- Book Chapter
7
- 10.1007/978-3-540-79056-3_9
Non-Linear Thermal Stresses in Adhesive Joints
- Jan 01, 2008
- Mustafa Kemal K Apalak
Adhesive joints serve under thermal loads as well as structural loads. The different thermo-mechanical properties of the adhesive and adherend materials cause incompatible thermal strains along the adhesive and adherend interfaces. Consequently, nonuniform thermal stress distributions are observed in the adhesive joints. In case the adhesive joints are constrained, these thermal stresses become more evident even for a uniform temperature distribution. In practice the adhesive joints interact with fluids (air) with different temperature and velocity and experience conductive and convective heat transfers. The variable thermal boundary conditions introduce a new non-linearity in addition to the geometrical and material non-linearities which are observed in adhesive joints. The transient temperature distributions can be obtained by solving the energy equation under the thermal boundary conditions. The corresponding thermal strain and stress distributions can be calculated using the transient temperature distributions. The large displacement and rotations occurring in adhesive joints require the implementation of the small strain-large displacement theory to the elastic stress analysis. This study introduces a simple method for calculating the heat transfer coefficients between the fluid and adhesive joints and explains the implementation of the finite element method to the thermal analysis and the geometrical nonlinear stress analysis. The thermal stresses in the metal-metal adhesive single lap, tubular, metal-metal and composite tee joints were analysed for the variable thermal and specified structural boundary conditions. The variable thermal boundary conditions cause non-uniform temperature distributions through the adhesive lap joints; consequently, non-uniform thermal strain and stress distributions occur. The adherend and adhesive regions in the neighborhood of the adhesive-adherend interfaces were subjected to high stress concentrations.
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