• Home
  • Search
  • Upstream Electrohydrodynamic Conduction Pumping for Flow Distribution Control of Parallel Microchannel Evaporators
  • Cite Icon2
  • https://doi.org/10.1115/1.4064442Copy DOI Icon

Upstream Electrohydrodynamic Conduction Pumping for Flow Distribution Control of Parallel Microchannel Evaporators

Show More
  • Abstract
  • Literature Map
  • References
  • Citations
  • Similar Papers
Abstract

Abstract Flow boiling in mini and microchannels has become an attractive option for many applications, such as compact and low charge heat exchangers. Microchannel heat exchangers, however, are more susceptible to maldistribution between parallel flow channels. When operating during uneven heat load conditions, the maldistribution becomes even more severe. Electrohydrodynamic (EHD) conduction pumping technology offers an innovative way to redistribute flow between parallel branches in a microchannel heat exchanger and is also being explored as a next generation mechanism of microgravity heat transport. In EHD conduction pumping, a strong electric field interacts with dissociated electrolytes in dielectric fluid to generate a net body force, and thus, a net flow, with no moving parts, no acoustical noise, lower power consumption, and the ability to operate in microgravity. An EHD conduction pump was designed, fabricated, and tested for upstream flow distribution control of a parallel microchannel evaporator in an opposing configuration. Flow redistribution capability was measured at system flowrates up to 6 ml/min. The EHD conduction pump was capable of completely blocking and reversing the flow in its branch. Recovery from near critical heat flux conditions up to a maximum heat flux of 77.5 W/cm2 was also demonstrated for the operating conditions and design of this study. This was achieved in the absence of enhanced surfaces. The working fluid is HFE 7100. The results show that EHD conduction is able to effectively control the flow distribution of the microchannel evaporator, however, its effectiveness decreases with increasing heat flux and flowrate.

Similar Papers
  • Research Article
  • Citations13

Thermal boundary layer depletion in minichannels by electrohydrodynamic conduction pumping

  • May 12, 2023
  • Applied Thermal Engineering
  • R Deepak Selvakumar +1
  • Conference Article
  • Citations11

Performance Enhancement of a Monogroove Heat Pipe With Electrohydrodynamic Conduction Pumping

  • Jan 01, 2002
  • S I Jeong +1
  • Conference Article
  • Citations3

Recent experimental advances in electrohydrodynamic conduction pumping research

  • Oct 01, 2014
  • Viral K Patel +1
  • Conference Article
  • Citations3

Experimental Study of a Two-Phase Heat Transport Device Driven by Electrohydrodynamic Conduction Pumping

  • Jan 01, 2008
  • Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C
  • Matthew R Pearson +1
  • Research Article
  • Citations5

Effect of electrode arrangement on heat transfer enhancement by electrohydrodynamic conduction pumps in a rectangular channel

  • Nov 08, 2024
  • Applied Thermal Engineering
  • Yi-Bo Wang +8
  • Research Article
  • Citations16

Electrohydrodynamic Conduction Pumping-Driven Liquid Film Flow Boiling on Bare and Nanofiber-Enhanced Surfaces

  • Dec 29, 2015
  • Journal of Heat Transfer
  • Viral K Patel +4
  • Research Article
  • Citations20

Heat transfer enhancement of backstep flow by means of EHD conduction pumping

  • Mar 21, 2014
  • International Journal of Heat and Mass Transfer
  • Miad Yazdani +1
  • Conference Article
  • Citations7

Combined Electrohydrodynamic Conduction Pumping and Dielectrophoresis for Enhancement of Liquid Film Flow Boiling

  • Nov 13, 2015
  • Viral K Patel +1
  • Research Article
  • Citations24

Characteristics of electrohydrodynamic pump of the dissociation type: low and high voltage ranges

  • Oct 01, 2015
  • IEEE Transactions on Dielectrics and Electrical Insulation
  • V A Chirkov +2
  • Research Article
  • Citations26

Combined Dielectrophoretic and Electrohydrodynamic Conduction Pumping for Enhancement of Liquid Film Flow Boiling

  • Feb 28, 2017
  • Journal of Heat Transfer
  • Viral K Patel +1
  • Research Article
  • Citations6

Dielectrophoretically-Assisted Electrohydrodynamic-Driven Liquid Film Flow Boiling in the Presence and Absence of Gravity

  • Dec 09, 2022
  • ASME Journal of Heat and Mass Transfer
  • Alexander J Castaneda +5
  • Research Article
  • Citations104

Experimental study of electrohydrodynamic pumping through conduction phenomenon

  • Apr 19, 2002
  • Journal of Electrostatics
  • Seong-Il Jeong +1
  • Conference Article
  • Citations1

Investigation of Gravity Effects on Electrically Driven Liquid Film Flow Boiling: A Micro-Gravity Flight Campaign in Preparation of ISS Experiment

  • Nov 16, 2020
  • Alexander J Castaneda +2
  • Research Article
  • Citations1

Thermal performance of a two-pass microchannel evaporator

  • Jul 23, 2024
  • International Journal of Thermal Sciences
  • Jingwei Han +4
  • Research Article
  • Citations229

Flow Boiling Instabilities in Microchannels and Means for Mitigation by Reentrant Cavities

  • May 16, 2008
  • Journal of Heat Transfer
  • C.-J Kuo +1
Cactus Communications logo

Copyright 2026 Cactus Communications. All rights reserved.