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Use of refrigerator-cooled cryopumps in sputtering plants

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Abstract

The sputtering process is one of the modern techniques for production of thin films as they are used in the technology of semiconductors, in processing of surfaces, etc. This process demands a high vacuum pump of the following qualities: (1) Easy to handle, (2) Stable and repeatable process conditions, (3) High pumping speed for all gases, especially for water vapor, (4) Ability to achieve a high vacuum environment before process begins (5×10−7 mbar), (5) Usable for process pressure up to 2×10−2 mbar, (6) Rapid evacuating of the process chamber from the process pressure down to a pressure 5×10−7 mbar after process is finished. Modern refrigerator-cooled cryopumps meet the requirements 1 to 4 without problems. Therefore the report especially deals with the 5th and 6th topics. Here special modifications are necessary compared to common cryopumps. There are two possibilities to cover the demand of using the pump at high pressures: (1) Using a refrigerator with high cooling capacity, (2) Installing a throttling valve into the cryopump. Both are discussed. Concerning topic six pumpdown plots of well designed cryopumps are shown. The conditions of the process were simulated while both argon and mixture of argon and hydrogen were let into a chamber. During the sputtering process hydrogen is produced by the process itself.

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