- Research Article
- 10.1002/ppap.70115
Atmospheric Pressure Plasma Treatment for Direct Sputtering of Copper Seed Layers on Cycloolefin Polymer Films for High‐Frequency Applications
- Jan 01, 2026
- Plasma Processes and Polymers
- Akihiro Shimizu + 2 more +2
ABSTRACT This study investigates the feasibility of atmospheric pressure plasma (APP) treatment using a nitrogen–air gas mixture as a surface modification technique to enable the direct sputtering of copper seed layers on cycloolefin polymer (COP) films. The APP treatment achieved a peel strength of 0.6 kN/m between the COP film and the copper plating layer, exceeding the 0.5 kN/m threshold required for reliable circuit pattern formation. This result demonstrates the potential of the APP treatment as a cost‐effective and scalable alternative to vacuum‐based surface modification methods for high‐frequency applications, including next‐generation antenna substrates under ambient‐pressure conditions.
Read more