2- https://doi.org/10.1109/eptc.2003.1298766
Highly accelerated stress test (HAST) for low-cost flip chip on board technology
- Jan 1, 2003
- Jianzhong Wei +4 more
Abstract
Flip chip on board (FCOB) technology has been in widespread application. The reliability testing of solder-joints and the delamination between underfill and chip or substrate is still a critical issue for FCOB technology. In this paper, an accelerated environmental testing HAST-was used to rapidly evaluate the reliability of area array solder bumped packages on FR-4 PCBs. The test results intend to identify the effective reliability test criteria for low-cost FCOB technology.
- # Flip Chip On Board
- # Board Technology
- # Highly Accelerated Stress Test
- # FR-4 PCBs
- # Flip Chip
- # Reliability Of Solder
- # Reliability Test
- # Issue For Technology
- # Low-cost Technology
- # Area Array Solder
Similar Papers
