- Research Article
- 10.4071/isom-2016-wp32
Ultra-High Density System-in-Package (SiP) for the Lowest Size Weight and Power (SWAP)
- Oct 01, 2016
- International Symposium on Microelectronics
- Bruce Barbara
Abstract Fan out wafer level packages have emerged across the market in an effort to reduce size and weight of electronics used in portable and wearable applications in the commercial, industrial, and the hi-reliability products space. If it is not a stationary platform, weight and volume reduction are imperative. For the stationary platforms, size and power are most critical. Integration of multiple complex heterogeneous IC components can only be done if there are a sufficient number of interconnect layers. Additionally, multiple interconnects are needed for transmission line creation and shielding. This paper provides an introduction to Aurora Semiconductor's high density packaging technology i.e. iUHD (integrated Ultra High Density) and compares it with other alternative technologies. The Aurora iUHD technology is a 2.5D/3D FOWLCSP including embedded components, TSV, multi-layer top and bottom interconnects.
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