• Home
  • Search
  • Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics
  • Cite Icon6
  • https://doi.org/10.1016/j.matlet.2023.135675Copy DOI Icon

Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics

Show More
  • Abstract
  • Literature Map
  • References
  • Citations
  • Similar Papers
Abstract

Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics

Similar Papers
  • Conference Article
  • Citations1

A Study Of Pile Capacity For The Heather Platform

  • Oct 24, 1978
  • R.H.G Parry
  • Research Article
  • Citations183

The effect of shear strength on the ballistic response of laminated composite plates

  • Apr 27, 2013
  • European Journal of Mechanics - A/Solids
  • K Karthikeyan +4
  • Conference Article
  • Citations4

Pressureless and low temperature sintering by Ag paste for the high temperature die-attachment in power device packaging

  • May 01, 2022
  • Chuncheng Wang +7
  • Research Article
  • Citations25

The shear strength of Calabrian pine (Pinus brutia Ten.) bonded with polyurethane and polyvinyl acetate adhesives

  • Jan 19, 2006
  • Journal of Applied Polymer Science
  • Erol Burdurlu +3
  • Research Article
  • Citations7

Shear strength of calabrian pine (Pinus brutia Ten.) bonded with polyurethane and polyvinyl acetate adhesives

  • Mar 29, 2006
  • Journal of Applied Polymer Science
  • Erol Burdurlu +3
  • Research Article
  • Citations3

English

  • Nov 28, 2017
  • Soil & Environment
  • Mohd Nizar Khairuddin +4
  • Research Article
  • Citations161

Adhesive properties of soy proteins modified by sodium dodecyl sulfate and sodium dodecylbenzene sulfonate

  • Jul 01, 2000
  • Journal of the American Oil Chemists' Society
  • Weining Huang +1
  • Research Article
  • Citations22

Accelerated curing of adhesively bonded G-FRP tube connections — Part I: Experiments

  • Apr 17, 2021
  • Composite Structures
  • Morten Voß +1
  • Research Article
  • Citations15

炭素繊維/炭素複合材と銅合金との接合

  • Jan 01, 1996
  • QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY
  • Hisanori Okamura +2
  • PDF
  • Research Article
  • Citations4

Modelling shear strength of compacted soils

  • Jan 01, 2019
  • E3S Web of Conferences
  • Sam Bulolo +1
  • Research Article
  • Citations2

Microstructure and mechanical properties of Ti-Ti2AlNb interface

  • Jan 01, 2021
  • Composites and Advanced Materials
  • Tao Niu +3
  • Research Article
  • Citations7

Preparation and sintering properties of Cu10Sn3 IMCs nanopaste as die attach material for high temperature power electronics

  • Oct 15, 2020
  • Materials Letters
  • Longjun Guo +2
  • Research Article
  • Citations27

A Study on the Block Shear Strength according to the Layer Composition of and Adhesive Type of Ply-Lam CLT

  • Nov 01, 2020
  • Journal of the Korean Wood Science and Technology
  • Gyu Woong Choi +5
  • Research Article
  • Citations22

Investigation of formaldehyde-free wood adhesives from kraft lignin and a polyaminoamide–epichlorohydrin resin

  • Jan 01, 2004
  • Journal of Adhesion Science and Technology
  • Kaichang Li +1
  • Research Article
  • Citations13

Full scale testing and development of wood-steel composite shear walls

  • Apr 18, 2019
  • Structures
  • Kyle Conrad +1
Cactus Communications logo

Copyright 2026 Cactus Communications. All rights reserved.