CIM strategy for semiconductor fab-building blocks approach

Summary form only given. Productive and cost effective use of semiconductor manufacturing equipment is a primary concern in semiconductor fabs today. As equipment costs continue to escalate, semiconductor manufacturers are focusing their efforts on Computer Integrated Manufacturing (CIM) to bolster productivity, improve yields, and reduce the cost of ownership. Equipment Integration can play a key role in these sophisticated CIM systems by bridging the gap between factory computer systems and process equipment. To implement efficient and effective equipment integration, the semiconductor manufacturer must overcome the following obstacles: high implementation costs; difficult technical implementation; long development cycles; finite resources; limited operational functionality. Specifically, the equipment's communication interface (CI) contributes to those obstacles through: Limited communication interface functionality; Unique equipment communication interfaces; Unpredictable equipment communication interfaces; Poor reuse of integration practices and software from factory to factory. Motorola is addressing these obstacles by implementing a program to improve equipment communication interface consistency, predictability, and functionality. To improve equipment communication predictability, Motorola utilizes improved CI characterization tools techniques that thoroughly exercise the equipment's CI. To improve interface consistency and functionality, Motorola is establishing partnerships with equipment vendors and characterization software suppliers. These partnerships provide the foundation for improved CI quality and adherence to SEMI standards before a product is shipped to Motorola. Mr. Guy Davis will share his perspective on how standards, procedures, and software tools can improve the quality and reduce the cost and cycletime involved in equipment integration. He will discuss the benefits realized when software suppliers, system integrators, equipment providers, and semiconductor manufacturers are working together.

A significant effort in recent computer-integrated manufacturing (CIM) development was carried out by SEMATECH who had laid out and created an open framework for the integration of manufacturing execution system applications running in semiconductor industries at the factory operation level. This paper presents the feasibility to incorporate basic manufacturing applications at the factory engineering level, which include product design, process planning, and material requirement planning, into the SEMATECH CIM framework to form a generic framework across both factory operation level and factory engineering level. The CIM framework established in this paper was aimed to provide a reusable integrated system framework that clearly specifies the functional interface boundaries and standard information model of the required components, in general, manufacturing systems at both factory operation and factory engineering levels. Standard unified modeling language (UML) diagrams and Petri nets have been utilized to model and analyze the specifications and dynamic behaviors of this generic CIM framework. The goal is to build a framework by creating a common, modular, flexible, and integrated object model that unifies an advanced object-oriented architecture concept and heterogeneous manufacturing application development in an open and multisupplier CIM system environment.

1 - CIM — the scope

Use of computer aided management information systems in the food and beverage industry in Germany

At Stanford University we have developed concepts of a programmable factory, an alternative Adaptable Manufacturing Systems (AMS) approach to IC fabrication, which may offer more economical small or large scale production, higher flexibility to accommodate many products on several processes, and faster turnaround to hasten product innovation [1–3]. This approach is based on a new generation of single-wafer, flexible, multifunctional equipment with extensive use of computer integrated manufacturing (CIM) to further enhance the flexibility. In this approach programmable equipment quickly processes one semiconductor wafer at a time, performs several process steps insitu in contrast to the conventional alternative of slowly processing many wafers simultaneously and one step per equipment [1–3]. Single-wafer processing facilitates the use of in-situ monitoring and real-time control. Extensive use of CIM for specification, monitoring, control, and information management should make switching between processes faster and more reliable, should increase the ease by which large numbers of different products could simultaneously be routed and tracked through the factory, and should maximize equipment utilization.

Concepts such as six sigma quality, continuous flow manufacturing (CFM), and computer integrated manufacturing (CIM) are critical components for success in manufacturing. However, there is much work involved in translating such concepts into competitive specific solutions that meet business objectives. Simulation provides an effective vehicle for defining the path from competitive concepts to real world solutions. This paper presents an overview of logistics management considerations in semiconductor manufacturing and describes the critical role of simulation in the development and implementation of an effective logistics solution.

A Distributed Real-Time Transaction Processing Environment For the CIM Applications

A pragmatic alternative to approaches to the CIM (computer-integrated manufacturing) concept involving plant-wide control layers as part of the control hierarchy is discussed. The alternative approach embraces a plant-wide control system and business planning, communication software, standard interfaces, real-time operational control, and a phasing-in approach that addresses human needs and cultural issues. The authors consider that their method does not risk obsolescence or require large initial capital investment, yet focuses on manufacturing objectives. An example of automation implementation using the method is described.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Data acquisition and real-time bolometer tomography using LabVIEW RT

On the basis of the rapidly increasing power, speed, and decreasing cost of the personal computer (microcomputer) it was felt that a real time data acquisition and control system could be configured quickly and very cost effectively. It was further felt that by using a high level or object-oriented programming language that considerable time and expense could be saved and at the same time increase system flexibility. This paper will attempt to address the desired system requirements and performance for both the control of the high power transmitters and for the data acquisition and presentation of the information.

Evaluation of refinery control systems

Software based on the CAMAC standards has been developed for a real-time data acquisition and process control system. The system is used to control the examination of irradiated fuel elements. Employing CAMAC in software has resulted in the development of a standard method of addressing the acquisition and control hardware. A description of a subroutine that outputs command words to the CAMAC system, checks for transmission errors, and checks for completion of the CAMAC handshake is presented. Use of this subroutine decreases programming time and training time due to system expansion or changes. Modularization of software through the use of subroutines has simplified programming of the software system.

This paper describes the partnership SEMY Engineering, Inc. and White Oak Semiconductor formed to successfully provide automation and advanced process control (APC) solutions from a combination of proprietary and commercially available software systems. The White Oak factory objective was to implement a computer integrated manufacturing (CIM) system providing full availability of all necessary data for yield analysis and process control. Semiconductor production throughput and reliability at White Oak has significantly increased using this implementation. A large ROI (>500%) has already been realized in the lithography cell in the first year alone.

T8-1 - Sources and solutions of fire and explosion in semiconductor fabrication processes

In order to meet the tomato color sorting system with the requirements of multi-channel data acquisition and real-time processing, [ ]firstly, a multi-channel color digital acquisition and processing technique program based on FPGA were proposed . Then, a multi-channel data acquisition and real-time parallel processing system was built. The RGB color sensors were slected as detection components and the FPGA chip EP1C3T144C8 was slected as a core of data acquisition and processing. Meanwhile, ports of signal acquisition and the solenoid valve control were adopted a two-way analog switch HC4051 for saving I/O ports of FPGA. Thirdly, under the modular design and module reuse principles, we developed all modules with VHDL Language in QuartusII development environment. Finally, RTL and time sequence simulation for the system were done. The results showed that the connections between the modules accord with control logics. [²»´o¶O accorded ¹ýE¥E½] The performance of system time sequencev are good, which can meet with the requirements of real-time processing of tomato color sorting. On these bases, we also conducted a tomato sorting test verification. The results showed that the average accuracy of sorting is 98.70% and coefficient of variation is 0.01. This results can meet requirements of production.