3M is striving to develop packaging technologies that will enable reduction of cost and size of electronic products while increasing function and speed, and adhesive interconnection is one such enabling technology. With its first product (5303R) as a benchmark, 3M is pursuing three adhesive development goals: improvement of adhesion properties, reduction of processing temperatures and development of high performance materials for direct chip attachment. In addition, new particle dispersion technologies are under development which will provide for direct adhesive flip-chip attachment of unbumped integrated circuits. The technical approaches and present status of these development efforts are described in this paper.

This paper presents an investigation of die-attachment materials suitable for die-bonding of large-area naked chips to substrates of FR-4 and alumina. The size of the chips employed ranges from 12 to 20 mm. Two silver-loaded epoxy adhesives, one silicone and one tape adhesive, are evaluated and compared with an In/Pb solder. After temperature cycling from −40 to +100°C for 1000 h, microscopic cracks were revealed in the silicon chips. No major difference between the different materials was found in this respect. Measurements of the thermal resistance of the chip–substrate assembly showed comparable results between the adhesives and the solder except for the tape adhesive, which performed worse. Studies of the curvature of bonded chips showed that the radii of curvature were clearly measurable for most of the die-attachment materials used. The deflection was not measurable for the silicone adhesive, which exhibits a much lower modulus of elasticity and therefore absorbs the mechanical stresses causing the bending.

Journal of Electronics ManufacturingVol. 03, No. 04, pp. 175-178 (1993) PAPERSNo AccessDebonding of adhesively joined electronic circuits for recyclingA. HARTWIG and O. D. HENNEMANNA. HARTWIGFraunhofer-Institut für Angewandte Materialforschung, Abteilung Klebtechnik, Neuer Steindamm 2, 28719 Bremen, Germany Search for more papers by this author and O. D. HENNEMANNFraunhofer-Institut für Angewandte Materialforschung, Abteilung Klebtechnik, Neuer Steindamm 2, 28719 Bremen, Germany Search for more papers by this author https://doi.org/10.1142/S0960313193000188Cited by:0 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractA restriction of the use of lead in electronics can be expected. Conductive adhesives are able to replace the lead containing solder. The alternative joining technology should not only replace lead, debonding of the connection must be possible for the purpose of repair and recycling, too. Possible methods for debonding are described as well as requirements of environmentally friendly adhesively bonded electronics.Keywords:conductive adhesiveelectronic circuitrecyclingdebondingsolder replacement FiguresReferencesRelatedDetails Recommended Vol. 03, No. 04 Metrics History Received 1 September 1993 Accepted 1 September 1993 Keywordsconductive adhesiveelectronic circuitrecyclingdebondingsolder replacementPDF download

Semiconductor manufacturing occurs in a highly complex environment where many work areas interact. This paper is motivated by a situation in a test area of semiconductor manufacturing. It concentrates on the operations that occur after the last test insertion. These operations are sometimes referred to as post-test and may be performed by more than one work area. Because post-test operations are the final steps in the manufacturing process they are crucial, and the decisions made when a job reaches these operations greatly impacts on customer satisfaction. For different input variations, common dispatching policies are compared to determine their effects on the system. It was found that input variation significantly affects the output performance. This is consistent with the results in the literature that, in a job-shop environment, job-release policies affect output performance more significantly than dispatching policies. However, dispatching policy effects are still noticeable when input variation is high. Policies that perform well when input variation is high are selected for comparison with a new look-ahead dispatching policy. When compared with the common dispatching policies, in most cases the look-ahead policy performs well for the dual criteria of variance of weekly throughput and percentage of late jobs.

Journal of Electronics ManufacturingVol. 03, No. 02, pp. 79-84 (1993) PAPERSNo AccessSMT in Singapore: a window into the challenges and practiceROBERT DE SOUZA, SUBODH MHAISALKAR, KIAN TIONG YAP, and CHEE KENG YEOROBERT DE SOUZASchool of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author , SUBODH MHAISALKARInstitute of Manufacturing Technology, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author , KIAN TIONG YAPInstitute of Manufacturing Technology, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author , and CHEE KENG YEOInstitute of Manufacturing Technology, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author https://doi.org/10.1142/S0960313193000097Cited by:0 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThis paper reports on a survey of a sample of surface-mount technology (SMT) users in Singapore. The problems and challenges of this sample of SMT practitioners in adopting and adapting to current and emerging technologies are presented. The conclusion drawn is that there are a number of problems which are common to all the users and which have to be overcome; at the same time implementation of the newer technologies cannot be ignored in order to increase Singapore's competitiveness in electronics manufacturing.Keywords:Surface mount technologySingaporesurveySMT FiguresReferencesRelatedDetails Recommended Vol. 03, No. 02 Metrics History Received 1 September 1992 Accepted 1 December 1992 KeywordsSurface mount technologySingaporesurveySMTPDF download

Journal of Electronics ManufacturingVol. 03, No. 01, pp. 13-23 (1993) PAPERSNo AccessDesign and development of a generic ECAD interfaceMUI KIANG ANG and ROBERT K. L. GAYMUI KIANG ANGGINTIC Institute of CIM, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author and ROBERT K. L. GAYGINTIC Institute of CIM, Nanyang Technological University, Nanyang Avenue, Singapore 2263, Singapore Search for more papers by this author https://doi.org/10.1142/S0960313193000036Cited by:0 PreviousNext AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractIn the face of growing competition in the PCB assembly industries, considerable effort has been applied to determine the most effective solutions to the problems of printed circuit board (PCB) design, manufacture and test to meet changing market demands as well as to improve productivity and quality. Conceptually, the ideal solution is believed to lie in the creation of a practical computer-integrated manufacturing (CIM) environment. To achieve this, the integration of computer-aided design (CAD) systems with auto-insertion and placement machines in a flexible manufacturing system (FMS) is a vital requirement. This paper describes the design and development of a generic CAD interface applicable to a wide variety of CAD systems and auto-insertion and placement machines.Keywords:Generic ECAD interfacePCB assemblyPCB assembly FMS FiguresReferencesRelatedDetails Recommended Vol. 03, No. 01 Metrics History Received 1 September 1992 Accepted 1 October 1992 KeywordsGeneric ECAD interfacePCB assemblyPCB assembly FMSPDF download

This paper proposes a tolerance-based rule-base system for a single-crane scheduling problem in a flexible circuit board electroplating line. The objective is to minimize the completion time without a defective product. The algorithm is designed to determine the crane and job schedules in a real-time environment with dynamic change of job demand and random processing times. Two rule bases are used in the algorithm. The proposed rule base utilizes the tolerance of processing times to prevent delaying jobs’ entry times; the basic rule base which adopts only the shortest processing time (SPT) is introduced as a base to compare with the proposed one. The simulation results show the tradeoffs on the performances of the algorithm between these two rule bases and the tolerance-based rule base results in better throughput.

This paper briefly reviews the historical development of conducting adhesives and highlights their application problems. A product is described that is tested and demonstrated to overcome many of these problems. The paper closes by indicating successful applications of the technology.

Journal of Electronics ManufacturingVol. 01, No. 02, pp. 97-104 (1991) PapersNo AccessThe concurrent engineering approach to product developmentMICHAEL J. O’FLYNN and M. MUNIR AHMADMICHAEL J. O’FLYNNDigital Equipment Corporation, Manufacturing Engineering Department, Ballybrit Industrial Estate, Galway, Ireland Search for more papers by this author and M. MUNIR AHMADDepartment of Mechanical and Production Engineering, University of Limerick, Limerick, Ireland Search for more papers by this author https://doi.org/10.1142/S0960313191000126Cited by:0 Previous AboutSectionsPDF/EPUB ToolsAdd to favoritesDownload CitationsTrack CitationsRecommend to Library ShareShare onFacebookTwitterLinked InRedditEmail AbstractThe manufacturing sector has experienced significant changes over the past twenty years. Companies are becoming more international and are facing increased competitive challenges. Because of this, and owing to higher customer expectations, there are greater demands on product quality, functionality, aesthetics, reliability, and flexibility. In addition, product life-cycles have reduced which has led to shorter time periods in which to recover costs. There is greater pressure on design teams to develop products in shorter time periods as profits have been shown to be very sensitive to time-to-market (TTM). Many of the above factors are directly influenced during product development and therefore the approach adopted during this phase of the product life-cycle can have a major impact on profitability. This paper defines the simultaneous or concurrent engineering (CE) approach to product development, and the benefits of adopting it, versus the traditional sequential engineering approach. CE implementation techniques, including formal methodologies and computer-based initiatives, currently employed or being developed, are described. Finally, an overview of a design for manufacture (DFM) expert model for PWB design and manufacture, based on minimising manufacturing costs, is presented (in this context, a PWB includes printed wiring board plus componentry).Keywords:Concurrent engineeringsimultaneous engineeringdesign for manufactureproduct development FiguresReferencesRelatedDetails Recommended Vol. 01, No. 02 Metrics History KeywordsConcurrent engineeringsimultaneous engineeringdesign for manufactureproduct developmentPDF download