Thermal Interface Material Validation Framework for Large-Scale Chip Packages

Abstract

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With the continuous advancements in semiconductor technology, the power consumption and heat flux density of chips have increased significantly, creating an ever-growing demand for more efficient thermal management solutions. The heat dissipation pathway of a chip begins at the chip itself (junction-to-case), then flows through the thermal interface material (TIM) to the thermal cooling solution, and is further dissipated into the surrounding environment or other devices. The TIM acts as a critical bridge between the chip and the thermal solution. If its performance is under expectation, even the most effective thermal solution will fail to achieve its maximum potential.