The economics of component parts selection

This paper had its origin in consideration of the work reported on by D. M. Boodman [Boodman, D. M. 1953. The reliability of airborne radar equipment. Jour. Op. Res. Soc. America 1 (February) 39–45.]. The purpose is to examine some of the implications arising from the assumption that a piece of complex equipment fails when, and only when, one of its component parts fails. The equipment is assumed made up of many individual parts, each of which is liable to prime failure independent of all other parts. Two different initial conditions are assumed at the beginning of observation or operation: (a) all components are new; (b) the equipment has been operating for a long time, components that have failed having been replaced by new ones at the time of failure. We consider the probability of failure of the equipment as a function of time and of the survival curve of individual components, and the possible improvement of reliability of equipment by replacement of components at a given age. Operations Research, ISSN 0030-364X, was published as Journal of the Operations Research Society of America from 1952 to 1955 under ISSN 0096-3984.

У статті представлені результати аналізу питання забезпечення післяремонтної надійності військової авіаційної техніки при налагодженні виготовлення комплектуючих деталей (запасних частин, агрегатів) вітчизняними підприємствами у процесі імпортозаміщення та наведені рекомендації щодо мінімізації ризиків імпортозаміщення процесів заводського ремонту в умовах особливого періоду. Рекомендації стосуються державної політики у сфері оборони, законодавчої бази на технічну документацію підприємств, заходів щодо матеріалознавства та технології виробництв, врахування залежності рівня надійності від конструктивно-схемних рішень.

Temperature is widely viewed as a major influence on failures of electronic equipment. Failure Prediction Methodology (FPM), such as MIL-HDBK-217 is an often quoted reference describing the temperature influence, often depicted as being exponential in effect, affecting wide classes of electronic component parts. The FPM concept of a constant failure rate that is accelerated by various environmental influences is widely applied beyond its validity. Misapplications of the reliability models in current use may cause failure avoidance efforts such as temperature reduction and parts quality selections not to yield anticipated overall results. The cost and complexity effects can be significant: temperature reduction, for example, can result in expensive system implementations in some cases whose costs and complexities may exceed the anticipated benefits in reliability. Due to industry wide continuing improvements in component quality over the years, the continuing quest for electronics reliability should change emphasis from attention to electronic parts to activities that address assembly and processes. This paper discusses the ways the temperature ingredient of reliability and similar concepts may be currently applied, with examples to illustrate disparities between anticipations and realizations. Alternate approaches are offered and their possible implementations are discussed.