Book Chapter3410.1016/b978-0-12-234124-3.50006-9Chapter 1 - Heterostructure and Quantum Well PhysicsJan 01, 1994VLSI Electronics Microstructure ScienceWilliam R FrensleyCiteListenSave
Book Chapter110.1016/b978-0-12-234122-9.50013-4Chapter 7 - Packaging-Related Reliability IssuesJan 01, 1990VLSI Electronics Microstructure ScienceCiteListenSave
Book Chapter1010.1016/b978-0-12-234121-2.50011-5Chapter 6 - Chemical Beam EpitaxyJan 01, 1989VLSI Electronics Microstructure ScienceW T TsangCiteListenSave
Book Chapter10.1016/b978-0-12-234119-9.50003-1Copyright pageJan 01, 1989VLSI Electronics Microstructure ScienceCiteListenSave
Book Chapter10.1016/b978-0-12-234121-2.50014-0Chapter 9 - Electron Beam Testing: An Outline of TechniquesJan 01, 1989VLSI Electronics Microstructure ScienceA GopinathCiteListenSave
Book Chapter10.1016/b978-0-12-234117-5.50012-6Chapter 8 - Neural StimulationJan 01, 1989VLSI Electronics Microstructure ScienceBarry M YomtovCiteListenSave
Book Chapter110.1016/b978-0-12-234118-2.50006-1Chapter 2 - Current Trends in MOS Process IntegrationJan 01, 1989VLSI Electronics Microstructure ScienceAlan G Lewis + 1 more +1CiteListenSave
Book Chapter10.1016/b978-0-12-234120-5.50014-xChapter 9 - VLSI TrendsJan 01, 1989VLSI Electronics Microstructure ScienceCiteListenSave
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Book Chapter10.1016/b978-0-12-234118-2.50011-5Chapter 7 - LatchupJan 01, 1989VLSI Electronics Microstructure ScienceJ Edward HallCiteListenSave