- Research Article
1
- 10.7791/jspmee.8.169
Influence of Thermal Fluctuation on Bonding Accuracy in Die-Attach Proces
- Sep 10, 2019
- Journal of Smart Processing
- Daisuke Sakurai + 4 more +4
The purpose of the present study is to supply the design guidelines of the high accuracy bonding process concerning the assembly of the semiconductor packages such as 2.5D, 3D and fan-out wafer level package. In this study, the target of the bonding accuracy of the die-attach process is within 3 μm. The authors fabricated the bonding unit consist of the transparent head and the sideview camera, which can directly recognize the alignment mark chucked on the bonding head. In order to solve the issue that the recognition accuracy becomes worse by the thermal fluctuation, the authors quantified the thermal-fluid behavior by the thermal fluid analysis and the particle image velocimetry, and clarified the correlation between the control factors of the recognition accuracy in the bonding process. Furthermore, the condition to reduce the thermal fluctuation was found, so that the bonding accuracy of ±3 μm was achieved in the die-attach process.
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