Wafer dicing process optimization and characterization for C90 low-k wafer technology

Zero defect in semiconductor packaging is key especially for high demanding reliability applications (automotive, spatial...) combined with high performance technologies (Silicon ultra lowK wafers 40nm and beyond). The most complex challenge is the Chip Package Interconnect which requires an optimized and controlled singulation process to prevent weaknesses occurring during the process (ILD crack/ delamination, side wall crack, metal burrs, humidity propagation and die strength weakness). Laser grooving prior mechanical dicing offers a good seal ring protection of the chips, ie use of a laser to perform ablation and remove the sawing street contents (dielectric / metallization / patterns) in order to make a clean `path' for the mechanical sawing step afterward. Degradation of the blade condition is also reduced with this approach. This article describes the interactions between laser grooving process and the lLD BEOL delamination prevention by applying a perfect U shape profile.Laser Grooving process selection is a complex combination of different requirements: (i) U shape profile geometry tradeoff to guarantee integrity of BEOL layers during mechanical dicing, while keeping a high level of miniaturization of the sawing street not to increase wafer cost. (ii) Laser technology and process to match the required U-shape geometry minimizing redeposition of residues (recast), avoid pitting (voids) and absorb the heterogenous content of a scribe line with a minimum level of energy applied. This is achieved thanks to an accurate selection of the laser source (wavelength, beam size), accuracy of the beam position (lens optical system), ablation method (multi pass) and process parameter optimization (power, speed, frequency...). (iii) Advanced characterization technics are required to ensure the required quality criteria are matched, like 3D profilometer, FIB cross sections, SEM controls, AOI and 3 points die strength.STMicroelectronics is deploying this quality driven mindset to high volume manufacturing environment in all BE manufacturing plants. Emerging technologies like ultrafast laser wavelength or replacement of mechanical dicing by plasma dicing are next steps of interest further enhanced the robustness of more and more fragile wafer FE technologies.

An overview and emerging challenges in mechanical dicing of silicon (Si) wafer are discussed from view point of narrow kerf, thin wafer, chip strength enhancement, Copper (Cu)/low-k wafers and dicing challenges for emerging technologies.

The low-k dielectric materials in wafer fabrication are widely used. The current advanced mechanical dicing is not able to meet the requirement of low-k technology, since the low-k materials are harder and brittle. Laser dicing is developed for low-k wafer dicing. There are various laser dicing techniques in the market. Depending on the wafer thickness, laser dicing can either be a though cut or a partial cut process, which is commonly known as laser grooving. In this paper, the study work mainly focus on laser grooving and mechanical dicing process for Low-k wafer. The laser grooving used in this study is a 3-pass laser beam, and the laser grooving process setup is discussed. High power optical microscope, SEM, FIB and IR were the inspection tools used in this study. After laser grooving, the characterize of laser grooving, including the die edge quality, grooving geometry, die strength, mechanical dicing and reliability results are all investigated. The die was packaged into a 19×19mm 529IO MAPBGA package. Post assembly, CSAM and electrical test were performed on the assembled parts at T0, post MSL3/260degree C, post 264h UHST (110°C/85%RH), and post TC500cycles (-55°C to 125°C). With optimized parameter, a good dicing quality was get, without metal burr, metal remaining, micro cracks on side wall etc. The packaged sample had passed all stress. No laser grooving and mechanical dicing defect related fail. It is concluded that the 3-pass laser grooving is a good solution for low-k wafer dicing.

This paper describes the development work on single and multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in this study. The effects of single and multi beam laser micromachining parameters, i.e. laser power, laser frequency, feed speed, and defocus amount were investigated. The laser processed die samples were thoroughly inspected and characterized. This includes the die edge and die sidewall grooving quality, the grooving shape/profile and the laser grooving depth analysis. Die strength is important and critical. Die damage from thermal and ablation caused by the laser around the die peripheral weakens the mechanical strength within the die, causing a reduction in die strength. The strength of a laser grooved die was improved by optimizing the laser process parameter. High power optical microscopy, Scanning Electron Microscopy (SEM), and focused ion beam (FIB) were the inspection tools/methods used in this study. Package reliability and stressing were carried out to confirm the robustness of the multi beam laser grooving process parameter and condition in a mass production environment. The dicing defects caused by the laser were validated by failure analysis. The advantages and limitations of conventional single beam compared to multi beam laser grooving process were also discussed. It was concluded that, multi beam laser grooving is possibly one of the best solutions to consider for dicing quality and throughput improvements for low-k/ULK wafer dicing. The multi beam laser process is a feasible, efficient, and cost effective process compared to the conventional single beam laser ablation process.

This paper describes the development work of enabling a multi beam laser grooving technology for 40nm node low-k/ULK semiconductor device. A Nd:YAG ultraviolet (UV) laser diode operating at a wavelength of 355 nm was used in the study. The effects of multi beam laser micromachining parameters, i.e. laser power, laser frequency, feed speed, and defocus amount were investigated. The laser processed die samples were thoroughly inspected and characterized, which included the die edge and die sidewall grooving quality, the grooving shape/profile and the laser grooving depth examination. Die strength is important and critical. Die damage from thermal and ablation caused by the laser around the die peripheral weakens the mechanical strength within the die, causing a reduction in die strength. The strength of a laser grooved die was improved by optimizing the laser process parameter. High power optical microscopy, scanning electron microscopy (SEM), and focused ion beam (FIB) are the inspection tools/methods used in this study. Package reliability and stressing were carried out to confirm the robustness of the multi beam laser grooving process parameter and condition in a mass production environment. The dicing defects caused by the laser were validated by using failure analysis. The advantages and limitations of conventional single beam compared to multi beam laser grooving process were also discussed. It is shown that, multi beam laser grooving is possibly one of the best solutions to choose for dicing quality and throughput improvements for low-k/ULK wafer dicing. The multi beam laser process is a feasible, efficient, and cost effective process compared to the conventional single beam laser ablation process.

Objective This work aims to present a Quality-by-Design (QbD) step-by-step methodology to formulate anti-ulcer and gastro-protective oral suspensions. Methods Sucralfate was used as a drug model. The Quality Target Product Profile was established early during preformulation. Viscosity, resuspendability, pH, and density were assessed through the screening of several suspension platforms based on different prototype compositions. A compatibility study between the active pharmaceutical ingredient and the excipients was performed by thermal analysis and infrared spectroscopy. An Ishikawa fishbone diagram and Failure Mode and Effect Analysis were employed to identify the Critical Material Attributes (CMAs), Critical Process Parameters (CPPs), and Critical Quality Attributes (CQAs). CMAs’ and CPPs’ impact on identified CQAs was further assessed through a 22 full factorial experimental design at normal conditions after manufacture and one month at super-accelerated stress conditions. Results: The lead prototype exhibited no physicochemical incompatibilities. The risk assessment tools revealed that the concentration of the wetting agent and the total concentration of thickening agents represented critical factors for the quality profile of the preparation in terms of viscosity. The optimized formulation comprising 1.125 w/v% total concentration of Natrosol 250 HX and Avicel RC 591 exhibited an enhanced performance according to the established profile. Conclusions The analytical and physicochemical tests showed the robustness and compliance of the final preparation with the quality profile. The proposed step-by-step methodology based on QbD, Design of Experiments, and Quality Risk Management presented in our research holds practical implications for local industries and formulation scientists involved in the development of oral suspensions.

Extract Extended abstract of a paper presented at Microscopy and Microanalysis 2007 in Ft. Lauderdale, Florida, USA, August 5 – August 9, 2007

The demand to accelerate monoclonal antibody (mAbs) process development timelines using Chinese hamster ovary (CHO) host cells to bring therapies to patients sooner is gaining momentum. The applicability of single use high-throughput (HTP) bioreactor system such as Ambr®250 facilitating precise and automated control is very promising. This entails optimizing process parameters through design of experiments (DoE) using less resources and time, compared to traditionally employed large-scale bench top reactors (2-5L). It is imperative to improve mAb productivity through robust process development to mitigate current manufacturing challenges. In this study, a systematic mapping approach was employed to identify critical process parameters(CPP) and improve process efficacy. A central composite design (CCD) was used in Ambr®250 bioreactors to investigate the impact of initial seeding density (SD) and feeding rate (FR) on mAb production. Variance in the SD and FR impacted the cell performance and mAb titer profile based on which parameter optimization was done using response surface methodology. Significant impact of FR and SD was identified leading to improved mAb titer. Bioreactors operated at SD > 1 × 106 cells/mL and FR of > 2% Vc/day were more productive, and respective optimal FR and SD were estimated at 2.68% Vc/day and 1.1 × 106 cells/mL. Cell viability and productivity were well-maintained at optimal conditions allowing extended cultivation time to reach higher mAb titer of up to 5g/L. These findings, which optimize the operating range of critical process parameters (CPPs) using the high-throughput Ambr® 250 scaled-down platform, provide a framework for accelerated early-phase process development and enable reliable scalability to commercial manufacturing. Improving productivity and providing robust estimates for manufacturing scale would significantly cut costs and reduce timelines for biologics development and facilitate patient access.

Various approaches have been applied to optimize biological product fermentation processes and define design space. In this article, we present a stepwise approach to optimize a Saccharomyces cerevisiae fermentation process through risk assessment analysis, statistical design of experiments (DoE), and multivariate Bayesian predictive approach. The critical process parameters (CPPs) were first identified through a risk assessment. The response surface for each attribute was modeled using the results from the DoE study with consideration given to interactions between CPPs. A multivariate Bayesian predictive approach was then used to identify the region of process operating conditions where all attributes met their specifications simultaneously. The model prediction was verified by twelve consistency runs where all batches achieved broth titer more than 1.53 g/L of broth and quality attributes within the expected ranges. The calculated probability was used to define the reliable operating region. To our knowledge, this is the first case study to implement the multivariate Bayesian predictive approach to the process optimization for the industrial application and its corresponding verification at two different production scales. This approach can be extended to other fermentation process optimizations and reliable operating region quantitation.

Optical fibers have been the basis of the modern information technology since Kao and Hockham proposed glass waveguides as a practical medium for communication in 1965. A lot of different optical fiber active/passive devices including couplers, interferometers, gratings, resonators and amplifiers have been widely employed for applications on telecommunications and sensing networks (Agrawal, 2002). For a number of applications, it is important to reduce the device’s size. Small size is often attractive for particular sensing applications because of some benefits such as fast response to detecting small objection with little perturbation on the object being measured. There are two steps to obtain fiber devices as small as possible. First, it is to taper or etch the fiber and reduce its diameter. A subwavelength-scale microfiber is the basic element of miniature fiber devices and subsystems (Tong et al., 2003; Brambilla et al., 2004, 2005, 2010). The second is to engineer the microfiber to realize miniature version of conventional fiber devices. There are various fabrication methods to engineer the microfiber, such as CO2 laser, femtosecond (fs) laser, HF acid etching, arc splicing and focused ion beam (FIB). Most of these techniques have the difficulties in carving the microfiber freely because of the resolution. The latest progress in FIB technique has opened a new widow for ultra-small size fiber devices. So far, FIB is the most flexible and powerful tool for patterning, cross-sectioning or functionalizing a subwavelength circular microfiber due to its small and controllable spot size and high beam current density. FIB systems have been produced commercially for approximately thirty years, primarily for large semiconductor manufacturers. FIB systems operate in a similar fashion to a scanning electron microscope (SEM) except, rather than a beam of electrons and as the name implies, FIB systems use a finely focused beam of ions that can be operated at low beam currents for imaging or high beam currents for site specific sputtering or milling (http://en.wikipedia.org/wiki/Focused_ion_beam). The fine and controllable ion spot size and high beam current density are perfect for microand nano-fabrications with high spatial resolution (~ 10 nm). As a result, FIB has recently become a popular candidate for fabricating high-quality micro-devices or high-precision microstructures. Originally, FIB processing was used for mask repair (Liang et al., 2000), integrated circuit chip repair/modification (Liu et al., 2006), cross-sectional imaging of critical parts of

The global energy landscape is undergoing a profound transformation, shifting from traditional fossil fuel-based systems to sustainable, renewable energy sources like wind, solar, bioenergy, hydroelectric, and tidal energy. This transition signifies a significant evolution in global energy generation and consumption patterns, necessitating advanced energy storage solutions to manage the intermittent nature of renewables and ensure a stable and reliable energy supply. Advanced energy storage technologies, including batteries, supercapacitors, and other innovative systems, play a pivotal role in this transition by enabling effective load balancing, supporting the electrification of transportation through electric vehicles and charging infrastructure, managing peak demand, and facilitating the seamless integration of renewable energy into the grid. This evolution not only advances sustainability goals but also enhances energy security and independence. [1]Advanced analytical techniques are essential for developing energy storage systems, especially batteries, by providing critical insights into their complex chemical and physical processes. Battery materials' microstructure, composition, and operational dynamics can be explored using analytical techniques like scanning electron microscopy (SEM), focused ion beam (FIB), transmission electron microscopy (TEM), X-ray diffraction (XRD), and spectroscopy. The detailed analysis through these techniques is crucial for optimizing material properties, enhancing energy density, improving safety, and extending battery lifespan. By identifying degradation mechanisms and optimizing electrode and electrolyte materials, these techniques contribute to precise battery engineering. As demand grows for more efficient and higher-capacity batteries, these sophisticated tools are indispensable for advancing energy storage technology. [2]At Shell Technology Center Houston, we have developed air-controlled and cryogenic electron microscopy (EM) workflows for studying advanced energy storage systems in preparation for the energy transition. The air-controlled EM workflow, employing SEM, FIB, TEM, and XRD, plays a pivotal role in battery research by providing a controlled environment that prevents exposure to atmospheric elements that could alter material properties. These techniques are essential for examining the fine structural details and chemical compositions of battery components under near-native conditions. The cryo-EM workflow using SEM, FIB, and TEM is vital in battery research for studying materials and interfaces sensitive to environmental conditions or rapid degradation upon exposure. These cryogenic techniques involve rapid freezing of battery components to preserve their structure in a close-to-native state and prevent deleterious effects of air exposure such as oxidation or moisture interaction. [3]In our study, we present comprehensive results obtained using both air-controlled EM and cryogenic EM workflows to investigate advanced energy storage systems, including lithium-ion batteries (LIBs) and beyond-LIBs such as multivalent rechargeable batteries. The utilization of air-controlled EM techniques such as SEM, FIB, TEM, and XRD allows us to examine battery components under controlled environmental conditions, ensuring accurate analysis of structural details and chemical compositions without the risk of atmospheric contamination. Additionally, the use of cryo-EM techniques, including cryo-SEM, cryo-FIB, and cryo-TEM, enables the study of sensitive battery materials and interfaces in a preserved, near-native state. These cryogenic methods prevent degradation effects such as oxidation and moisture interaction, providing unprecedented insights into the ultrastructural properties and operational dynamics of battery materials at atomic or molecular levels. By leveraging both air-controlled and cryogenic EM workflows, we have achieved a comprehensive understanding of battery mechanics and chemistry, paving the way for improved battery design and enhanced performance in energy storage applications.Reference[1] International Renewable Energy Agent (IRENA) 2021 https://www.irena.org/publications/2021/Aug/Renewable-energy-statistics-2021[2] Tarascon, J.-M., Armand, M., Nature 414, 359–367 (2001). https://doi.org/10.1038/35104644[3] Cheng, D., Lu, B., Raghavendran, G., Zhang, M., and Meng, Y. S., Matter, Volume 5, Issue 1, p26-42, 2022 https://doi.org/10.1016/j.matt.2021.11.019

Copper wire bonding in IC packages is not always suitable for devices with active circuit under bonding pad because higher bonding power required for copper wire bonding may cause top aluminum metal splash and mechanically impact the circuit underneath. Silver wire is an alternative solution to this problem based on its physical properties and lower cost compared to gold wire. Ag88%Au8.5%Pd2.5%X1% and Ag95%Au1.5%Pd2.5%X1% alloyed silver wires are used in the study to compare with copper and gold wires of 99.99% in purity. As bonding power plays a dominating role in wire bonding, we focused on the effects of silver, copper and gold bonding wires with different bonding power on the top aluminum metal splash of power device by Optical Microscope(OM) and Scanning Electron Microscope(SEM). The ball shear strength of the bonding wires with different bonding power in samples without mold compound encapsulation was investigated before and after 24, 48, 96 and 192 hours of pressure cooker test (PCT). The intermetallic compound (IMC) formed between silver and aluminum was confirmed by focus ion beam (FIB) and transmission electron microscope (TEM). Although the top surface of the silicon device shows no significant difference after aluminum layer removal for all three wire types, the severity level of vertical deformation and side splash of aluminum layer due to copper wire bonding is much more than silver or gold wire using same amount of bonding power. Ball shear strength of non-encapsulated silver wire decreases dramatically after PCT aging compared with copper wire or gold wire and some samples show zero shear strength after PCT 96 hours and PCT 192 hours for silver wires doped with Pd/Au. Furthermore, larger bonding power induces higher ball shear strength. The major IMC compositions between silver and aluminum are Ag3Al and Ag2Al. A thermo dynamic model was built to explain why silver wire is prone to corrosion compared with copper wire by humidity although copper is easier to be ionized than silver. No electrical test was performed as the samples cannot be tested without package encapsulation and singulation. Furthermore, silver wire samples in SO8 package with mold compound encapsulation were subjected to highly accelerated stress test (HAST), PCT, temperature cycle test (TCT) after MSL1 preconditioning test as well as high temperature operation life test (HTOL) according to JEDEC procedures. The encapsulated samples using either Ag 88wt% or Ag95wt% alloys all passed MSL1 and PCT/HAST/TCT/HTOL. Drain to source on-resistance (Rdson) of the device including package parasitics was measured and it has no significant difference between silver wire and gold wire. The results from this study shows promising data using silver alloy wires but care should be taken to further understand the degradation of silver-aluminum interface under severe humidity condition. Using other metallization on silicon top surface such as NiAu or CuAu can significantly alleviate the interface problem related to AgAl.

PurposeThe present study spotlights the single and multicriteria decision-making (MCDM) methods to determine the optimal machining conditions and the predictive modeling for surface roughness (Ra) and cutting tool flank wear (VB) while hard turning of AISI 4340 steel (35 HRC) under dry environment.Design/methodology/approachIn this study, Taguchi L16 design of experiments methodology was chosen. The experiments were performed under dry machining conditions using TiSiN-TiAlN nanolaminate PVD-coated cutting tool on which Taguchi and responses surface methodology (RSM) for single objective optimization and MCDM methods like the multi-objective optimization by ratio analysis (MOORA) were applied to attain optimal set of machining parameters. The predictive models for each response and multiresponse were developed using RSM-based regression analysis. S/N ratios, analysis of variance (ANOVA), Pareto diagram, Tukey's HSD test were carried out on experimental data for profound analysis.FindingsOptimal set of machining parameters were obtained as cutting speed: at 180 m/min., feed rate: 0.05 mm/rev., and depth of cut: 0.15 mm; cutting speed: 145 m/min., feed rate: 0.20 mm/rev. and depth of cut: 0.1 mm for Ra and VB, respectively. ANOVA showed feed rate (96.97%) and cutting speed (58.9%) are dominant factors for Ra and VB, respectively. A remarkable improvement observed in Ra (64.05%) and VB (69.94%) after conducting confirmation tests. The results obtained through the MOORA method showed the optimal set of machining parameters (cutting speed = 180 m/min, feed rate = 0.15 mm/rev and depth of cut = 0.25 mm) for minimizing the Ra and VB.Originality/valueThis work contributes to realistic application for manufacturing industries those dealing with AISI 4340 steel of 35 HRC. The research contribution of present work including the predictive models will provide some useful guidelines in the field of manufacturing, in particular, manufacturing of gear shafts for power transmission, turbine shafts, fasteners, etc.

This paper presents an investigation on the effect and optimization of machining parameters on the kerf (cutting width) and material removal rate (MRR) of titanium alloy (TI-6AL-4V) using wire electrical discharge machining WEDM with a brass wire diameter of 0.5mm. The experimental studies were conducted under varyingpulse-off time, peak current, wire feed and wire tension. The settings of machining parameters were determined by using Taguchi experimental design method. The multiple performance characteristics based on the statistical-based analysis of variance (ANOVA) and grey relational analysis (GRA) was attempted. Analysis of variance was used to study the significance of process parameters on grey relational grade (GRG) which showed the most significant factor. The GRG obtained from the GRA was used to optimize the WEDM process. The optimum process parameters are determined by the GRG as the overall performance index. To validate the findings, confirmation experiment had been carried out at the optimal set of parameters, and the predicted results were found to be in good agreements with experimental findings. Improved machining performance in the WEDM process has been achieved by using this approach.

The reliability of high-density interconnect (HDI) printed circuit boards (PCBs) is strongly influenced by the integrity of microvias, which serve as critical vertical interconnects between layers. Although microvias enable compact designs and improved electrical performance, they are prone to failures such as cracking, void formation, and delamination, particularly under thermal and mechanical stress. Traditional inspection methods provide only limited insight into these complex failure mechanisms. This paper highlights the application of advanced characterization techniques — including optical microscopy, X-ray imaging, electrical testing, scanning electron microscopy (SEM) with energy-dispersive spectroscopy (EDS) and electron backscatter diffraction (EBSD), focused ion beam (FIB) cross-sectioning, transmission electron microscopy (TEM) with electron energy-loss spectroscopy (EELS), and nano beam diffraction (NBD). Together, these methods provide complementary structural, chemical, and crystallographic information across multiple scales. Case studies demonstrate how these tools reveal defect origins, such as contamination and interfacial weakness, and link microstructural features to failure mechanisms. The integration of these techniques not only deepens scientific understanding but also provides manufacturers with actionable feedback to refine drilling, cleaning, and plating processes, thereby improving the reliability of next-generation HDI PCBs.