ABSTRACT Hosted by SMTA Ontario Chapter On their basic premise, conformal coatings are simple materials meant to protect circuit boards against common environmental pollutants and thus extend the lifespan of electronics. With each application, there comes unique requirements that sets a threshold the candidate material must fulfill to have success in the field, but how can we best determine whether the data on paper will correlate? In this webinar, we will explore how to systematically assess a candidate material's suitability for use, comparing common application requirements with standard data along and industry certifications. What's Included: Recorded Presentation (On-Demand)

ABSTRACT * This webinar is presented in Spanish* En este webinar, exploraremos la trayectoria de una ingeniera junior en una instalaciόn de SMT, centrándonos en la curva de aprendizaje y la experiencia práctica, en particular en el proceso de soldadura por ola. Ya sea que esté comenzando o recordando sus primeros días en la industria, esta charla le ofrecerá informaciόn valiosa sobre los desafíos y las oportunidades de crecimiento que conlleva el puesto. También destacaremos la importancia de la diversidad en el campo, alentando a los nuevos ingenieros, especialmente a las mujeres, a dar el salto y prosperar en el apasionante mundo de SMT. In this webinar, we'll explore the journey of a junior engineer in an SMT facility, focusing on the learning curve and hands-on experience, particularly within the wave soldering process. Whether you're just starting out or reminiscing about your early days in the industry, this talk will offer valuable insights into the challenges and growth opportunities that come with the role. We'll also highlight the importance of diversity in the field, encouraging new engineers—especially women—to take the leap and thrive in the exciting world of SMT. Speaker Bio: Daniela Lara naciό en Querétaro. Estudiό ingeniería industrial en el Instituto Tecnolόgico de Querétaro y actualmente es ingeniera de procesos en Kostal Eletromobility Mexicana, empresa que fabrica cargadores a bordo (OBC) para vehículos eléctricos. Participa en el ensamble de placas de circuito impreso (PCB), específicamente en el proceso backend, como la soldadura por ola. On Demand Webinar

ABSTRACT Technical Presentation: Providing a general answer regarding the danger posed by particles to the reliable function of electronic assemblies, particularly in High Voltage (HV) applications, is challenging. Simple particle counting and size measurements only indicate their presence, not necessarily their risk. In this webinar, Freddy Gilbert will outline typical expectations regarding the behavior of metallic and non-metallic particles, especially in HV applications, and demonstrate a method for meaningful risk assessment: • Differentiation between metallic and non-metallic particles and their anticipated impacts on electronic assemblies • Risk assessment through frit voltage analysis • Practical insights: Review of field cases Speaker Bio: Freddy Gilbert studied Material Sciences and Engineering at the Graduate School of Engineering of the University of Montpellier and the Technical University of Berlin. He currently works as Senior Technology Analyst in the Reliability & Surfaces team of ZESTRON. He organizes and conducts Technology Coachings and Analyses with the focus on reliability of electronics against humidity-related failure mechanisms and contamination-induced failures. On Demand Webinar

ABSTRACT Technical Presentation: The migration of circuitry to Ultra HDI brings many benefits in terms of miniaturization. The fabrication technology is undergoing a step-function change in densities – and therefore functionalities – that will enable an entire new generation of electronics for defense, healthcare, transportation and communications. The fact that a printed circuit board can be fabricated does not necessarily indicate that it can also be assembled. For high-performance products, very little reliability data exists for high reliability UHDI assemblies. The newly released SMTA Ultra HDI Assembly Test Board brings special attention in terms of validating new processes needed with this miniaturization and testing the reliability of their outputs. This presentation will review: • Basic SMT Process Overview • Impacts of miniaturization on SMT systems • New assembly tests on the UHDI Assembly Test Board • Vision for the future – UHDI Stackups • Summary – Pros and Cons of UHDI in SMT Speaker Bio: Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys Shea Chrys is an SMTA “Member of Technical Distinction,” an SMTA “Distinguished Speaker” and four-time winner of the SMTAI “Rich Frieberger Best of Conference” award for her research on solder paste printing. She earned a Bachelor's Degree in Mechanical Engineering and a Master's Degree in Manufacturing Engineering. Chrys' background is in SMT process engineering. She held various production engineering, new product introduction, research and management positions before launching her own business and is celebrating 15 years as an independent technologist. What's Included: • Recorded Presentation (On-Demand)

ABSTRACT Organized by SMTA Penang Chapter Overview 6G technology will change our world to a whole new level of connectedness and use of artificial intelligence. This talk explains what 6G is, the changes it will bring, plus discusses the impact of the new technologies on electronics manufacturing. There will be challenges in the design and manufacture of 6G electronics, with new materials, pushing or breaking of design rules and innovative processes required. The opportunities will come as the factory of the future vision becomes reality. About the Presenter: Julie Silk is a Program Manager for Keysight Technologies. She manages Keysight's compliance with EU RoHS, materials reliability investigations plus Keysight's engagements with electronics manufacturing and reliability consortia. Julie is VP of Technical Programs for SMTA, Chair of the Board for HDP User Group, Technical Committee Chair for iNEMI and General Chair of the Product Reliability committee for IPC. She has had a focus on printed circuit assembly design, quality, reliability and supplier development. She has a BS in Chemical Engineering from the University of Washington and has worked for Hewlett-Packard / Agilent Technologies / Keysight Technologies for over 40 years. She also is dedicated to encouraging young women to enter engineering fields through Keysight's Introduce a Girl to Engineering Day and as president of the non-profit Expanding Your Horizons Sonoma County. Julie Silk Files Available: Recorded Presentation (On-Demand) Slides (PDF)

ABSTRACT Presentations: John Watson, Palomar College Title: PCB Design Courses Abstract: Most of us have noticed the growing trend for the past 10 to 15 years with the lack of talent in the workforce. Yearly surveys for the Printed Circuit and Fabrication industry asking if individuals intend to retire in the next year has shown an alarming percentage of 62%. That explains why there is an increase in a company's talent, experience, and knowledge walking out the door. The other trend is the drop in new students in Hardware development, including in Printed Circuit Board design studies. The presentation will discuss a unique online college course program for the next generation of PCB Designers, which is over 32 weeks (2 semester course) on basics and advanced classes that concentrates strictly on PCB design. It will discuss the root causes of talent shortage hitting our industries, how to reverse those trends, how to provide the needed training for your team, how to take advantage of educational development programs, how to participate in a unique internship program in the industry, new programs for young people as juniors and seniors in high school and how they can get involved with what is called the middle college program. Daniel Gutierrez, Data Product Analyst/ Data Scientist, Intraratio Title: Careers in PCB Manufacturing Abstract: From the car we drive, the phone we use to text our friends, and even the coffee maker to jump start our day, every electronic device contains a Printed Circuit Board to allow them to function seamlessly. Behind our favorite devices hidden away by shiny glass, colorful plastics and flawless metals the PCB is its own work of art. The many advances in PCB fabrication and assembly has allowed our technologies to further advance, products are faster, smaller and cheaper year after year. The industry is full of breakthrough engineering triumphs as well as their complex challenges. From designing the intricate network of signals across multiple layers to placing thousands of components on the surface, the PCB requires expertise in many fields to build them. The presentation will explore the many careers in the PCB industry across three stages of the PCB life cycle: Design, Fabrication, and Assembly. Areas which will be discussed will include the PCB and Challenges in the industry, Design including DFM (Design for Manufacture) Guidelines and Design Software Tools, PCB Fabrication, Assembly and Test and Supply Chain Operations. Presentations will be followed by a panel discussion on careers in electronics manufacturing with companies/organizations answering questions from the attendees. Speaker Bios: John Watson , CID has had a career spanning over 44 years in electronics, with 24 of them working in the PCB design/engineering field. John has worked with several companies including Teledyne API, Emerson Computer Power, and Legrand Corporation, and proudly served in the US Army in the Military Intelligence field. Presently, he works as a Customer Success Manager with Altium. He trains and mentors new customers on the company tools and the PCB process, working alongside companies to improve their proficiency with the company's electronics product design platform and the overall quality PCB design process. John is a College Professor at Palomar College in San Marcos, CA teaching basic and advanced PCB design in the 32-week program. He is an author and writer for various Blogs, White Papers, and is a Monthly columnist for IConnect-007 magazine. John is the author of two Library and Data Management books and a Speaker/ Lecturer in the USA, Europe, and Asia. This includes being a guest speaker at University of the Philippines- College of Engineering. John is on the PCEA (Printed Circuit Engineering Association) Committee- Next-Gen Core Team- developing ways to mentor future PCB designers. John Watson Daniel Gutierrez has over 12 years experience in electronics, medical device, and polymer manufacturing, with expertise in PCB design, assembly, and testing. This extends to process improvement using advanced data analytics. In his current role as Data Product Manager/Data Scientist, he is leading the development of AI/Machine Learning applications for manufacturing process improvement. Daniel Gutierrez On Demand Webinar

ABSTRACT On-demand webinar originally hosted by SMTA Wisconsin Chapter Technical Presentation: In this webinar, presenters review 3D Printing technologies that exist today and where this industry is heading in the future. We will also plan to focus on how 3D printing specifically relates to the electronics manufacturing industry. On Demand Webinar

ABSTRACT Co-organized by the Intermountain, Long Island, Silicon Valley and Upper Midwest Chapters and the Students & Young Professionals Committee Technical Presentations: 1. Professor Ron Lasky, PhD, PE, Dartmouth College and Senior Technologist, Indium Corporation Title: Statistical Process Control 101 Abstract:. The presentation will cover statistical process control (SPC). SPC is an important tool in controlling SMT assembly processes, especially stencil printing. It will start with a discussion of the 6 Ms of variation and then delineate common cause and special cause variation. The difference between precision and accuracy will then be clarified. After discussing the precision tolerance ratio, the technique to perform a Gage R&R (Repeatability and Reproducibility) analysis will be presented. Process control charts, and their development will then be discussed including the Shewhart Rules. Several sets of SPC Xbar-R and C Chart data will then be plotted and analyzed with commercial statistical software. The webinar will conclude with a discussion and application of the process capability indices Cp and Cpx. SPC 101 Topics Covered Include: The 6 Ms of variation Special Cause and Common Variation Measuring as a Process Precision and Accuracy Precision/Tolerance Ratio Gage R&R (Repeatability & Reproducibility) Analysis Control Charts- Shewhart Rules Xbar R Charts Stencil Printing Example C Charts Pareto Charts Cp and Cpk with Examples Commercial statistical software will be used throughout 2. Chrys Shea, President, Shea Engineering Services Title: The Use of SPC in Relation to Stencil Printing Abstract: The presentation will review the typical variables monitored under SPC on typical SMT assembly lines, with special focus on the solder paste printing process. The print process is arguably the most important to monitor because it is the most easily affected by both Special and Common causes of variation. The presentation will review a fishbone diagram of print process factors as well as a discussion of troubleshooting print problems and specific defect modes. Biographies: Ron Lasky Ron Lasky is currently an Instructional Professor at Dartmouth College, a Senior Technologist at Indium Corporation and a Consultant with ITM. Prior to this, he had over thirty years experience in electronic and optoelectronic packaging and assembly at IBM, Universal Instruments and Cookson Electronics. He has authored or edited 7 books on science, electronics, and optoelectronics and numerous technical papers and authored articles for Scientific American. He holds a number of patent disclosures and is the developer of several new concepts in SMT processing software relating to cost estimating, line balancing and process optimization. He is the co-creator of engineering certification exams in electronic assembly and the Director of Dartmouth"™s Lean Six Sigma Program. He was awarded the SMTA Founder's Award in 2003 and Member of Technical Distinction Award in 2021. He has four degrees, including a Ph.D. from Cornell University in Materials Science. Ron is a New York State licensed professional engineer and a Lean Six Sigma Master Black Belt. Chrys Shea is the President of Shea Engineering Services, a consulting firm that produces technical studies and communications tools for the electronics manufacturing industry. Chrys is an SMTA "Member of Technical Distinction," an SMTA "Distinguished Speaker" and four-time winner of the SMTAI "Rich Freiberger Best of Conference" award for her research on solder paste printing. She earned a Bachelor's Degree in Mechanical Engineering and a Master's Degree in Manufacturing Engineering. Chrys' background is in SMT process engineering. She is a member of the SMTA International Technical Committee and the IPC 7526A Stencil Cleaning Handbook Committee. She held various production engineering, new product introduction, research and management positions before launching her own business in 2008. Chrys Shea Files Available to Download: Recorded Presentation (On-Demand) Presentation Slides Part 1 (PDF) Presentation Slides Part 2 (PDF) Additional Resources (PDF)

ABSTRACT Technical Presentation: In this session, we will discuss how Shortages and Obsolescence creates increased Counterfeit in the market place. It was widely thought that the Shortages would start to ease up starting in the second quarter of 2022. All signs are that the Shortages will not be easing up anytime soon and everything is pointing to situations where those Shortages will turn into Obsolescence issues. Parts that are currently not available due to the Shortage market, will never come back, with no opportunities for Last Time Buys. We will examine the outlook for Obsolescence in 2022 and beyond, the causes of the increase of Obsolescence in 2022, and how much of this Obsolescence will be Instant Obsolescence. We will also look at how these Obsolescence and Shortage risks cause an increase in Counterfeit Risk and how you can avoid the Obsolescence and Shortages in the first place. Vernon Densler Biography: Vernon Densler is a Solutions Engineer at Sourceability. He has been with Sourceability since 2021 and previously spent 3 years at SiliconExpert and 18 years at Northrop Grumman as both a Systems Engineer and Manager in charge of Obsolescence Management and Spares & Repairs. Vernon holds a BS in Computer Information Systems, Management from Florida Institute of Technology. Vernon frequently speaks at industry events and symposiums, where he is able to use his experience in the Parts Management field to assist in furthering best practices and the Parts Management discipline. Vernon resides in Palm Bay, Florida. Files Available to Download: • Recorded Presentation (On-Demand) • Slides (PDF) On Demand Webinar

ABSTRACT On-demand webinar originally hosted by SMTA Ontario Chapter Technical Presentation: This presentation will show you how to recognize certain defects, such as HIP, QFN opens, cracks and fractures and many more using high resolution X-Ray. Biography: John Travis is the Sales Manager for Nordson Test & Inspection and is responsible for sales and X-Ray applications for the Northeast region. He has many years of experience with various applications and inspection techniques using digital x-ray imaging. He brings over 30 years of experience in the electronics industry and has been involved in application engineering and the sales of X-Ray inspection equipment for the last 20 years. John Travis On Demand Webinar