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Investigations into intrachip wireless interconnection for ultra large scale integration technology

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Abstract

A wireless link was created using two identical antennas deposited on the substrate at the transmitting and receiving sides as shown in Fig.1a. To investigate effect of the environment existing between the transmitting and receiving antennas, several simulations were performed; one without any wired interconnections and other for different widths of the wired interconnections (w i ). The frequency range used for the simulations was from 20 GHz to 30 GHz. The result of simulations concerning the transmission gain between the transmitter and the receiver is shown in Fig. 2a. Note that the case of no wired interconnections is presented in Fig. 2a as w i =0. The distance between the two antennas (d) was assumed to be 10 mm in this case, as measured between the end-to-end antenna structures. It is clear from Fig. 2a that the transmission gain is larger than −20 dB across the band 21 GHz to 27 GHz for the case of no wired interconnection and between 22 to 28 GHz for the case of wired interconnection. The gain is at least 10 dB larger than the reported results in the literature when using other types of antennas, such as the monopoles, dipoles or zigzag dipoles [3]. This result indicates clearly the possibility of using the proposed antenna to establish a wireless interconnection even with packages that have a relatively large size. It is also interesting to compare the transmission gain with the conventional wired interconnections (when the wireless link is replaced by the wired link). To this purpose, the results published in [11] were interpolated. For a distance of 10 mm, the conventional wired interconnections described in [11] offered a transmission gain less than −28 dB at frequency of 25 GHz.

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