The ACM Symposium on Solid and Physical Modeling and Applications is an annual international forum for the exchange of recent research results and applications of spatial modeling and computations in design, analysis and manufacturing, as well as in emerging biomedical, geophysical and other areas. Previous symposia in this series were held in Austin, Texas, 1991; Montreal, Canada, 1993; Salt Lake City, Utah, 1995; Atlanta, Georgia, 1997; Ann Arbor, Michigan in 1999 and 2001; Saarbrucken, Germany, 2002; and Seattle, Washington, 2003, and Genova, Italy, 2004. For additional information, visit www.solidmodeling.org, the home page of the Solid Modeling Association that oversees this symposia series.Since its inception in 1991, the ACM Symposium on Solid Modeling and Applications has been the primary venue for disseminating research results in the design, representation, analysis, visualization, and use of digital models of real or planned solid objects and of their bounding surfaces. At the same time, modeling solids entails not only handling their geometric shape, but also their physical properties and behaviors. To emphasize this broader mission, we have expanded the name of the 2005 Symposium to Solid and Physical Modeling (abbreviated SPM). SPM-05 was held on the MIT campus, in Cambridge, Massachusetts, in plenary sessions (no parallel tracks) from Monday June 13 to Wednesday June 15, and was followed by the <u>Shape Modeling International</u> (SMI) conference. Both SPM and SMI events are part of the <u>2005 Joint Convention on Solids and Shapes</u>, (S&S'05) hosted at MIT and chaired by Nick Patrikalakis. The <u>2004 Joint Convention on Shapes and Solids</u> took place in Genoa Italy.Some sixty technical papers have been submitted and were reviewed by the international program committee and expert reviewers from around the world. At least three to four external reviewers and members of the program committee reviewed and discussed each submission. A total of 22 refereed papers have been selected for plenary presentation and full paper publication in the proceedings. In addition, 6 more papers have been selected as technical sketches for shorter publication and presentation at the conference. The symposium program also includes two keynote presentations invited from leading authorities in their fields: Bruce Donald and James O'Brien. Another new feature in the symposium program was that we had three panel session where recent trends and challenges are discussed. The panel sessions were organized by Dimitris Metaxas (Biomedical Modeling), Michael Wang (Physical Modeling and Simulation), and Jan Vandenbrande (Design, Analysis, and Manufacturing).
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