Effective Defect Localization for Scan ATPG Failure through Layout Aware Analysis

Parallel computing is widely utilized to speed up automatic test pattern generation (ATPG); however, most of today's parallel ATPGs are non-deterministic, which often leads to non-reproducible test pattern sets. This paper presents a fault-parallel test pattern generator: CPP-ATPG; it generates the same test pattern set regardless of the thread count and timing. Besides, it exhibits good speedup scalability as the thread count increases. These are achieved by the circular pipeline processing (CPP) principle, which guides the proposed parallel ATPG to preserve the task processing orders that are necessary to ensure ATPG determinism but with low inter-thread synchronization overhead. Furthermore, a multi-round test generation and compaction strategy is proposed to avoid possible test pattern inflation. Experimental results show that CPP-ATPG exhibits close-to-linear speedup for at least up to 12 threads.

Hard functional and logic failures which are insensitive to temperature, voltage, or frequency have become increasingly difficult to debug in advanced technology nodes, especially when Photon Emission (PEM) analysis could not provide any leads and Dynamic Laser Stimulation (DLS) could not be used due to the nature of the failure (no pass/fail margin). Laser Voltage Imaging (LVI), which is an extension of the Laser Voltage Probing (LVP) technique, provides a visual map of active components that are toggling at a certain frequency. This technique is widely employed in scan chain debug due to its simplicity, efficiency, and accuracy. However, most of LVI applications in literature reviews only involve scan chain fault isolation. This paper will present alternative applications for LVI, apart from scan chain debug. One specific application is the debug of a broken signal path by sending a periodic signal as a stimulus to a GPIO pad and tracing the LVI signal through the path by frequency mapping. In this paper, the concept and methodology behind this fault isolation approach will be discussed in full detail. Furthermore, three case studies of different types of hard failures with different applications of LVI will also be presented: an IO functional failure, an ATPG (Automatic test pattern generation) SAF (Stuck At Fault) failure and a BSDL(Boundary scan description language) input interconnect failure, to illustrate how LVI could be deployed in fault isolation for those functional and logic hard failures.

Combining different techniques for sequential automated test pattern generation (ATPG) can help overcome their respective limits and exploit their advantages. In this paper, a hybrid technique resulting from mixing topologic and symbolic approaches to the sequential ATPG problem is presented. Macros are first identified within the circuit (possibly resorting to RT-level knowledge of circuit architecture). Information about macro behavior is then computed and efficiently stored resorting to symbolic techniques. A topological tool exploits this information during the ATPG process to speed-up the propagation task and to identify early unsuccessful choices. Experimental results are reported, demonstrating that the method is able to improve the efficiency of a topological ATPG in terms of required CPU time and attained fault coverage, especially on medium-sized control-dominated circuits.

The authors present an approach to improve sequential circuit automatic test pattern generation (ATPG) by using E-cells that capture knowledge of circuit functionality without physically modifying the circuit. The approach addresses the problem of test generation for circuits which are inherently testable but outstrip the ATPG algorithm's capacity to generate sufficient fault coverage in reasonable time. Using E-cells the ATPG algorithm processes a less complex virtual circuit. Experimental results on complex industrial designs demonstrate fault coverage improved by 258% and CPU time was reduced by an order of magnitude. >

Due to the continuous shrinking of semiconductor technology, there are more and more subtle errors or faults widely distributed in manufactured chips, and traditional "single" stuck-at fault model may become inappropriate. It is definitely better if all combinations of multiple faults can be completely tested. In this paper, we present ATPG (Automatic Test Pattern Generation) techniques targeting all multiple stuck-at faults, i.e. all combinations of stuck-at faults. That is, given "n" possibly faulty locations in a circuit, the target set of faults consists of 3 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">n</sup> - 1 fault combinations, as each possibly faulty location is under stuck-at 1, stuck-at 0, or normal/non-faulty. Traditional ATPG flows use fault simulators to eliminate all detectable faults by the current set of test vectors. The problem, however, fault simulators represent fault lists explicitly in the sense that all possible faults are enumerated in the fault lists. This prevents us from dealing with ultra large fault lists, such as 3 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">n</sup> - 1 faults. We need "implicit" representation of faults in order to deal with such huge numbers of faults or fault combinations. We present SAT based formulations for ATPG of circuits having very large numbers of faults by implicitly eliminating detected faults. We solve a set of SAT problems whose constraints increase pure incrementally (here "pure" means never deleting constraints), and so the entire solving process can be very efficient, as all learnings obtained so far are valid in the following SAT problems. Experiments are performed on combinational parts of ISCAS89 circuits in their AIG (AND-Inverter Graph) representations. We have successfully generated the complete set of test vectors assuming that faults happen only at outputs of gates. Our ATPG techniques can also start with a given set of test vectors. If we start the ATPG processes with a set of test vectors for single stuck-at faults, we can obtain the set of additional test vectors required for multiple stuck-at faults. Results are a little bit surprising in the sense that we need very few additional test vectors for multiple faults, although the numbers of fault combinations are exponentially larger. As far as we know, for the first time, complete test vectors for all stuck-at faults for ISCAS89 circuits where faults happen only at outputs of gates in AIG representations of the circuits have been obtained.

This paper presents an efficient automatic test pattern generation technique for loop-free circuits. A partial scan technique is used to convert a sequential circuit (finite state machine) with arbitrary feedback paths into a pipelined circuit for testing. Test generation for these modified circuits can be performed with a modified combinational automatic test pattern generator (ATPG), which is much faster than a sequential ATPG. A combinational model is obtained by replacing all flipflops by buffers. It is shown that a test vector for a fault in this model obtained by a combinational test generator can be expanded into a sequence of identical vectors to detect the same fault in the original sequential circuit. This technique may abort a few faults which can then be resolved with a sequential ATPG. Experiments on the ISCAS89 circuits show that only 30% to 70% of flipflops require scanning in larger circuits and 96% to 100% fault coverage for almost all the circuits without resorting to a sequential ATPG.

In this paper, we propose a hierarchical automatic test pattern generation (ATPG) framework that can generate custom tests for full-scan systems-on-chip (SOCs) containing intellectual property (IP) cores without revealing much IP. The proposed ATPG is shown to be correct and complete and its average and worst case complexities are shown to be comparable with those of classical ATPG. The proposed ATPG reduces DFT overheads and test application costs. It also enables utilization of a range of test methodologies at the SOC level.

The type of Field Programmable Gate Arrays (FPGAs) technology and device family used in a design is a key factor for system reliability. Though antifuse-based FPGAs are widely used in aerospace because of their high reliability, current antifuse-based FPGA devices are expensive and leave no room for mistakes or changes since they are not reprogrammable. The substitute for antifuse-based FPGAs are needed in aerospace design, they should be both reprogrammable and highly reliable to Single Event Upset effects (SEUs). SRAM-based FPGAs are widely and systematically used in complex embedding digital systems both in a single chip industry and commercial applications. They are reprogrammable and high in density because of the smaller SRAM cells and logic structures. But the SRAM-based FPGAs are especially sensitive to cosmic radiation because the configuration information is stored in SRAM memory. The ideal FPGA for aerospace use should be high-density SRAM-based which is also insensitive to cosmic radiation induced SEUs. Therefore, in order to enable the use of SRAM-based FPGAs in safety critical applications, new techniques and strategies are essential to mitigate the SEU errors in such devices. In order to improve the reliability of SRAM-based FPGAs which are very sensitive to SEU errors, techniques such as reconfiguration and Triple Module Redundancy (TMR) are widely used in the aerospace electronic systems to mitigate the SEU and Single Event Functional Interrupt (SEFI) errors. Compared to reconfiguration and triplication, scrubbing and partial reconfiguration will utilize fewer or even no internal resources of FPGA. What's more, the detection and repair process can detect and correct SEU errors in configuration memories of the FPGA without affecting or interrupting the proper working of the system while reconfiguration would terminate the operation of the FPGA. This paper presents a payload system realized on Xilinx Virtex-4 FPGA which mitigates SEU effects in the internal FPGA by implementing scrubbing strategy and thus improve the reliability of the whole system.

The ever increasing size and complexity of today’s Very-Large-Scale-Integration (VLSI) designs requires a thorough investigation of new approaches for the generation of test patterns for both test and diagnosis of faults. SAT-based automatic test pattern generation (ATPG) is one of the most popular methods, where, in contrast to classical structural ATPG methods, first a mathematical representation of the problem in form of a Boolean formula is generated, which is then evaluated by a specialized solver. If the considered fault is testable, the solver will return a satisfying assignment, from which a test pattern can be extracted; otherwise no such assignment can exist. In order to speed up test pattern generation, the concept of D-chains was introduced by several researchers. Thereby supplementary clauses are added to the Boolean formula, reducing the search space and guiding the solver toward the solution. In the past, different variants of D-chains have been developed, such as the backward D-chain or the indirect D-chain. In this work we perform a thorough analysis and evaluation of the D-chain variants for test pattern generation and also analyze the impact of different D-chain encodings on diagnostic test pattern generation. Our experimental results show that depending on the incorporated D-chain the runtime can be reduced tremendously.

Cell-aware test (CAT) explicitly targets defects inside library cells and therefore significantly reduces the amount of test escapes compared to conventional automatic test pattern generation (ATPG). Our CAT flow consists of three steps: (1) defect-location identification (DLI), (2) defect characterization based on detailed analog simulation of the cells, and (3) cell-aware automatic test pattern generation (ATPG). This paper focuses on Step 1, as quality and cost are determined by the set of cell-internal defect locations considered in the remainder of the flow. Based on technology inputs from the user and a parasitic extraction (PEX) run that analyzes the cell layouts, we derive a set of open defects on and short defects between both transistor terminals and intra-cell interconnects. The full set of defect locations is stored for later use during failure analysis. Through dedicated DLI algorithms, we identify a compact subset of defect locations for defect characterization and ATPG, in which we include only one representative defect location for each set of equivalent defects locations. For Cadence’s GPDK045 library, the compact subset contains only 2.8% of the full set of defect locations and reduces the time required for defect characterization with the same ratio.

This work proposes automatic test pattern generation (ATPG) for Null Convention Logic (NCL). NCL is a robust asynchronous paradigm that introduces new challenges to test and testability algorithms due to the lack of a clock signal and the presence of a large number of state holding elements. The main features of this work are clockless, self-timed ATPG for all single stuck-at faults in NCL circuits, including those of gate internal feedback (GIF). The detection of faults on GIF is performed with no added test hardware. To the extent of our knowledge, this is the first work which has addressed clockless, self-timed ATPG with coverage for faults on GIF of NCL gates and with no area overhead. The proposed test generation algorithms are evaluated for several real-size NCL circuits with average 96.2% fault coverage.

An automatic test pattern generation (ATPG) method is presented for a scan-based test architecture which minimizes ATE storage requirements and reduces the bandwidth between the automatic test equipment (ATE) and the chip under test. To generate tailored deterministic test patterns, a standard ATPG tool performing dynamic compaction and allowing constraints on circuit inputs is used. The combination of an appropriate test architecture and the tailored test patterns reduces the test data volume up to two orders of magnitude compared with standard compacted test sets.

Today, VLSI design has progressed to a stage where it needs to incorporate methods of testing circuits. The Automatic Test Pattern Generation (ATPG) is a very attractive method and feasible on almost any combinational and sequential circuit. Currently available automatic test pattern generators (ATPGs) generate test sets that may be excessively long. Because a cost of testing depends on the test length, compaction techniques have been used to reduce that length. The motivation for studying test compaction is twofold. Firstly, by reducing the test sequence length, the memory requirements during the test application and the test application time are reduced. Secondly, the extent of test compaction possible for deterministic test sequences indicates that test pattern generators spend a significant amount of time generating test vectors that are not necessary. The compacted test sequences provide a target for more efficient deterministic test generators. Two types of compaction techniques exist: dynamic and static. The dynamic test sequence compaction performs compaction concurrently with the test generation process and often requires modification of the test generator. The static test sequence compaction is done in a post-processing step to the test generation and is independent of the test generation algorithm and process. In the thesis, a new idea for static compaction of test sequences for synchronous sequential circuits has been proposed. Our new method - SUSEM (Set Up Sequence Elimination Method) uses the circuit state information to eliminate some setup sequences for the target faults and consequently reduce the test sequence length. The technique has been used for the test sequences generated by HITEC test generator. ISCAS89 benchmark circuits were used in our experiments, for some circuits which have a large number of target faults and relatively small number of flip-flops, the very significant compactions have been obtained. The more important is that this method can be used to improve the test generation procedure unlike most static compaction methods which blindly or randomly remove parts of test vectors and cannot be used to improve the test generators.

DFT (Design for Testability) is a methodology of testing for manufacturing defects in a chip. DFT consists of scan, ATPG (Automatic test pattern generation) methodologies and the BIST (Built in self-test) methods. This paper explores ATPG for pattern generation and LBIST (Logic built-in self-test) for testing. LBIST is explored and tested using pseudorandom test pattern generation. The fault list created for undetected faults are dumped into ATPG and fault specific test patterns are generated. These patterns detect the random pattern resistant faults (which are undetected by pseudorandom testing patterns). Further, a smart compression algorithm is defined to compress the pattern which can be stored inside the chip for LBIST testing, with no added memory overhead, and the minimum extra hardware (which only comprises of combinational logic). The proposed algorithm has been reviewed and analyzed and it has been found that the fault coverage achieved is 86.01%.

The statistical delay of a path is traditionally modeled as a Gaussian random variable assuming that the path is always sensitized by a test pattern. Its sensitization in various circuit instances varies among its test patterns and the pattern induced delay is non-Gaussian. It is modeled using probability mass functions (PMFs). This article presents an automatic test pattern generation (ATPG) method, where multiple uncorrelated test patterns per path improve its defect coverage (DC). The impact of the ATPG process is evaluated by comparing to traditional methods. It is also shown that the presented ATPG is useful in selecting critical paths.