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  • https://doi.org/10.31399/asm.cp.istfa2025p0082Copy DOI Icon

Effective Failure Analysis Approach in Uncovering Circuit Level Continuity Defects

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Abstract

Abstract Uncovering circuit level high resistance to open circuit defect sites in integrated circuits require an extensive failure analysis approach. The electrical attributes of having low currents during electrical verification and high resistance to open I/V curve response during curve trace testing contribute to the complexity of the analysis. In most cases, missing normal photon emissions, resistance changing site and thermal spots are encountered though these data are relevant during circuit analysis. To effectively pinpoint the defect site, the recommended approach are schematics and layout reviews coupled with probing analysis, either through resistance measurements and/or voltage mappings, then further fault isolation analysis, commonly the OBIRCH technique. Three (3) case studies focusing on missing and damaged Thin Film Resistors (TFR) are discussed in this technical paper to demonstrate the effectiveness of the recommended FA approach.

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