High-speed high-resolution CCD for aerial reconnaissance

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ABSTRACT A 111-Mega pixel, 92x92 mm 2 , full-frame CCD imager with 9x9 um 2 pixel size has been developed for use in scientific applications. Recent interest for ultra-high resolution imagers for electronic imaging OEM customers in various scientific markets, including biotechnology, microscopy, crystallography, astronomy, spectroscopy, and aerial reconnaissance markets has lead to the development of the STA1600A 111-Mega pixel monochromatic charge-coupled device. Innovative design techniques were utilized in the early development of this device, yielding low RMS noise and high MTF for readout speeds ranging from 1 Mpixel/s to 25 Mpixel/sec. This paper will provide detailed information on the design and performance capabilities of the STA1600A, as we ll as background information on the commercial uses of this device. Key Words : Charge Coupled Device (CCD), Charge Transfer Efficiency (CTE), RMS Noise, Quantum Efficiency (QE) 1. INTRODUCTION Charge Coupled Devices have been used for aerial reconnaissance since there invention, but due to fabrication constraints the utilization of these imagers has been limited. Airborne reconnaissance requires that the sensors are both large format (able to cover a large field of view) and contain extremely high resolution. Due to the aggressive requirements the CCD must meet several performance requirements: hi gh signal to noise ratio (SNR) or dynamic range, large pixel full well capacity, high spatial resolution, and high speed readout for increased frame rate. Semiconductor Technology Associates (STA) is an indepe ndent company, providing custom CCD imagers for over 7 years. STA is currently working to push technology into a new regime with the development of the ultrahigh resolution CCD (up to the maximum limit of a 150 mm wafer). Most aerial reconnaissance systems are using time delay integration (TDI) devices due to stability and high speed performance. Howeve r, the recently developed STA1600 has used advancements in silicon fabrication technology to create a full frame imager that meets the previously stated performance requirements, thus improving the capabilities of the current systems.