State-reuse Test Generation for Progressive Random Access Scan: Solution to Test Power, Application Time and Data Size

Integrated circuit (IC) chip designs relying on Random Access Scan (RAS) architecture for post-production structural tests typically provide lower test power dissipation, test data volume, and test application time comparedto the classical serial scan-based Design for Test (DFT) methodology. However, previous RAS schemes incur high signal routing and test area overheads relative to the serial scan way. Unlike serial scan schemes, previous RAS schemes have not been effectively combined with test compression to further reduce test application time and test data volume. Authors have already formally documented a locally addressed (segmented) and compressed Segmented RAS (SRAS) architecture with low area overhead and test application time. This paper describes the SRAS architecture in more detail and provides comparative experimental results. Area overhead is reduced using test access hierarchy (segmented), while adding compression to RAS lowers the test application time.

Scan design, providing a good test solution to sequential circuits, suffers large data volume, long test time and high test power problem. Recently, the random access scan (RAS) scheme offers a solution to alleviate the above problems (Baik et al., 2004). In this paper, based on RAS, a cocktail scan scheme is proposed and demonstrated to improve the test efficiency significantly. The scheme adopts a two-phase approach, firstly by using a cycle random scan test with a few random seed patterns to test the DUT and secondly, by using the RAS mechanism to test the circuit. Due to employment of a revised process and several strategies, namely, test response abundant, constrained static compaction, and bit propagation before test vector dropping, it is very effective in reducing bit flipping and test data volume, consequently, the test application time and power. Experimental results show that the scheme can achieve 86% reduction in test data volume and 10 times of speedup in test application time.

A test pattern compression scheme for test data volume and application time reduction is proposed. While compression reduces test data volume, the increased number of internal scan chains due to an on-chip, fixed-rate decompressor reduces test application time proportionately. Through on-chip decompression, both the number of virtual scan chains visible to the ATE and the functionality of the ATE are retained intact. Complete fault coverage is guaranteed by constructing the decompression hardware deterministically through analysis of the test pattern set.

Random Access Scan, which addresses individual flip-flops in a design using a memory array like row and column decoder architecture, has recently attracted widespread attention, due to its potential for lower test application time, test data volume and test power dissipation when compared to traditional Serial Scan. This is because typically only a very limited number of random care bits in a test response need be modified to create the next test vector. Unlike traditional scan, most flip-flops need not be updated. Test application efficiency can be further improved by organizing the access by word instead of by bit. In this paper we present a new decoder structure that takes advantage of basis vectors and linear algebra to further significantly optimize test application in RAS by performing the write operations on multiple bits consecutively. Simulations performed on benchmark circuits show an average of 2–3 times speed up in test write time compared to conventional RAS.

Testing chips is very critical to guarantee chips are fault-free before they are integrated in a system, so as to increase the reliability of the system. Although full-scan is a widely adopted design-for-test technique for LSI design and testing, the need for reducing the test data volume, scan-in power dissipation and test application time (VPT) of the full-scan designed chip is imperative. Based on the analysis of the characteristics of the variable-to-fixed run-length coding technique and the random access scan architecture, this paper presents a novel design scheme tackling all VPT issues simultaneously. Experimental results on ISCAS'89 benchmarks have shown on average 51.2%, 99.5%, 99.3% and 85.5% reduction in test data volume, average scan-in power dissipation, peak scan-in power dissipation and test application time, respectively.

In this paper, we propose a method of test compression for multiple scan designs. Instead of the conventional serial scan chains, the proposed method constructs scan trees in which scan flip-flops are placed and routed in a tree structure. Inputs of the scan trees drive several scan trees of different lengths (height). Since test data volume and test application time are dominated by the scan tree with the maximum height among the constructed scan trees, the proposed method distributes the scan flip-flops to the scan trees so as to minimize the maximum height of the scan trees. In addition, the proposed method modifies the given test vectors to maximize the reduction in test application time. Experimental results for ISCAS-89 benchmark circuits show that the proposed method could reduce, on the average, test data volume by 77% compared with the conventional multiple scan design. The scan tree construction enlarges the number of scan outputs required. However test data volume could be reduced by 66% even if the number of scan outputs is limited.

Conventional random access scan (RAS) designs, although economic in test power dissipation, test application time and test data volume, are expensive in area and routing overhead. In this paper, we present a localized RAS architecture (LRAS) to address this issue. A novel scan cell structure, which has fewer transistors than the multiplexer-type scan cell, is proposed to eliminate the global test enable signal and to localize the row enable and the column enable signals. Experimental results on ISCAS'89 and ITC'99 benchmark circuits demonstrate that LRAS has 54% less area overhead than multiplexer-type scan chain based designs, while significantly outperforms the state-of-the-art RAS scheme in routing overhead.

We present a test resource partitioning (TRP) technique that simultaneously reduces test data volume, test application time and scan power The proposed approach is based on the use of alternating run-length codes for test data compression. Experimental results for the larger ISCAS-89 benchmarks and an IBM production circuit show that reduced test data volume, test application time and low power scan testing can indeed be achieved in all cases.

Test access mechanism (TAM) optimization and test data compression lead to a reduction in test data volume and testing time for SOCs. In this paper, we integrate for the first time both these approaches into a single test methodology. We show, how an integrated test architecture based on TAMs and test data decoders can be designed. The proposed approach offers considerable savings in test resource requirements. Two case studies using the integrated test architecture are presented. Experimental results on rest data volume reduction, savings in test application time and the low test pin overheads for a benchmark SOC demonstrate the effectiveness of this approach.

Today, VLSI design has progressed to a stage where it needs to incorporate methods of testing circuits. The Automatic Test Pattern Generation (ATPG) is a very attractive method and feasible on almost any combinational and sequential circuit. Currently available automatic test pattern generators (ATPGs) generate test sets that may be excessively long. Because a cost of testing depends on the test length, compaction techniques have been used to reduce that length. The motivation for studying test compaction is twofold. Firstly, by reducing the test sequence length, the memory requirements during the test application and the test application time are reduced. Secondly, the extent of test compaction possible for deterministic test sequences indicates that test pattern generators spend a significant amount of time generating test vectors that are not necessary. The compacted test sequences provide a target for more efficient deterministic test generators. Two types of compaction techniques exist: dynamic and static. The dynamic test sequence compaction performs compaction concurrently with the test generation process and often requires modification of the test generator. The static test sequence compaction is done in a post-processing step to the test generation and is independent of the test generation algorithm and process. In the thesis, a new idea for static compaction of test sequences for synchronous sequential circuits has been proposed. Our new method - SUSEM (Set Up Sequence Elimination Method) uses the circuit state information to eliminate some setup sequences for the target faults and consequently reduce the test sequence length. The technique has been used for the test sequences generated by HITEC test generator. ISCAS89 benchmark circuits were used in our experiments, for some circuits which have a large number of target faults and relatively small number of flip-flops, the very significant compactions have been obtained. The more important is that this method can be used to improve the test generation procedure unlike most static compaction methods which blindly or randomly remove parts of test vectors and cannot be used to improve the test generators.

There is mounting evidence that automatic test pattern generation tools capable of producing tests with high coverage of defects occurring in the large semiconductor nanometer designs unprecedentedly inflate test sets and test application times. A design-for-test technique presented in this paper aims at reducing deterministic pattern counts and test data volume through the insertion of conflict-aware test points. This methodology identifies and resolves conflicts across internal signals allowing test generation to increase the number of faults targeted by a single pattern. This is complemented by a method to minimize silicon area needed to implement conflict-aware test points. The proposed approach takes advantage of the conflict analysis and reuses functional flip-flops as drivers of control points. Experimental results on industrial designs with on-chip test compression demonstrate that the proposed test points are effective in achieving, on average, an additional factor of $2\times $ – $4\times $ compression for stuck-at and transition patterns over the best up-to-date results provided by the embedded deterministic test (EDT)-based regular compression.

Test data compression (TDC) is a promising low-cost methodology for System-on-a-Chip (SOC) test. This is due to the fact that it can reduce not only the volume of test data but also the bandwidth requirements. In this paper we provide a quantitative analysis of two distinctive TDC methods from the system integrator's standpoint considering a core based SOC environment. The proposed analysis addresses four parameters: compression ratio, test application time, area overhead and power dissipation. Based on our analysis, some future research directions are given which can lead to an easier integration of TDC in the SOC design flow and to further improve the four parameters.

In this paper, we propose a new test data compression method for reducing test data volume and test application time. The proposed method consists of two steps: scan chain compaction and dictionary-based compression scheme. The scan chain compaction provides a minimum scan chain depth by using compaction of the compatible scan cells in the scan chain. The compacted scan chain is partitioned to the multiple internal scan chains for using the fixed-length index dictionary-based compression scheme that provides the high compression ratio and the fast testing time. The proposed compression method delivers compressed patterns from the ATE to the chip and drives a large number of multiple internal scan chains using only a single ATE input and output. Experimental results for the ISCAS-89 test benches show that the test data volume and testing time for the proposed method are less than previous compression schemes.

This paper presents a novel test pattern generation flow to detect stuck-at and transition faults simultaneously. Both fault models are transformed into a unified fault model for a proposed 2-time-frame circuit model. This makes it possible to generate patterns for both types of faults in one ATPG run with no need to modify the ATPG tool. A highly compact pattern set can thus be obtained which requires less test data volume and shorter test application time without degrading the fault coverage for either type of faults. Experimental results show that, compared to the conventional methods, the proposed method can reduce the total test pattern counts by up to 12.27% and 15.54% and test application times up to 12.06% and 15.58% for ISCAS'89 and ITC'99 circuits, respectively.

Recently design for manufacturability (DFM) has been required to achieve higher process yield. Information obtained from silicon by testing and/or fault analysis is sometimes fed back for redesign of VLSI circuits. In this paper we propose a method to maximize defect coverage of a test set initially generated for stuck-at faults in a full scan sequential circuit by using feed back information from fault analysis. If a test set for more complex faults than stuck-at faults is generated, higher defect coverage would be obtained. Such a test set, however, would have a large number of test vectors, and hence the test costs would go up. The proposed method improves defect coverage of the test set by not adding new test vectors but modifying test vectors with the information obtained from fault analysis. Therefore there are no negative impacts on test data volume and test application time. The initial fault coverage for stuck-at faults of the test set is guaranteed with modified test vectors. In this paper we focus on detecting as many as possible non-feedback AND/OR-type bridging faults. Experimental results show that the proposed method significantly decreases the number of non-feedback AND/OR-type bridging faults undetected by a test set generated for stuck-at faults.