength at break: 41.10 ± 10.78 MPa; 100% modulus = 6.73 ± 0.12 MPa), making processing at lower temperatures (180 or 190 °C) feasible. With the inclusion of PTC, the synthesized polycarbonate TPU exhibits the advantages of polycarbonate and is suitable for a wide range of applications.

In this paper, we report a novel approach to fabricate a low cost, large area and flexible mould and its applications in large area roller embossing. A liquid crystal polymer (LCP) film, which had a high glass transition temperature of 280°C, was clad with copper foils on both sides, was used as a starting material for mould fabrication. The LCP film and the copper foils were 50 and 36 μm thick, respectively. The LCP-Cu flexible mould was obtained through photolithographic patterning and wet etching of the copper foil on top surface of the LCP film. Using this proposed method, a polymer-metal hybrid flexible mould with an area of 150 mm × 150 mm was fabricated. The fabricated mould has a minimum feature size of 25 μm, and has been successfully used to demonstrate large area micro roller embossing. Micro channels, micro dots and micro mixers were embossed on polymeric as well as ceramic green substrates.

The dynamic viscoelastic properties of liquid crystalline polymer (LCP) and polyethylene terephthalate (PET) blends were studied at two different temperatures: 265°C at which LCP was in solid state and 285°C at which LCP was in molten state. The PET was in molten state at both the temperatures. The storage modulus, G’, loss modulus, G’’, dynamic viscosity, h’, of blends with different compositions were evaluated and compared. The morphology of these samples was studied using scanning electron microscope, which exhibited composition dependency. A maxima was observed in the viscosity versus composition plot corresponding to 90/10 LCP/PET blend at 285°C. The G’ versus G’’ plots demonstrated the composition dependency of LCP/PET blends.

Properties of a blend of poly(phenylene ether) with a liquid-crystalline polymer

A new liquid crystalline polymer based processing aid and its effects on micro-molding process

A new means of obtaining fine Si particles is through the use of a melt thermal treatment (MTT), where the mixing of low and high temperature alloy melts produces a fine Si structure. Modification is achieved by nuclei resulting from the degeneration of large atom clusters and some refractory solids in the low temperature melt when it is heated by the high temperature melt. This is a relatively recent technique which demonstrates promise as an alternative to Sr-modification, as it requires no element addition, thus reducing the risk of increased porosity normally associated with the addition of strontium to the melt. The use of melt superheat is also found to produce refinement of the eutectic Si structure. In this case, the high melt temperature assists in the degeneration of atom clusters, providing more nuclei for α-Al dendrite formation, and a resulting refinement of the microstructure. KeywordsMelt Thermal Treatment; Melt Superheat; Sr Modification Eutectic Si Particle Characteristics

The injection moulding of polymeric materials is an important and complicated process, involving non-isothermal, time-dependent flows at very high pressures, shear rates, temperature and shear rate gradients. In glass-fibre reinforced thermoplastics (FRTPs) and liquid crystalline polymers (LCPs) (and to a lesser extent in semi-crystalline and amorphous polymers), flow field induces orientation of the fluid microstructure. The morphology and orientation associated with the exceptional physical properties of these materials are often the direct result of the flow history during processing.

The miscibility in the melt and solid state of blends made of poly(p-phenylene sulphide) (PPS) with a liquid crystalline polymer (LCP) from DuPont was studied by polarized light optical microscopy (PLOM) and dynamic thermal mechanical analysis. Both techniques showed that the PPS and the LCP are immiscible in both states, and that the critical concentration for the formation of fibrils C*, in this particular system, was located between 20 and 25 wt % LCP. The resultant blend morphology was studied by PLOM and scanning electron microscopy (SEM). It was observed that when LCP fibrils are formed in the PPS matrix, the PPS macromolecules will crystallize around the LCP fibrils by forming columnar layers called transcrystallites. These transcrystallites are the result of the LCP acting as a nucleating agent for the PPS, promoting heterogeneous nucleation. © 1996 John Wiley & Sons, Inc.