スルホコハク酸浴からのＣｎＳｎ合金の電析

Electroless (ELS) copper plating process has been commonly used for printed circuit board (PCB) metallization. The traditional ELS copper plating process uses tin/palladium colloid or complexed palladium ion as catalysts for ELS copper deposition. But the price of palladium catalyst is much higher than that of gold. Herein, we use complexed copper(II) ion to replace the palladium catalyst in order to greatly reduce the process cost but maintain the performance and the reliability of the complexed copper(II) ion as good as palladium. The synthesis process of the complexed copper ion is simple and its cost, which compared with palladium, is cheap. Especially, they have no oxidation issue because they are not metallic copper nanoparticles but copper(II) ions. Before ELS copper plating, the grafted copper(II) ion that is chemically adsorbed onto the substrate surface is reduced to copper atom, so they can catalyze ELS copper deposition. In this work, we optimize the experimental parameters such as operating temperature, reaction time, copper ion concentration and the pH of the plating solution. After ELS plating process, the backlight test of through holes (THs) of a PCB and the morphology of the ELS copper deposited onto the sidewalls of the THs are evaluated by optical microscope (OM) and scanning electron microscope (SEM), respectively. The thermal reliability of the ELS copper deposition catalyzed by the grafted copper catalyst was examined after copper electroplating using thermal shock in a tin bath at 288℃ for ten seconds and repeated it for 5 times. Results show that it can pass the thermal shock test. Therefore, the application of complexed copper(II) ion as the catalyst of ELS copper plating is expected to replace the expensive palladium for PCB fabrication.

In this work, copper (II) ions were saturated and copper oxide nanoparticles (CuO NPs) were supported in natural zeolite from Chile; this was achieved by making the adsorbent material come into contact with a copper ion precursor solution and using mechanical agitation, respectively. The kinetic and physicochemical process of the adsorption of copper ions in the zeolite was studied, as well as the effect of the addition of CuO NPs on the antibacterial properties. The results showed that the saturation of copper (II) ions in the zeolite is an efficient process, obtaining a 27 g L-1 concentration of copper ions in a time of 30 min. The TEM images showed that a good dispersion of the CuO NPs was obtained via mechanical stirring. The material effectively inhibited the growth of Gram-negative and Gram-positive bacteria that have shown resistance to methicillin and carbapenem. Furthermore, the zeolite saturated with copper at the same concentration had a better bactericidal effect than the zeolite supported with CuO NPs. The results suggested that the ease of processing and low cost of copper (II) ion-saturated zeolitic material could potentially be used for dental biomedical applications, either directly or as a bactericidal additive for 3D printing filaments.

Commercial Inconel 600 nickel-chromium alloy was implanted with nitrogen, titanium, chromium, copper with tin (as bronze components) and yttrium ions to doses ranging from 1.6e17 to 3.5e17 cm−2. The aim of this research was to investigate the properties of the modified alloy in the context of its application in foil bearings. The virgin and the treated samples were tribologically tested and examined by Scanning Electron Microscopy, Glow Discharge Mass Spectrometry and Energy Dispersive Spectroscopy. The technological studies were preceded by modelling of concentration values of the introduced elements. The results obtained with the use of ion implantation are discussed. There are two advantages which should be highlighted: good agreement in modelling and experimental results of depth profiles of implanted ions, wear resistance improvement of Inconel 600 surface by implantation of copper and tin ions. The tribological tests indicate that abrasion and corrosion are the predominant mechanisms of surface wear.

Two chemosensors derived from acenaphthene-imidazole hybrid were synthesized and characterised for the purpose of detecting tin (Sn 2+ ) and copper (Cu 2+ ) ions detection limits were calculated to be 1.2 × 10 −9 M and 2.1 × 10 −9 M, respectively.

The paper mainly discusses the antibacterial performance of bamboo pulp and cotton fabrics which were treated with NaOH solution and copper ammonia solution. SEM, ICP-OES, and agar diffusion plate method were used to investigate the existence of copper ions and analyze the influence of treatment parameters on the copper ion content and antibacterial performance. The results show that there is significant difference for all the properties between bamboo pulp and cotton fabrics. The alkali treatment, concentration, and time period all have significant influence on the copper ion contents and antibacterial performance, and they have different influences on the bamboo pulp fabrics and cotton fabrics. The antibacterial performance not only depends on the copper ion content on the fabrics but also relate to the release action. The release ability of copper ions in bamboo fabrics is better than that in cotton fabrics. Alkali treatment makes the complex of copper ion more stable and the release rate slower.

Electrical potential may facilitate the moving of corroded metal ions across radicular dentin to cause allergic reaction. This study was to investigate the effect of electrical potentials on the penetration of silver and copper ions through radicular dentin. Eighty-eight dentin discs were prepared from intact premolar teeth and placed between two containers of the model. One container was filled with copper and/or silver solution. Another container was filled with 0.9% sodium chloride solution. Five levels of electrical potential were applied to the model at 37 degrees C for 1 and 24 hrs. Then silver and copper ions in sodium chloride solution were measured by ICP-ES. The data was analyzed by one-way ANOVA with Tukey comparison test and student's t-test (P< 0.05). The concentrations of metal ions significantly increased as the electrical potentials increased when above 250 mV were applied after 1 hr. The concentrations of silver ions were significantly greater than those of copper ions. Low concentrations of silver and copper ions were detected after 24 hrs at 125 mV level. These results suggest that the penetration of corroded silver and copper ions through radicular dentin caused by intraoral potential might be minimal.

The aim of the study was to evaluate the effect of zinc as well as magnesium or copper ions on the efficacy of passive transport of imipramine hydrochloride in in vitro model. According to results from passive transport, the next aim of the studies was to check the efficiency of active transport of imipramine hydrochloride in the presence or absence of zinc ions. The passive transport study was conducted in specially designed capsules, while CaCo-2 cell lines were used in active transport evaluation. Zinc, magnesium and copper content was determined by F-AAS method. The analysis of imipramine hydrochloride was performed using HPLC method. Mean concentrations of zinc, magnesium, and copper ions obtained in this experiment were as follows: 2.98, 1.34 and 3.52 mg/L, respectively. The presence of zinc ions increased the efficiency of active transport of imipramine hydrochloride by 39%. Furthermore, the transport of zinc ions in the presence of imipramine hydrochloride was 27% greater than that of the zinc-containing solutions without imipramine hydrochloride. The extending of the time of experiment from 30 to 60 minutes resulted in an increase in transport efficiency of more than 10% in both cases. The efficiency of passive and active transport of imipramine hydrochloride is influenced by the presence of Mg, Zn and Cu ions. The passive transport of imipramine hydrochloride after 90 minutes of experiment was the most effective in the presence of copper and zinc ions. Further studies conducted on the CaCo-2 cell line indicated a clear positive interaction of imipramine - zinc.

Control of legionella in drinking water

This study reviews the latest progress of ratiometric fluorescent probes of copper ions from 2022 till now. As a key trace element in biological systems, copper ions play an important role in a variety of biological processes. However, the abnormal change in copper ion concentration is closely related to a variety of diseases, so the development of highly sensitive and highly selective copper ion detection methods is of great significance for scientific research and clinical diagnosis. In this paper, we first introduced the classification of copper ion fluorescence probes, including molecular sensors based on five-membered azocycles, six-membered azocycles, imide groups (R2C=NR'), oxygen and nitrogen functional groups (such as ethers, aldehydes, ketones, esters, carboxylic acids and hydroxyl groups) and group VIA elements. Subsequently, the application of nanosensors in the detection of copper ions is further discussed, especially the nanosensors in which copper is used as a reactant, catalyst or alternative reaction. Finally, the current research status of copper ion fluorescence probes is summarized, and the future development direction is prospected in order to provide reference and inspiration for the design of new high-efficiency copper ion detection tools.

Magnesium-aluminium hydrogenphosphate layered double hydroxide that synthesized by used of co-precipitation and followed by hydrothermal (MAHP4) method was used as an adsorbent to remove copper ions from aqueous solutions. The effects of various optimization parameters such as contact time, adsorbent dosage and lead ion concentrations were investigated by used of Response surface methodology (RSM). The Response surface methodology (RSM) based on a four-level-three variables Central Composite Rotatable Design (CCRD) was employed to evaluate the interactive effects of the various optimization parameters. The parameters were contact time (2-6 h), adsorbent dosage (0.01 0.05 g) and copper ion concentrations (50 100 mg/l). Simultaneously by increasing contact time and amount of dosage of MAHP4 used, the percentage of lead ion removal from aqueous solution was increased. However, the percentage removal decreases with an increase in concentrations of copper ion. The experimental percentage removal recorded under optimum conditions was compared well with the maximum predicted value from the RSM which suggest that fractional factorial design of RSM can be used to study the removal of copper from aqueous solution by used of magnesium-aluminium hydrogenphosphate layered double hydroxide as an adsorbent.

Alterations of thiol metabolism in human cell lines induced by low amounts of copper, mercury or cadmium ions

The sustenance of human life activities depends on copper, which also serves as a crucial factor for vital enzymes. Under typical circumstances, active homeostatic mechanisms keep the intracellular copper ion concentration low. Excess copper ions cause excessive cellular respiration, which causes cytotoxicity and cell death as levels steadily rise above a threshold. It is a novel cell death that depends on mitochondrial respiration, copper ions, and regulation. Cuproptosis is now understood to play a role in several pathogenic processes, including inflammation, oxidative stress, and apoptosis. Copper death is a type of regulatory cell death(RCD).Numerous diseases are correlated with the development of copper homeostasis imbalances. One of the most popular areas of study in the field of cancer is cuproptosis. It has been discovered that cancer angiogenesis, proliferation, growth, and metastasis are all correlated with accumulation of copper ions. Copper ion concentrations can serve as a crucial marker for cancer development. In order to serve as a reference for clinical research on the product, diagnosis, and treatment of cancer, this paper covers the function of copper ion homeostasis imbalance in malignant cancers and related molecular pathways.

Features of the kinetics of ozone decomposition in water at pH 2 are studied depending on the concentration of silver and copper ions that are present. The existence of a critical concentration of metal ions (∼3−6 × 10−6 M) is established, below which ions slow the rate of ozone decomposition and above which the accelerate the process. It is concluded that the first region is due to the capture of hydroxyl and other radicals by metal ions, inhibiting the chain of ozone decomposition in water. A further increase in the concentration of ions leads to dominance of their direct interaction with molecules of ozone. A mechanism for the process is proposed and the rate constants of reaction of ozone with silver ions and copper are calculated (0.033 and 0.06 M−1 s−1, respectively).

A novel fiber sensor which can detect the concentration of copper ions indirectly was proposed and demonstrated by coating the knotted-shaped fiber with chitosan. The diameter of the knotted-shaped fiber was determined to be 10 mm. The Mach-Zehnder Interference generated due to bending deformation that excited some core-modes into higher order cladding-modes and two modes interfered. Chitosan was selected as the identification material for coating the fiber. In order to enhance the chelation between chitosan and copper ions, and improve the sensitivity of copper ions, glutaraldehyde was used to chemically modify chitosan. The original fiber sensor was annealed to obtain a stable structure, and then it was immersed in the modified chitosan solution and deionized water to form an available chitosan coating on the surface of the sensor. In the detection experiment with copper ions concentration of 0-330 ppm, the results show that interference spectra uniformly red-shift with the increase of the copper ions concentration and the sensitivity of the copper ion was 24.6 pm/10ppm. At the same time, ideal spectral fluctuations were demonstrated in the stability inquiry experiments.

Electroplating wastewater contains high amount of heavy metals that can cause serious problems to humans and the environment. Therefore, it is necessary to remove heavy metals from electroplating wastewater. The aim of this research was to examine the electrocoagulation (EC) process for removing the copper (Cu) and lead (Pb) ions from wastewater using aluminum electrodes. It also analyzes the removal efficiency and energy requirement rate of the EC method for heavy metals removal from wastewater. Regarding this matter, the operational parameters of the EC process were varied, including time (20−40 min), current density (40−80 A/m2), pH (3−11), and initial concentration of heavy metals. The concentration of heavy metals ions was analyzed using the atomic absorption spectroscopy (AAS) method. The results showed that the concentration of lead and copper ions decreased with the increase in EC time. The current density was observed as a notable parameter. High current density has an effect on increasing energy consumption. On the other hand, the performance of the electrocoagulation process decreased at low pH. The higher initial concentration of heavy metals resulted in higher removal efficiency than the lower concentration. The removal efficiency of copper and lead ions was 89.88% and 98.76%, respectively, at 40 min with electrocoagulation treatment of 80 A/m2 current density and pH 9. At this condition, the specific amounts of dissolved electrodes were 0.2201 kg/m3, and the energy consumption was 21.6 kWh/m3. The kinetic study showed that the removal of the ions follows the first-order model.