Abstract In this paper, we present our recent applications of scanning capacitance microscopy (SCM) on specific devices with sampling window as small as 100nm. The dopant related root causes were successfully identified on those devices fabricated with 90nm CMOS technology. The key step in our approach is the development of a sample preparation technique that allows us to precisely x-section through a transistor without being affected by focused ion beam (FIB) artifacts. FIB was used to mark the area of interest with high precision, but it did not expose the devices of interest. Optical microscope and atomic force microscope (AFM) were used to inspect the mechanically polished surface, thus avoiding beam effects from FIB or SEM. In the first application, a doping anomaly was identified in a PFET poly gate, in a single bit failed SRAM cell. In the second application, an asymmetry of a PWell implant profile in a window of 150nm was identified as the cause of leakage in a capacitor array. Our approach may be applied to other scanning probe microscopy (SPM) techniques in the same category, i.e., scanning spreading resistance microscopy (SSRM) or scanning microwave microscopy (SMM).
24Experimental observation of FIB induced lateral damage on silicon samples
Experimental observation of FIB induced lateral damage on silicon samples
23Drift mobility in quantum nanostructures by scanning probe microscopy
We used scanning capacitance microscopy (SCM) and scanning spreading resistance microscopy (SSRM) to determine the drift hole mobility in nanometer thick Si∕Si0.75Ge0.25∕Si quantum wells (QWs), from the carrier concentration profiles (obtained by SCM) and the local resistivity values (obtained by SSRM). A relevant decrease of the hole mobility at room temperature was observed when reducing the QW width from 10 nm down to 1 nm. This effect has been explained in terms of the increasing role of surface scattering at the Si∕SiGe interface for lower QW widths.
Read morePolarization in Wide Bandgap Semiconductors and their Characterization by Scanning Probe Microscopy
In this chapter, we discuss recent developments in the characterization of polarization doped wide bandgap semiconductor (WBS) heterojunctions with an emphasis on characterization by scanning probe microscopy (SPM). Wide bandgap semiconductors, such as SiC and GaN, have a wide variety of applications in electronic and optoelectronic devices [1–6]. The operation of devices made from these materials is dominated by the polarization properties of III-N and SiC semiconductor crystals. For example, polarization doped 2 dimensional electron gas (2DEG) channels in undoped GaN/AlGaN and SiC polytypic heterojunctions have been fabricated with current densites in excess of 1A/mm. Other effects, such as surface charge instability stemming from polarization, offer interesting potentials and challenges.While some of these effects may be studied using more conventional techniques such as currentvoltage (IV) and capacitance-voltage (CV) techniques (described in sections 2 and 3), others require probes capable of investigation on the nanometer scale. Transmission electron microscopy (TEM) can be used to investigate such polarizationinduced phenomena with atomic resolution, but involves destructive and laborious sample preparation. SPM techniques offer powerful, non-destructive tools to effectively and conveniently probe electronic materials and devices. Since the discovery of scanning tunneling microscopy (STM) in 1981 by Binnig and Rohrer [7], the field of SPM has advanced to encompass a large number of variations including, (i) STM, (ii) Atomic force microscopy (AFM), (iii) Electrostatic force microscopy (EFM), (iv) Scanning capacitance microscopy (SCM), (v) Scanning conduction microscopy (SCM), (vi) Magnetic force microscopy (MFM), (vii) Piezoelectric force microscopy (PFM), and (vii) Near field scanning optical microscopy (NSOM). Of the above modes, the first five modes have been extensively used for semiconductor characterization [8–15]. For WBS characterization, especially III-N, AFM, EFM and SCM modes are the most important due to the strong polarization of III-N and SiC. In the latter half of this chapter, we focus on the characterization of III-N by EFM operated in
Read more1Capacitive Probe Microscopy
A scanning capacitance microscope (SCM) combines a differential capacitance measurement with an atomic force microscope (AFM). The AFM controls the position and contact force of a scanning probe tip, and a sensor simultaneously measures the capacitance between that tip and the sample under test. The capacitance sensor can detect very small (≈10 −21 F) changes in capacitance. The sensor is electrically connected to an AFM cantilevered tip that has been coated with metal to make it electrically conductive. As the SCM/AFM tip is scanned across the sample surface, simultaneous images of topography and differential capacitance are obtained. Currently, the most common application of SCM is imaging the carrier concentration variations (also known as dopant profiles) qualitatively within transistors that are part of silicon integrated circuits (ICs). Another application that has encouraged the development of commercial SCMs is the need for quantitative two‐dimensional (2‐D) carrier profiling of silicon transistors. This article reviews the history, operating principles, and applications of SCM. Special emphasis is placed on measuring quantitative 2‐D carrier profiles in silicon using SCM. This article also reviews implementation and applications of the scanning capacitance spectroscopy (SCS) technique, the intermittent contact mode of SCM (or IC‐SCM), and two other techniques that can also be classified as scanning capacitance probes: the scanning Kelvin probe microscope (SKPM), when operated at twice its drive frequency, and the scanning microwave microscope (SMWM).
Read more5Evaluation of scanning capacitance microscopy sample preparation by focused ion beam
Evaluation of scanning capacitance microscopy sample preparation by focused ion beam
10Analytical procedure for experimental quantification of carrier concentration in semiconductor devices by using electric scanning probe microscopy
Scanning capacitance microscopy (SCM) is based on a contact-mode variant of atomic force microscopy, which is used for imaging two-dimensional carrier (electrons and holes) distributions in semiconductor devices. We introduced a method of quantification of the carrier concentration by experimentally deduced calibration curves, which were prepared for semiconductor materials such as silicon and silicon carbide. The analytical procedure was circulated to research organizations in a round-robin test. The effectiveness of the method was confirmed for practical analysis and for what is expected for industrial pre-standardization from the viewpoint of comparability among users. It was also applied to other electric scanning probe microscopy techniques such as scanning spreading resistance microscopy and scanning nonlinear dielectric microscopy. Their depth profiles of carrier concentration were found to be in good agreement with those characterized by SCM. These results suggest that our proposed method will be compatible with future next-generation microscopy.
Read more5Nanoscale Characterization of SiC Interfaces and Devices
This paper reviews some recent advances in the application of scanning probe microscopy (SPM) electrical characterization techniques to several critical surface and interface issues in SiC technology. High resolution carrier profiling capabilities in SiC of scanning capacitance microscopy (SCM) and scanning spreading resistance microscopy (SSRM) were employed for several applications. These included two-dimensional (2D) imaging of doped regions in SiC devices (to be used as input for device simulations or as a feedback for device processing) and the quantitative evaluation of the electrically active profiles of P (or N) and Al implanted 4H-SiC after high temperature treatments. Furthermore, the electrical modification of the SiO2/4H-SiC interface in MOS devices subjected to post-oxide-deposition treatments in NO or N2O and POCl3 have been investigated, providing quantitative information on the electrical activation of incorporated N or P in the few-nm-thick SiC interfacial region. The lateral homogeneity of metal/SiC interfaces was probed at nanoscale by conductive atomic force microscopy (CAFM), with a special emphasis given to the case of Schottky contacts on 3C-SiC, where the diode behaviour is strongly affected by the high density of electrically active defects in the substrate. Finally, CAFM has been employed to study the current transport in epitaxial graphene (EG) grown on 4H-SiC (0001), revealing the impact of the substrate morphology (terraces and steps or facets) on the local conductivity.
Read more61Evaluating probes for “electrical” atomic force microscopy
The availability of very sharp, wear-proof, electrically conductive probes is one crucial issue for conductive atomic force microscopy (AFM) techniques such as scanning capacitance microscopy, scanning spreading resistance microscopy, and nanopotentiometry. The purpose of this systematic study is to give an overview of the existing probes and to evaluate their performance for the electrical techniques with emphasis on applications on Si at high contact forces. The suitability of the characterized probes has been demonstrated by applying conductive AFM techniques to test structures and state-of-the-art semiconductor devices. Two classes of probes were examined geometrically and electrically: Si sensors with a conductive coating and integrated pyramidal tips made of metal or diamond. Structural information about the conductive materials was obtained by electron microscopy and other analytical tools. Swift and nondestructive procedures to characterize the geometrical and electrical properties of the probes prior to the actual AFM experiment have been developed. Existing contact models have been used to explain variations in the electrical performance of the conductive probes.
Read more8Fabrication and use of metal tip and tip-on-tip probes for AFM-based device analysis
Different techniques based on the atomic force microscope (AFM) have been developed in the last few years for the electrical characterization of semiconductor devices. The quality of these measurements strongly depends on the tip which should not only have a small radius of curvature but also a high electrical conductivity. Therefore, the choice of metal as tip material is obvious. We have developed a process scheme for the fabrication of pyramidal metal tips which are integrated into a silicon cantilever. This paper discusses this process in detail and shows how the transition was made from prototyping to batch friction using standard 150 mm silicon wafer technology. Results are presented concerning the application of such probes for two-dimensional carrier profiling of InP and silicon structures using scanning spreading resistance microscopy (SSRM) and scanning capacitance microscopy (SCM). A novel tip configuration called tip-on-tip has also been developed. This concept looks promising for future applications. We demonstrate how such a tip-on-tip configuration can be realized.
Read more1Measurement of Dielectric Constant and Doping Concentration of a Cross-Sectioned Device by Quantitative Scanning Microwave Impedance Microscopy
Scanning microwave impedance microscopy (sMIM) is an emerging technique that can provide detailed information beyond that of conventional scanning capacitance microscopy (SCM), and other electrical scanning probe microscopy (SPM) techniques, for the investigation and failure analysis (FA) of semiconductor devices. Integration of new dielectric materials at lower levels of the device structure with the need for quantification of dielectric and dopants in semiconductor devices with sub-micron spatial resolution pushes the practical boundaries of typical atomic force microscopy (AFM) electrical modes. sMIM can measure both linear and non-linear materials (insulators and doped semiconductors, respectively) simultaneously. sMIM has a linear response to log k (dielectric number) and log N (doping concentration) making it an ideal method for providing quantitative measurements of semiconductor devices over a large range of values. This work demonstrates an example of a practical application of sMIM for quantitative measurement of the dopant concentration profile in production semiconductor devices. A planar dopant calibration sample is used to calibrate the sMIM prior to performing the measurements on an “unknown” production device. We utilize nanoscale C-V data to establish a calibration curve for both n- and p-type carriers and apply the calibration curve to an “unknown” device, presenting the measurements in units of doping concentration.
Read more30Nanolithography and nanoindentation of tantalum-oxide nanowires and nanodots using scanning probe microscopy
Nanolithography and nanoindentation of tantalum-oxide nanowires and nanodots using scanning probe microscopy
10SSRM characterisation of FIB induced damage in silicon
Scanning spreading resistance microscopy (SSRM) has been applied to study focused ion beam (FIB) induced damage in silicon in dependence on ion irradiation doses from 1012 cm-2 to 2·1016 cm-2. Starting from the lowest dose, SSRM detects increasing spreading resistance (SR) with increasing dose. For doses from 2·1013 cm-2 to 4·1014 cm-2, a slight decrease of SR is measured whereas for higher doses SR again slightly increases. The results are explained by physical effects like decreased carrier mobility due to increased scattering, amorphisation of silicon and precipitation of implanted Ga ions. The results clearly prove that SSRM is well suited for the fast detection of ion beam induced damage with high lateral resolution.
Read moreImaging free Carriers in Electronic Material using a Scanning Probe Microscope: Scanning Capacitance Microscopy
The development of methods to measure electrical properties, which are suitable to directly yield the desired carrier distributions on a nanometer scale has greatly benefited from the development of scanning probe technology over the last decade. Scanning Probe Microscopes (SPMs) offer inherent two-dimensionality and have been shown to have applications ranging from Magnet force to electro-chemistry. We have used an SPM in contact mode to simultaneously measure topography (and therefore physical structure) and capacitance variations (due to an applied bias) of various electronic materials such asdoped silicon, poly silicon, SiC, and III-V materials.The technique aptly named Scanning Capacitance Microscopy (SCM) takes advantage of the fact that electrical carrier response to an applied electric field is largely dependent upon the local carrier concentration. Using a high 'Q' GHz resonant circuit, SCM measures capacitance variations due to an applied bias between the metalized nano-probe tip and semiconductor sample during scanning. Since thesevariations are directly related to dopant (carrier) concentration, the SCM generates a two-dimensional image with contrast corresponding to near-surface variations in carrier density. Because the measurement is done with an extremely sharp probe, we have been able to resolve features as small as lOnm, corresponding to attofarad (le-18 farad) capacitance changes.
Read more8Inverted Scanning Microwave Microscopy of a Vital Mitochondrion in Liquid
The inverted scanning microwave microscope (iSMM) is a recently developed variety of scanning microprobe microscopes. Similar to a scanning microwave microscope (SMM), the iSMM is sensitive to not only surface structure, but also electromagnetic properties below the surface. Different from the SMM, the iSMM can be converted from any scanning probe microscope, such as an atomic force microscope (AFM) and a scanning tunneling microscope, with a simple metal probe to outperform the SMM in terms of ruggedness, bandwidth, sensitivity, and dynamic range. This letter reports the first iSMM images of a vital mitochondrion in an isotonic glucose solution. Compared to the AFM and SMM, the iSMM offers more insights into the mitochondrion. This shows the potential of iSMM for noninvasive and label-free imaging and characterization of subcellular structures.
Read moreDopant Activation Depth Profiling for Highly Doped Si:P By Scanning Spreading Resistance Microscopy (SSRM) and Differential Hall Effect Metrology (DHEM)
Heavily n-doped epitaxially grown Si layers are of great importance for source/drain (S/D) application in advanced node nMOS devices. For contact resistivity reduction, the dopant activation level is very important. Various techniques are being used to evaluate dopant activation in Si:P layers. Among these two methods are Scanning Spreading Resistance Microscopy (SSRM) and Differential Hall Effect Metrology (DHEM). SSRM uses an atomic force microscope equipped with a hard conductive probe that is scanned in contact mode on the cross-sectioned sample’s surface and measures spreading resistance. Measured resistance values as a function of depth are converted into resistivity and carrier concentration depth profiles using calibration measurements and conversion relationships. DHEM provides depth profiles of mobility, resistivity and carrier concentration through a semiconductor layer by making successive sheet resistance (Rs) and Hall voltage measurements using Hall effect/Van der Pauw techniques, as the electrically active thickness of the layer is reduced through successive oxidation steps. Controlled oxidation is achieved by electrochemical anodization. Data collected can then be processed to yield the depth profiles. In this contribution we have carried out SSRM and DHEM measurements on Si:P epi layers subjected to different processing conditions including annealing and ohmic contact fabrication. Secondary Ion Mass Spectrometry (SIMS) was used to measure the total (active + inactive) dopant profiles through the films. Effects of these processes on dopant diffusion and activation were studied and the results from DHEM and SSRM were compared.In-situ phosphorus (P) doped Si epi-layers were grown over 300mm diameter boron doped monitor wafers. While one set was kept as the reference, a second set was treated by a spike-annealing process at 1000 °C. In a third set a Ti/TiN contact fabrication process was carried out and the contact was removed before analysis. In the fourth set contact process was applied to the spike annealed wafer before removal of the Ti/TiN layers. Bulk sheet resistance measurements were made using 4-point probe (4PP) for all the samples. SSRM measurements were carried out at IMEC. Cross-shaped Van der Pauw test-patterns were formed on 8mmx8mm areas on the samples and DHEM measurements were performed at ALP. Figure below shows the dopant depth profiles obtained by SIMS and the carrier concentration profiles from DHEM and SSRM techniques for samples D02 (as deposited Si:P) and D03 (spike annealed). One can make some general observations from the data in this figure. The total dopant concentration as measured by SIMS is ~ 1.4E21/cm3. There is only a small difference in the total dopant distribution profiles (SIMS) between the as deposited sample and the spike annealed sample. However, the spike annealed sample shows much higher dopant activation as measured by DHEM. Carrier concentration is ~2.5x higher in sample D03 (~5E20/cm3) compared to sample D02 (~2E20/cm3). Activation levels measured by SSRM, however, are lower for both samples, and the peak carrier concentration value increases only slightly upon spike annealing, going from ~2E20/cm3 in sample D02 to ~2.2E20/cm3 in sample D03. DHEM clearly indicates the sharp interface between the p-type substrate and the n-type epi-layer and its depth calibration agrees well with the expected thicknesses of the epi layers. The tail of the SSRM data is much more graded. Data from other samples will be presented and discussed in the final manuscript. Figure 1
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