Incorporating multi-chip module packaging constraints into system design

A low-cost multichip module (MCM) package has been developed to house a 40 MHz digital signal processor static RAM chipset. A design and prototype effort was undertaken to design, procure, assemble, and test these modules. The design constraint was to merge a state-of-the-art high-density interconnect substrate with conventional chip assembly techniques while meeting a prespecified cost goal. The package concept is that of an MCM-L substrate with more than one chip, where the chips are connected to the substrate by means of conventional gold wire bonding and the part is overmolded. A mix of solder balls and peripheral leads is used to interface to the package. The mix of package connectorization approaches is used to increase the routing resources, decouple the signal and power/ground distribution, and provide good thermal coupling between the package and the next level board. Issues such as board layout, component design and fabrication, board assembly, and first-order cost models are discussed. >

Welcome to the DATE 08 Conference Proceedings. DATE combines the world's favourite electronic systems design conference and Europe's leading international exhibition for electronic design, automation and test, from system level hardware and software implementation right down to integrated circuit design. The DATE 08 event features a technical program with 77 sessions covering the latest developments in system design and embedded software, IC design/test methodologies and EDA tools, together with an exhibition with the leading EDA, silicon and IP providers showing their new products and services. Challenges that you all face or soon will face in your daily practice are the increasing design complexity of highly integrated systems, the introduction of reconfigurability and embedded software, and the control of power and variability in nanometer IC designs. All these issues will be addressed in this year's DATE event. For the 11th successive year DATE has prepared an exciting technical programme, with the help of the more than 400 members of the Technical Programme Committee, who dedicated their time to thoroughly review the 839 submissions in 37 topics, ranging from system level down to circuit design and covering all the most relevant application domains. The submissions are organised in 4 major areas: D --- Design Methods, Tools, Algorithms and Languages A --- Application Design T --- Test Methods, Tools and Innovative Experiences E --- Embedded Software After a thorough review and selection process (with an average of 5 reviews per paper), finally 198 regular papers were selected for presentation at the conference. Additionally, there are 46 Interactive Presentations that are organised in 5 IP sessions. Together with the invited special sessions (panels, embedded tutorials and hot topic sessions), this has resulted in a high-quality technical program. The technical program provides a wide but high-quality coverage of design, design automation and test topics, from the system level to the integrated circuit level. Compared with previous years, submissions in the Embedded Software track has increased by 50%, showing a clear trend towards a comprehensive system design focus with integrated hardware and software solutions. DATE has established itself firmly as a true Electronic System Design Conference. This year the conference is held in Germany, at the ICM in Munich and spans an entire working week from Monday March 10 to Friday March 14. On Monday, eleven pre-conference tutorials will be given. The three-full day tutorials cover topics of great interest for system design. The first tutorial deals with techniques to automatically realising embedded system from high-level functional models. The second tutorial addresses the different issues related to communication based design and architectures in automotive electronic systems. The third tutorial discusses several key concepts on system-level design and application mapping for wireless and multimedia MPSoC architectures. Furthermore, eight half-day tutorials are also given, which cover a wide spectrum of topics on specification, modelling, design and test. The main conference opens on Tuesday March 11, with two very interesting and complementary keynote speeches. Dominique Vernay, Chief Technical Officer for Thales, will talk about the challenges of embedded systems design, and Giovanni de Micheli, Professor at EPFL, will present his views on designing micro/nano systems for a safer and healthier tomorrow. On the same day, the Executive Track offers a series of business panels with executives discussing hot topics in design: the perils of 45 nanometers, the changes in EDA strategies from IDM, to fablite to fabless, and embedded systems level design strategies. DATE 08 will again offer two specific days related to special themes. On Wednesday March 12, a special full-day track is devoted to Automotive Electronics---Software and Architecture. This special-day track will focus on the challenges faced by the automotive supply chain with particular attention to system and software architecture design. It provides a comprehensive analysis of the evolution of automotive architectures, including ECUs, sensors and communication standards and discusses how new methods, tools and standards for interoperability and component-based design can deal with the increasing complexity of software systems and their need for reliability and guaranteed timely behaviour. In addition, it addresses to what degree existing standards, including AUTOSAR and FLEXRAY and model-based development, can support the development of safety and time-critical software. On Thursday March 13, a second special full-day track focuses on Dependable Embedded Systems. This track will address both conceptual and applied issues for design, analysis and validation of dependable embedded systems. The utility of embedded systems and services is based, in large part, on our depending on their sustained functionality in spite of the encountered operational or malicious disruptions. As the number of transient and also permanent disruptions (given the decreasing device geometries, higher device density, lower voltage latching, faster clocks etc) is expected to increase substantially, this will not only be a key issue for the hardware community but also the systems community in general. Solutions using a combination of hardware and software might be more effective than hardware-only or software-only solutions. This track focuses on both conceptual and applied issues for design, analysis and validation of dependable embedded systems. Besides these special tracks, the main conference is organized in six parallel tracks of sessions, three devoted to design methods, tools, algorithms and languages, one to application design, one to test methods, tools and innovative experiences, and finally one to embedded software. The presentations of the selected regular papers in these parallel tracks are complemented by nine Special Sessions and two Invited Industrial Sessions. The special sessions are organized in the form of panels, hot topics, and embedded tutorials. The topics to be covered include quantitative evaluation for embedded systems design, design and manufacturing at 32 and 22nm, software for wireless networked embedded systems, test challenges for low power devices, quantitative productivity measurement in IC design, and 3D Integration. The two invited industrial sessions deal with industrial system designs in transportation and information technologies. To emphasise that DATE is the major event for the designers, DATE 08 features also invited sessions where Europe's famous consumer industry presents their best designs and design practices. Friday March 14 is the day for the DATE workshops. DATE 08 offers workshops on current and emerging important issues in design, test, EDA and software to complement the regular conference. They provide a unique opportunity for the various research and design communities to spend a day discussing the latest and the best, sharing their experiences and visions. This year's workshop program includes eight workshop themes. Four workshops are related to software engineering, ranging from dependable software to modelling, analysis and development tools. Four other workshop themes cover a variety of topics such as the impact of process variations on design and test, the merging world of Nano-Electro-Mechanical Systems, new directions in high level synthesis, and heterogeneous reconfigurable hardware. Each workshop features presentations, invited or submitted, from highly distinguished academic and industrial researchers. Finally, throughout the conference days, DATE offers a comprehensive overview of commercial design and verification tools in its large exhibition hall. Exhibitors include EDA vendors, silicon, FPGA and IP providers showing their new products and services. In addition, there is an Exhibition Theatre featuring talks from engineering managers of the leading electronic manufacturers on first-hand design experiences of commercial EDA tools. New this year is the European projects village where different European and large government funded projects will be able to show their ongoing research and results to the design community and have the opportunity for internal meetings and discussions. The DATE week will be also an opportunity for students and universities to show their research work, through the PhD Forum on Monday evening and the University Booth where hardware and software demonstrations will be shown by different universities on a rotation schedule. The DATE 08 event's program will be particularly attractive to industrial designers, at analog, IC, FPGA and embedded system level, as well as software designers, to researchers and academics as well as to design managers, and an increasing attendance is expected. We therefore invite you to take full advantage of the many opportunities offered to you by DATE 08, to extend your knowledge and/or business in electronic system's design and to exploit the abundant networking possibilities offered to socialise with colleagues, including fringe meetings and a memorable social party with bands and dancing. We hope that you will all enjoy the DATE 08 Conference and Exhibition.

This article is concerned with how to represent in system design the kinds of features of work settings as reported by ethnographic studies of work. Various researchers and practitioners have found that ethnomehodological analyses of work settings can provide useful insights to the work processes and settings in which system design is interested. Previously at Lancaster University, we examined ways in whisk ethnography can be used in h e design process and how the results of ethnographic analyses can be presented in such a way as to be useful components of the design process. This article reflects an effort to approach these methodological issues from a different perspective. It examines how the lessons learned from ethnographic studies can be reflected in the design process itself and in particular how standardized design artifacts (e.g., models, documents) can express the type of information that ethnographic studies produce. The article focuses on how ethnographic analyses can influence the main representational artifact in systems design—the model of the system being developed. We examine how the Unified Modeling Language for object-oriented design can be used to express information about awareness in cooperative systems.

Technical system design processes are typically based on systems engineering vee models where designers move between functional and physical domains as they develop detailed designs of the overall system and its sub-systems and component parts. The movements between the functional and physical domains are informed by the core activities of any design process: synthesis, description, analysis and simulation, and decision-making. However, delivering socio-technical systems design mindsets, such as those needed to design multi-team systems, requires a new branch of systems science that integrates human behavior into system behavior. Design processes built on such a science would allow system designers to compare alternative solutions in terms of their anticipated performance and consider different options with respect to functions carried out by humans and machines. In this chapter we use a systems design process vee model and apply it to a case study that involves the design of a multi-team customer service system. Both the application of the vee model (i.e., the proposed design process) and the results of its application (i.e., the multi-team customer service system) can be regarded as socio-technical systems and are used to illustrate and elaborate on Clegg’s (Appl Ergon 31(5):463–477, 2000) socio-technical principles for system design. On this basis, we provide a practical framework for designing socio-technical systems and identify requirements for developing future methods and tools to support this process.

Purpose: This study aims to design the flow of the e-budgeting system to develop the village financial system, as well as to increase transparency and accountability of the web-based budget system and minimize the occurrence of corruption loopholes in the village. Method: The design system uses the waterfall method to analyze a model systematically. The model development step starts with the design of the system, database, menu structure, and interface. The design of the e-budget information system is built using PHP and MySQL programming in the form of web-based applications. Results: This study developed a web-based e-budgeting application using the waterfall method to manage village finances. The online system increases flexibility, allowing access from any device. It runs smoothly on computers, with all menus functioning as designed, and is expected to simplify village financial management. Limitations: The researchers’ capability in designing the system is not optimal, as the researchers do not have the basis of informatics engineering, so the results obtained and delivered are not too detailed. Contributions: This system is expected to be useful to facilitate the process of financial management at the village government level. Novelty: The novelty of this study lies in the design of a village e-budgeting system with features like automatic Standard Unit Price calculation, automated tax management, and tracking of village income (PADes) for transparency. This application aims to enhance financial management, ensuring transparency and accountability in the village.

Single and multigeneration Rankine cycles with aspects of thermodynamical modeling, energy and exergy analyses and optimization: A key review along with novel system description figures

Researchers from UC Berkeley, in collaboration with the Lawrence Berkeley National Lab, are engaged in developing an Infrastructure for Synthesis with Integrated Simulation (ISIS). The ISIS Project was a cooperative effort for “application-driven hardware design” that engages application scientists in the early parts of the hardware design process for future generation supercomputing systems. This project served to foster development of computing systems that are better tuned to the application requirements of demanding scientific applications and result in more cost-effective and efficient HPC system designs. In order to overcome long conventional design-cycle times, we leveraged reconfigurable devices to aid in the design of high-efficiency systems, including conventional multi- and many-core systems. The resulting system emulation/prototyping environment, in conjunction with the appropriate intermediate abstractions, provided both a convenient user programming experience and retained flexibility, and thus efficiency, of a reconfigurable platform. We initially targeted the Berkeley RAMP system (Research Accelerator for Multiple Processors) as that hardware emulation environment to facilitate and ultimately accelerate the iterative process of science-driven system design. Our goal was to develop and demonstrate a design methodology for domain-optimized computer system architectures. The tangible outcome is a methodology and tools for rapid prototyping and design-space exploration, leading to highly optimized and efficient HPC systems.

The integration of ‘‘real options’’ analysis will radically change the design of public and private systems. It will change the processes of system design, the way planners deal with uncertainly and risk. It will also change the outcomes, the kinds of elements designers build into the system as they develop it. This paper explains this coming evolution, and presents cases documenting the changes in attitude and the results already occurring. To think in terms of options alters the way one deals with uncertainty. Conventionally, good design minimizes risk. It focuses on increasing reliability and making the best decisions in risky situations. In short, it is reactive to risk. The framework of options thinking, however, recognizes that uncertainty adds value to options. In this context, uncertainty is a driver of value and can be viewed as a positive element. Correspondingly, systems design from this perspective is proactive towards risk. It seeks out opportunities to add value and commits to ongoing processes of information gathering to ensure that options can be exploited at the correct time. Thinking in terms of real options leads designers to build much more flexibility into a system than is common in current practice. For example, they may build duplicate combustion facilities that allow a plant to burn both natural gas and oil, or deliberately develop products that they may never launch. These investments that may be unused are ‘‘options’’; they give the system managers the capability to change the design or product mix, without requiring them to do so. The analysis of real options involves a set of procedures that adapt and extend the options analysis that won a Nobel in economics for its developers. Options analysis is now widely used for contracts on all kinds of widely traded financial instruments (stocks and bonds), commodities (oil, grain, and foreign exchange) and services (electric power, communications bandwidth). The analysis of real options applies the same basic principles, but adapts them to the particular circumstances of systems design, which generally deals with unique projects that lack historical statistics on risk. The analysis of real options enables managers and designers to estimate the value of system flexibility. As this has not been practical before, designers have previously not considered the value of flexibility. Incorporating this capability into systems analyses adds two significant dimensions to design. Public and private operators of major systems will come to recognize: - Large classes of projects as much more valuable than they now seem to be – these include all those that enable further development without committing to it prematurely, such as research, product development, system modularity, exploratory mining, etc.; and - New classes of design alternatives, specifically those enabling managers to adjust the system as needed when relevant information becomes available, that is design alternatives that involve deferral, acceleration and closure of facilities. The paper illustrates the wide range of applications of for the analysis of real options, using documented cases in many fields of engineering. It also refers to the extent possible to companies changing their procedures for system design and management to capitalize on the promise of real options.

Recent studies on thermoelectric (TE) systems indicate that the existence of high figure of merit (ZT) materials alone is not sufficient for superior system performance and an integrated system level analysis is necessary to attain such performance. This is because there are numerous design parameters at various levels of the system that are randomly variable in nature that could affect the overall system performance. In this work the effect of stochasticity in design variables at various levels of a TE system has been studied and analyzed to attain optimal design solutions. Starting with stochasticity in one of the environmental variables, a progression was made towards studying the coupled effects of stochasticity in multiple variables at environmental and heat exchanger levels of a thermoelectric generator (TEG) system. Research and analysis tools were developed to incorporate stochasticities in single or multiple variables individually or simultaneously to study both the individual and coupled affects of input design variable stochasticities (probabilities) on output performance variables. Results indicate that normal or Gaussian distribution in input design parameters may not produce Gaussian output parameters. Also when the stochasticities in multiple variables are coupled, the standard deviations in performance parameters are magnified, and their means/averages deviate moremore » from the deterministic values. Although more studies are required to quantify the parameters for design modifications, the studies presented in this paper affirm that incorporating stochastic variability not only aids in understanding the effects of system design variable randomness on expected output performance, but also serves to guide design decisions for optimal TE system design solutions that provide more robust system designs with improved reliability and performance across a range of off-nominal conditions.« less

The ‘top‐down’ system design process of functional decomposition is increasingly being criticised as simplistic, outmoded, and (in particular) too ‘reductionist’. Its use on large, complex systems is frequently portrayed as naive and impractical. There is much comment on the need to concentrate, instead, on the ‘emergent behaviours’ of systems, and to adopt a ‘holistic’ design approach in which a system solution is ‘evolved’ through a process of system design synthesis.This paper presents a counter‐argument that top‐down design decomposition can, in fact, be a highly efficient way to produce good (optimal) system solutions .Many of the fundamentals of function based system design are addressed: the central role of system function in the design process; the characterisation of system complexity and complication; the identification and specification of component requirements; and the determination of optimal design solutions.An established mathematical theory of systems design, using formal constructs and set‐theory notation, is used as the basis for the presentation of ideas.

The management of software development for single and dual processor system designs is making progress towards becoming a mature discipline. A good part of the progress can be attributed to the development and use of standard system and software engineering methods and design principles.However, new computer system designs (networking, distributed systems, embedded systems, multi- and coprocessors, fault tolerant systems, etc.) will create new challenges for managers of software development. The reason for this effect on management is that some of the system and software engineering methods and design principles developed for single and dual processor system designs are not valid for these newer designs.Some of the issues that software development project managers will need to cope with are:1. Life cycle model adjustments2. Rapid prototyping activities3. Different hardware and software phasing4. Increased tool development5. New trade-offs and hybrid developments of off-the-shelf software and newly developed software6. Development of concurrent design principles7. New software design principles to support fault tolerance and the use of new memory technologiesThe above items are just now being recognized as problems, and solutions for them either do not exist, or are not widely known.These problems create a series of new challenges that managers must deal with for software development based on the new architectures and requirements. The purposes of this paper are to discuss these issues and to identify some solutions that can serve in the interim as the technology changes to meet these new challenges.

Advanced, direct thermal energy conversion technologies are receiving increased research attention in order to recover waste thermal energy in advanced vehicles and industrial processes. Advanced thermoelectric (TE) systems necessarily require integrated system-level analyses to establish accurate optimum system designs. Past system-level design and analysis has relied on well-defined deterministic input parameters even though many critically important environmental and system design parameters in the above mentioned applications are often randomly variable, sometimes according to complex relationships, rather than discrete, well-known deterministic variables. This work describes new research and development creating techniques and capabilities for probabilistic design and analysis of advanced TE power generation systems to quantify the effects of randomly uncertain design inputs in determining more robust optimum TE system designs and expected outputs. Selected case studies involving stochastic TE .material properties and coupled multi-variable stochasticity in key environmental and design parameters are presented and discussed to demonstrate key impacts from considering stochastic design inputs on the TE design optimization process. Critical findings show that: 1) stochastic Gaussian input distributions may produce Gaussian or non-Gaussian outcome probability distributions for critical TE design parameters, and 2) probabilistic input considerations can create design effects that warrant significant modifications to deterministically-derived optimum TE system designs. Magnitudes and directions of these design modifications are quantified for selected TE system design analysis cases.

Over the past two decades, 3D techniques combined with heterogeneous integration, combining different functions and materials, have emerged as a key enabler for overcoming the physical and scaling limits of traditional 2D integration. These approaches are now expanding across multiple domains, including CMOS, memories, photonics, imagers, and RF systems, with the aim of delivering next-generation integrated systems for advanced computing (AI), analog/RF, and imaging applications. In this presentation, we will explore the fundamental techniques, recent advancements, and some challenges associated with achieving integration. Special emphasis will be placed on the role of hybrid bonding and sequential 3D integration schemes, as well as their implications for energy efficiency, device performance, and system-level innovations.3D integration has transitioned from a niche research area to a cornerstone technology in microelectronics, driven by its potential to address high density interconnect and traditional 2D scaling bottlenecks for several applications and enable heterogeneous integration at unprecedented scales. At the heart of this technological evolution are advanced schemes such as wafer thinning, Through-Silicon Vias (TSVs), hybrid bonding, and sequential 3D integration techniques. These techniques have been pivotal in shrinking the interconnect length, reducing latency, and enhancing data bandwidth in computing systems. In parallel, developments in wafer-to-wafer, die-to-wafer, and chiplet integration are enabling the seamless merging of diverse materials enabling functionalities such as logic, memory, photonics, and RF. Compact form factors are achieved enabling to boost performances of the most demanding applications such as Artificial Intelligence or Tb/s transceiver applications [1].Recent studies highlight significant progress in hybrid bonding technology, which achieves high-density interconnects at the submicron scale, thereby optimizing power delivery and thermal management in stacked devices [2]. Meanwhile, sequential 3D integration [3][4] where layers of transistors are fabricated sequentially on the same substrate, is emerging as a game-changing paradigm. It promises ultra-high-density integration with minimal parasitics, creating new opportunities for energy-efficient and high-performance systems. Several applications are foreseen including C-FETS, memories and imagers [5] .Photonic interconnects will enter in next generation 3D IC integration, addressing challenges in data bandwidth, power consumption and signal integrity and enabling photonic interposers for next generation of components for data centers and communication systems [7]. Similarly, RF [8] and analog domains [9] benefit from 3D stacking by improving front-end module integration with specific materials (III-V, HR, ...), leading to enhanced performance and higher frequencies.Despite these achievements, significant challenges remain. Thermal dissipation is a critical bottleneck [10] , particularly in densely 3D stacked architectures where hotspots can severely impact reliability and performance. Moreover, the mechanical stresses induced during bonding and processing can affect device yield and long-term stability. Our recent work in advanced thermal management and stress engineering underscores the need for interdisciplinary approaches to address these challenges. Solutions such as microfluidic cooling, novel materials for thermal interface layers and specific bonding technologies are being actively explored. Furthermore, while heterogeneous integration is currently feasible at the wafer scale—such as wafer-to-wafer hybrid bonding, which is already in mass production—expanding application fields will require advancements in die-to-wafer integration techniques.Looking ahead, the convergence of 3D integration with emerging paradigms such as neuromorphic computing, quantum technologies, multispectral and smart imagers, and advanced packaging promises to redefine system design at all levels. The synergy between 3D technologies and heterogeneous integration of advanced materials, such as 2D semiconductors, III-V, ferroelectric or oxide semiconductor [11] materials, further expands the horizon for innovation.In conclusion, 3D integration has proven to be a transformative force in microelectronics, offering pathways to overcome traditional limitations and unlock new performance dimensions. Intensive researches worldwide continues contribute to push the boundaries of what is possible, paving the way for smarter, more efficient, and highly integrated systems.

This book will help readers gain a solid understanding of non-functional requirements inherent in systems design endeavors. It contains essential information for those who design, use, and maintain complex engineered systems, including experienced designers, teachers of design, system stakeholders, and practicing engineers. Coverage approaches non-functional requirements in a novel way by presenting a framework of four systems concerns into which the 27 major non-functional requirements fall: sustainment, design, adaptation, and viability. Within this model, the text proceeds to define each non-functional requirement, to specify how each is treated as an element of the system design process, and to develop an associated metric for their evaluation. Systems are designed to meet specific functional needs. Because non-functional requirements are not directly related to tasks that satisfy these proposed needs, designers and stakeholders often fail to recognize the importance of such attributes as availability, survivability, and robustness. This book gives readers the tools and knowledge they need to both recognize the importance of these non-functional requirements and incorporate them in the design process

Sistem güvenilirliği, iletişim ve elektronik sistemler gibi ileri teknolojiye sahip modern mühendislik sistemlerinin tasarımı ve analizinde yaygın olarak kullanılan önemli ölçütlerden biridir. Günlük hayatımıza giren, çoğu çalışma alanında ve sosyal yaşamda kullandığımız uygulamaları doğrudan etkileyen altyapı tasarım problemlerinin bir kısmı güvenilirlik ölçütünü dikkate alan eniyileme problemi olarak tanımlanmaktadır. Bu nedenle bu tür problemlerin çözümü, farklı disiplinlerde çalışan birçok araştırmacının yoğun ilgisini çekmektedir. Sistem güvenilirliğinin eniyilenmesi için alan yazında yaygın olarak kullanılan Yedek Bileşen Tahsis Problemi (YBTP), sistemde yer alan bileşenlere paralel olarak yerleştirilen kullanıma hazır bileşenler ile yeni sistemlerin tasarlanması olarak tanımlanabilir. Böylece, güvenilirlik başarım ölçütü dikkate alınarak daha yüksek güvenilirlik değerine sahip sistem tasarımlarının elde edilmesi sağlanabilmektedir. Sistem özelliklerine bağlı olarak seçilen uygun yöntemle sistemin güvenilirlik değeri elde edilir. Bu çalışmada, artan arıza ve tamir oranlarının dikkate alındığı YBTP’de sistem güvenilirliğini gerçekçi bir yaklaşımla tahmin etmek için Kesikli Olaylı Benzetim (KOB) modeli, sistemin eniyilenmesi için ise Genetik Algoritma (GA) geliştirilmiştir. KOB modelinin geçerliliği test problemleri üzerinde gösterilmiştir. Önerilen yaklaşımla, YBTP için daha yüksek güvenilirliğe sahip sistem tasarımlarının daha düşük maliyetlerle elde edilebilmesi sağlanmıştır.