Processes in Devices Fabrication

Purpose– Maintaining and improving productivity of product design and engineering processes has been a paramount challenge for design-driven companies, which are characterised a high degree of development of products and processes in order to meet particular customer requirements. Literature on this issue is fragmented and dispersed and a concise and systematic overview is lacking. Hence, it remains unclear, which methods are applicable for design-driven companies to improve the productivity of limitedly available engineering resources (a challenge companies and nations face currently). The purpose of this paper is to develop such a systematic overview.Design/methodology/approach– An unusual approach was utilised by combining the outcomes from a systematic literature review and the results of a Delphi study. From both research approaches complementary and overlapping methods for improving the productivity of product design and engineering processes could be drawn.Findings– The unique systematic overview presents 27 methods to increase the productivity, effectiveness and efficiency of product design and engineering processes of design-driven companies. Moreover, the study finds that methods for improving effectiveness are preferred over methods for improving efficiency and that limitations with regard to the availability of resources are often not considered.Research limitations/implications– During the development of the systematic overview, a lack of empirical evidence to assess the actual impact of productivity improvement methods was discovered. This shortcoming demonstrates the need for more conceptual and empirical work in this domain. More studies are needed to test and confirm the usefulness of the proposed methods.Practical implications– Nevertheless, design-driven companies, which struggle to increase the productivity of their product design and engineering processes, can systematically select improvement methods from the overview according to their impact on productivity, effectiveness and efficiency. However, companies should keep in mind, whether effectiveness of product design and engineering can really be increased without considering limitations in engineering resources.Originality/value– Therefore, the systematic overview provides a valuable map of the unexplored territory of productivity improvement methods for product design and engineering for both practitioners and researchers. For the latter ones, it creates directions for empirical investigations in order to explore and to compare methods for the improvement of productivity of product design and engineering processes.

This special edition brings together a collection of articles that explore advances in materials science and environmental sustainability. The focus is on three distinct research areas: aluminium alloy properties and processing technologies, polymers and composites, and waste recycling and soil contamination analysis. The presented comprehensive examinations of technological innovations in materials science, machinery and environmental safety, make this edition an essential resource for researchers and engineers striving for sustainable progress in the modern world.

Due to its dominant role in silicon devices technologies [1, 2] the SiO2/Si interface has been intensively studied in the last five decades. The ability to form a chemically stable protective layer of silicon dioxide (SiO2) at the surface of silicon is one of the main reasons that make silicon the most widely used semiconductor material. This silicon oxide layer is a high quality electrically insulating layer on the silicon surface, serving as a dielectric in numerous devices that can also be a preferential masking layer in many steps during device fabrication. Native oxidation of silicon is known to have detrimental effects on ultra-largescale integrated circuit (ULSIC) processes and properties including metal/silicon ohmic contact, the low-temperature epitaxy of silicide and dielectric breakdown of thin SiO2 [3]. The use of thermal oxidation of Si(100) to grow very thin SiO2 layers (~ 100Ǻ) with extremely high electrical quality of both film and interface is a key element on which has been built the success of modern MOS (metal-oxide-semiconductor) device technology [4]. At the same time the understanding of the underlying chemical and physical mechanisms responsible for such perfect structures represents a profound fundamental challenge, one which has a particular scientific significance in that the materials (Si, O) and chemical reaction processes (e.g. thermal oxidation and annealing) are so simple conceptually. As a result of extreme decrease in the dimensions of Si metal-oxide-semiconductor field effect transistor device (MOSFET), the electronic states in Si/SiO interfacial transition region playa vital role in device operation [5]. The existence of abrupt interfaces, atomic displacements of interface silicon and intermediate oxidation states of silicon are part of different experiments [6, 7]. The chemical bonding configurations deduced from the observed oxidation states of silicon at the interface are the important basis for the understanding of the electronic states. The distribution of the intermediate oxidation states in the oxide film and the chemical bonding configuration at the interface for Si(100) and Si(111) were investigated [5] using measurements of Si 2p photoelectron spectra. One of the X-ray photoelectron spectroscopy (XPS) results is that the difference for and orientations is observed in the intermediate oxidation state spectra. Ultra thin SiO2 films are critical for novel nanoelectronic devices as well as for conventional deep submicron ULSIC where the gate oxide is reduced to less than 30Ǻ. Precise thickness measurement of these

We demonstrate the uniqueness, unclonability and secure authentication of N = 56 physical unclonable functions (PUFs) realized from silicon photonic moiré quasicrystal interferometers. Compared to prior photonic-PUF demonstrations typically limited in scale to only a handful of unique devices and on the order of 10 false authentication attempts, this work examines > 103 inter-device comparisons and false authentication attempts. Device fabrication is divided across two separate fabrication facilities, allowing for cross-fab analysis and emulation of a malicious foundry with exact knowledge of the PUF photonic circuit design and process. Our analysis also compares cross-correlation based authentication to the traditional Hamming distance method and experimentally demonstrates an authentication error rate AER = 0%, false authentication rate FAR = 0%, and an estimated probability of cloning below 10−30. This work validates the potential scalability of integrated photonic-PUFs which can attractively leverage mature wafer-scale manufacturing and automated contact-free optical probing. Such structures show promise for authenticating hardware in the untrusted supply chain or augmenting conventional electronic-PUFs to enhance system security.

Polymeric materials have been widely used for the fabrication of photonic devices. However, it remains a challenge to develop the reliable fabrication know-how in processing and patterning of polymeric materials. This paper will discuss the issues required in the fabrication of high performance polymer based photonic devices, and integrating them to address the future needs of the information and communication technology sector. Issues affecting the quality of the optical polymer films and device performances have been investigated. These include processing conditions, patterning technique and substrate selection. The findings can serve as a guide for optimizing the materials and process parameters in the fabrication of polymer optical devices.

The paper mainly focuses on the design, fabrication and measurement on Zinc Oxide (ZnO)-based Metal-Semiconductor Field Effect Transistor. The research problem in this study is difficulty on observing the electronic properties of ZnO materials to fabricate the high performance transistor design with non-toxic semiconductor materials. Even though the wide band gap materials of Group III and V possess high performance properties for fabricating the power electronics devices, the harmful impacts could not be reduced. The research solution for the problem statement in this study is emphasized on the non-toxic materials of Group II and VI-based high performance power electronics devices fabrication. The experimental studies of the device fabrication were conducted by Pulse Laser Deposition (PLD) process in standard laboratory. The step-by-step procedures for MSFET device fabrication were discussed and the confirmation of developed device fabrication was completed. The approaches on all measurement were completed based on band diagram condition, quantum interference on metal-semiconductor materials, and current-voltage characteristics. The step by step measurement for fabricated device for the proposed structure could be confirmed by standard measurement techniques. The proposed design has been validated for the utilization of high performance applications. The physical properties and physical characteristics for measurement results were confirmed by the theoretical analyses. The numerical analyses have been completed with the help of MATLAB. All results have been proved by recent research works.

Recent advances in materials science, microelectronics, and data analytics have propelled the flexible and wearable sensors field forward. This comprehensive review summarizes the current state of research in flexible and wearable sensors, shedding light on their evolving technology, applications, and potential impact on various industries. The key developments in sensor materials, fabrication techniques, and integration methods, highlighting their implications for human–machine interaction, health monitoring, sports and fitness, and beyond are explored. Additionally, the difficulties and possibilities in this quickly developing field are addressed and perspectives on the future paths and possible uses of wearable and flexible sensors, highlighting their influence on environmental monitoring, personalized technology, and the current healthcare landscape are provided. This review serves as a resource for researchers, engineers, and innovators interested in cutting‐edge developments and emerging opportunities in the realm of flexible and wearable sensors.

Modeling and simulation softwareSection:ChooseTop of pageModeling and simulation s... <<Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Comsol has released version 5.1 of its Multiphysics software, which allows users to create models, build simulation apps, and share the apps via the Comsol server mode. Upgrades include full integration between the model builder and the application builder. Users can easily switch between them and update the model and the app simultaneously. The model builder’s functions and features can be used in the application builder with no need to interface between the software packages. Both models and apps can be saved in the unified .mph file format. Version 5.1 simplifies code generation and provides many template codes for users who want to implement highly customized commands and operations. Additions have also been made to add-on products that expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Comsol Inc, 1 New England Executive Park, Burlington, MA 01803, http://www.comsol.comMagnetocaloric effect measurement softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea... <<Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...A software analysis program from Lake Shore Cryotronics allows users in the magnetic research field to characterize and determine the nature of magnetic phase transitions in magnetocaloric effect (MCE) candidate materials. It is offered in a free beta trial version for users of Lake Shore’s 7400 or 7300 series vibrating sample magnetometers (VSMs). According to the company, the software simplifies the process of calculating MCEs and makes it easier to prepare the measuring protocol. The program imports measured isothermal M(H) and isofield M(T) magnetization curves recorded using Lake Shore VSM system data acquisition software. It uses those data to calculate the materials’ refrigerant capacity and their magnetic entropy change from peak value and full width at half maximum. Lake Shore Cryotronics Inc, 575 McCorkle Boulevard, Westerville, OH 43082, http://www.lakeshore.comSemiconductor processing failure analysisSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ... <<Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Park Systems has released the NX-Hivac atomic force microscope system for research and industrial failure analysis in highly doped semiconductor processing. It uses high-vacuum scanning spreading resistance microscopy to enable higher sensitivity and resolution than can be achieved in ambient conditions. The applied force between tip and sample under ambient or dry nitrogen conditions is four times higher than in a vacuum; the lower force under vacuum reduces the strain in thin films of target samples, which results in higher spatial resolution and longer tip life. The NX-Hivac can load up to five samples and measure a seven-decade dynamic range of dopant concentration. It has a closed-loop XY scanner for accurate zoom-in imaging and a low noise ratio of 0.30 Å. Motorized laser alignment and high-resolution axis optics enhance ease of use. Park Systems Inc, 3040 Olcott Street, Santa Clara, CA 95054, http://www.parkafm.comComputing and modeling softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so... <<Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...MathWorks has released version 2015a of its Matlab mathematical computing software and Simulink graphical environment for simulation and model-based design. Enhancements include new graphical controls and displays and antenna-to-bits simulation and testing of wireless communications and radar systems. It also has four new products: an antenna toolbox for designing, analyzing, and visualizing antenna elements and arrays; a robotics system toolbox for designing and testing algorithms for robotics applications; a Simulink test for creating test harnesses, authoring complex test sequences, and managing simulation-based tests; and a vision HDL toolbox with pixel-streaming algorithms for designing and implementing vision systems on field-programmable gate arrays and application-specific integrated circuits for image processing, video, and computer vision systems. The MathWorks Inc, 3 Apple Hill Drive, Natick, MA 01760-2098, http://www.mathworks.comOptical engineering softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw... <<Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Photon Engineering has introduced version 14.40 of its optical engineering software, FRED. Used in product development, it merges optical elements with mechanical components to build integrated models. Among its improvements is increased flexibility in the feature that allows objects to be isolated in 3D view, since property-based isolation is now allowed. A new multiple selection method lets users simultaneously assign multiple properties such as coatings, ray-trace controls, and materials to different nodes in an object tree. Keywords, a new property in FRED, can facilitate complex model construction and configuration by acting as pass-throughs for objects assigned to them. A complete list of new FRED 14.40 features can be found in the developer release notes, accessible from the Help menu after installation. Photon Engineering LLC, 310 South Williams Boulevard, Suite 222, Tucson, AZ 85711, http://photonengr.comSemiconductor measurement toolSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement... <<Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Craic Technologies has developed its 20/30 XL microspectrophotometer to nondestructively analyze microscopic samples or microscopic areas on large devices, such as small-spot film thickness on 300-mm wafers. The instrument can acquire data by absorbance, reflectance, or luminescence spectroscopy. It can be used for UV-visible or near-IR microscopy and for high-resolution digital imaging of semiconductor and other types of samples. Users can add the company’s Apollo Raman spectroscopy modules to acquire Raman microspectra. Featuring calibrated variable apertures and manual and automated operation, the flexible instrument is designed to attach to large frames that can accommodate large-scale samples. Applications include mapping thin-film thickness of large devices, locating and identifying contaminants, and measuring strain in silicon. Craic Technologies Inc, 948 North Amelia Avenue, San Dimas, CA 91773, http://www.microspectra.comAutomated wafer-level device characterizationSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev... <<Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Keysight Technologies has unveiled WaferPro Express 2015, a software platform for high-volume measurement of wafer-level devices and circuit components for R&D applications such as device modeling, process monitoring, and component characterization. By controlling all components—instruments and wafer probers alike—WaferPro Express reduces setup complexity and provides a unified platform for efficient automated measurement and data management. It is integrated with Cascade Microtech’s Velox 2.0 probe station control software, a combination which allows for complete wafer-map synchronization. That enables easy, error-free information exchange between the software, including wafer alignment, sites, and die information. To maximize efficiency during RF measurement, WaferPro Express periodically monitors the stability of the RF calibration. Keysight Technologies Inc, 1400 Fountaingrove Parkway, Santa Rosa, CA 95403-1738, http://www.keysight.comIntegrated circuit patterning metrologySection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter... <<Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...The Archer 500LCM and SpectraFilm LD10, two advanced metrology systems from KLA-Tencor Corp, support the development and production of integrated circuit devices that are 16 nm and smaller. They are part of the company’s 5D patterning control solution that characterizes and monitors fab-wide processes. The Archer 500LCM system provides accurate overlay error feedback through all stages of the yield ramp, so chipmakers can resolve overlay issues associated with novel patterning techniques such as multipatterning and spacer pitch splitting. Through reliable, precise measurement of film thickness and stress, the SpectraFilm LD10 enables qualification and monitoring of the films and film stacks used in fabrication of FinFETs, 3D NAND, and other devices. KLA-Tencor Corporation, 1 Technology Drive, Milpitas, CA 95035, http://www.kla-tencor.comFluorescence imaging analysis softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal... <<Optical imaging and spect...Solder paste technologyAtomic layer deposition s...PicoQuant has released version 2.0 of its SymPhoTime 64 fluorescence-lifetime imaging microscopy (FLIM) and fluorescence correlation spectroscopy (FCS) software package. It provides new features for time-resolved data acquisition and analysis and for superresolution. They include global analysis of FCS and time-correlated single-photon counting (TCSPC) curve fitting, which improve cell measurements, and stimulated emission depletion data acquisition and analysis procedures, such as gated STED. An extended TCSPC binning functionality permits faster analysis and binary export of FLIM images. A newly developed fast pattern-matching approach allows two species to be separated by lifetime and absorption and emission spectra, thereby refining FLIM image analysis. PicoQuant, Rudower Chaussee 29, 12489 Berlin, Germany, http://www.picoquant.comOptical imaging and spectroscopy softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect... <<Solder paste technologyAtomic layer deposition s...Advancements in LightField version 5.0, an upgrade of Princeton Instruments’ scientific imaging and spectroscopy software, include a math engine for analyzing 64-bit data in real time, an interactive virtual optical bench for managing multiple experiment setups, and automatic export of data in various formats. LightField supports the latest Princeton Instruments hardware, including IntelliCal spectral-calibration light sources. When paired with LightField’s automated point- by-point wavelength and intensity calibration, IntelliCal improves wavelength accuracy and NIST-traceable, instrument-independent intensity data by a factor of 10. For time-resolved imaging and spectroscopy applications, LightField provides users with an intuitive oscilloscope-like timing interface to PI-MAX4 ICCD cameras for easy synchronization and gating controls. Princeton Instruments, 3660 Quakerbridge Road, Trenton, NJ 08619, http://www.princetoninstruments.comSolder paste technologySection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technology <<Atomic layer deposition s...Indium Corporation offers its BiAgX solder paste as a drop-in replacement for the high-lead solders used in many high-reliability die-attach and electronics assembly applications. Made with the company’s high-melting solder paste technology, it can survive both high-temperature environments in excess of 175 °C with little degradation of the mechanical structure or other properties and J-STD-020 moisture sensitivity level reflow profiles up to 260 °C in the final solder joint. It does not contain lead, antimony, or specialty materials such as nanosilver or sintering aids. BiAgX reflows, solders, wets, and solidifies like any other solder paste. Available in both dispense and printing forms, it is suitable for small, low-voltage quad-flat no-lead packages used in portable electronics, automotive electronics, and industrial applications. Indium Corporation, 34 Robinson Road, Clinton, NY 13323, http://www.indium.comAtomic layer deposition systemSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s... <<The Savannah G2 atomic layer deposition (ALD) system from Ultratech Cambridge NanoTech incorporates advanced field-upgradable options that help researchers expand and characterize their portfolio of ALD films. One option is a low-vapor precursor delivery system that enables the growth of novel materials, including single- and multicomponent films from perovskite, yttrium, lithium, and the rare-earth families. Others include ellipsometry, quartz crystal microbalance, and mass spectrometry, which allow for the simultaneous growth of ALD films and the real-time characterization of the deposition process, important capabilities for thin-film R&D. Ultratech Cambridge NanoTech, 130 Turner Street, Building 2, Waltham, MA 02453, http://www.ultratech.com© 2015 American Institute of Physics.

We describe a prototyping process for silicon nitride photonic integrated circuits, targeting applications in the visible and near-infrared wavelength ranges. The platform is based on direct-write electron beam lithography technology and provides a route toward the rapid fabrication of passive and thermo-optic active photonic devices. The fabrication turnaround time is on the order of several weeks, and critical feature sizes are demonstrated down to 100 nm which enables the fabrication of subwavelength metastructures. Two waveguiding material thicknesses have been demonstrated, 150 nm for visible light applications and 400 nm for infrared.

A self-driving vehicle used to be found in science fiction but would promisingly and gradually become a reality in our daily life in the foreseeable future. Self-driving or autonomous vehicles can bring about disruptive changes to the current transportation system, commuting ways, the concept of vehicle ownership, risk management, legal liability, regulations, urban planning, etc. A highly/fully self-driving vehicle is one of the most complex man-made systems and involves various aspects of modern society. Nevertheless, the public seems to lack a clear enough understanding of self-driving vehicles. To further the development of self-driving technologies, it is necessary to develop a comprehensive understanding of multifaceted factors that could hinder the mass adoption of self-driving vehicles. Therefore, this paper intends to present an overview of some technical factors that could influence the advancement of self-driving vehicles. First, this paper reviews state-of-the-art architectures of a self-driving vehicle. Various sensor technologies are followed with a discussion of their limitations. As two essential software subsystems for realizing a self-driving vehicle, the perception and decision-making systems are presented with an overview of their major tasks and challenges. This paper is concluded with a summary of the technical challenges, being a helpful resource for engineers, the public, policy-makers, and social researchers.

Over the last several years, a significant advancement in high-voltage electronic packaging techniques has paved the way for next-generation power electronics. However, controlling the thermal properties of these new packaging solutions is still a major challenge. The utilization of wide bandgap semiconductors such as SiC and GaN offers effective methods to minimize thermal inefficiencies caused by conduction losses through high-frequency switching topologies. Nevertheless, the need for high voltage in electrical systems continues to pose significant barriers, as heat generation remains one of the most significant obstacles to widespread implementation. The trend of electronics design miniaturization has driven the development of high-performance cooling concepts to address the needs of high-power-density systems. As a result, the design of effective cooling systems has emerged as a crucial aspect for successful implementation, requiring seamless integration with electronic packaging to achieve optimal performance. This review article explores various thermal management approaches demonstrated in electronic systems. This paper aims to provide a comprehensive overview of heat transfer enhancement techniques employed in electronics thermal management, focusing on core concepts. The review categorizes these techniques into concepts based on fin design, microchannel cooling, jet impingement, phase change materials, nanofluids, and hybrid designs. Recent advancements in high-power density devices, alongside innovative cooling systems such as phase change materials and nanofluids, demonstrate potential for enhanced heat dissipation in power electronics. Improved designs in finned heat sinks, microchannel cooling, and jet impingement techniques have enabled more efficient thermal management in high-density power electronics. By fixing key insights into one reference, this review serves as a valuable resource for researchers and engineers navigating the complex landscape of high-performance cooling for modern electronic systems.

Reconfigurable computing (RC) is rapidly emerging as a promising technology for the future of high-performance and embedded computing, enabling systems with the computational density and power of custom-logic hardware and the versatility of software-driven hardware in an optimal mix. Novel methods for rapid virtual prototyping, performance prediction, and evaluation are of critical importance in the engineering of complex reconfigurable systems and applications. These techniques can yield insightful tradeoff analyses while saving valuable time and resources for researchers and engineers alike. The research described herein provides a methodology for mapping arbitrary applications to targeted reconfigurable platforms in a simulation environment called RCSE. By splitting the process into two domains, the application and simulation domains, characterization of each element can occur independently and in parallel, leading to fast and accurate performance prediction results for large and complex systems. This article presents the design of a novel framework for system-level simulative performance prediction of RC systems and applications. The article also presents a set of case studies analyzing two applications, Hyperspectral Imaging (HSI) and Molecular Dynamics (MD), across three disparate RC platforms within the simulation framework. The validation results using each of these applications and systems show that our framework can quickly obtain performance prediction results with reasonable accuracy on a variety of platforms. Finally, a set of simulative case studies are presented to illustrate the various capabilities of the framework to quickly obtain a wide range of performance prediction results and power consumption estimates.

The present study numerically investigates the effects of a magnetic field on mixed convection flow and entropy generation within a double lid‐driven square cavity filled with a hybrid nanofluid. The flow is induced by two isothermally heated semi‐circles located on the bottom and left walls of the cavity. The cavity is filled with a ternary composition of hybrid nanofluid (aluminum oxide/silver/copper oxide‐water) and is exposed to a uniform magnetic field. The velocity ratio of the moving lids and the radius ratio of the semi‐circles are key parameters in the analysis. The study employs the finite volume method and full multigrid acceleration to solve the coupled continuity, momentum, energy, and entropy generation equations, along with the relevant boundary conditions. Key dimensionless parameters considered include the Hartmann number (0 ≤ Ha ≤ 100), Richardson number (0.01 ≤ Ri ≤ 1), hybrid nanofluid volume fraction (3% ≤ ϕ ≤ 12%), internal semi‐circle radius ratio (β = 0.5 and 1), and velocity ratio (−2 ≤ λ ≤ 2). Results revealed that the optimal heat transfer is achieved for Ri = 0.04, Ha = 100, ϕ = 0%, β = 1, and λ = 0.5 with 63% enhancement. Moreover, the maximum entropy generation rates are obtained for the same parameters with a rate of 47%, reflecting the complex balance of enhanced heat transfer and associated irreversibility's. Results reveal also that heat transfer and entropy generation are a decreasing function of Hartmann number implying a suppress of fluid motion due to the Lorentz force. This study provides a valuable resource and parametric analysis for researchers and engineers, aiding in the design and optimization of thermal management systems for various industrial applications, including heat exchangers, nuclear reactors, and energy systems.

This special edition presents a collection of contemporary research results across key areas of materials science, with a focus on structural metals, bio-based polymers, functional materials for sensing and photovoltaics, and catalytic materials and processes. The edition is intended to serve as a valuable resource for researchers, engineers, and students seeking insight into innovative approaches to materials development, sustainable technologies, and their functional applications across diverse fields.

Photolithography is one of the core technologies of micro-nano fabrication. Recently, lithography technology is applied to diverse field of technologies. These technologies include MEMS (micro electro mechanical system) devices, FPD (flat panel display), and semiconductor industry. When it comes to the typical exposure process of lithography technology, photomask costs is occupying large portion of the optical system. So, how to reduce the cost of the mask and employing maskless lithography technology has become an important issue to engineers. Although there being both advantages and disadvantages, maskless lithography is a receiving substantial attention from engineers in the fileds of micro-nano fabrication. With the development of technology, low cost, flexibility, efficiency in the fabrication of device are in high demand in maskless lithography technology. How to generate line/space patterns is gaining considerable attention in terms of maskless lithography exposure process. In order to achieve the accurate alignments of numerous optical heads within a reasonable amount of tack time, installing autonomous position align micro parallel manipulator system in each optical heads required. Applied parallel manipulator that consists of four 2-DOF (degree of freedom) decoupled actuator gives chances to provide 6-DOF independence motion, and has strength in high accuracy. It is thus, this parallel manipulator is suitable for the experiment. This paper covers the follows: First, we reported the DMD (Digital Micro mirror Device)-based makless lithography system to introduce spot array method in maskless digital exposure process. Second, applying a redundant parallel micro manipulator and analyzing kinematic characteristic of the 4-[PP]PS parallel manipulator is described. After that, comparing benefits and drawbacks of 4-[PP]PS parallel and 4-DOF serial manipulator is covered. Third, proposing a suitable error model of the system and applying the genetic algorithm to alignment spot array concerning position correction. Finally, we designed experiment which has vision sensor and align unit to verify positioning algorithm. Simulation and experimental result will be shown with the regard to parallel manipulator can find the optimal solution based on genetic algorithm and carry out the problem of spot array alignment by reducing the position error of the system.