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Inter-Chip Low-Voltage-Swing Transceivers

  • Jan 1, 1997
  • Muhammad S Elrabaa +2 more
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Abstract

The BiCMOS technology has proven to be an excellent workhorse for telecommunication applications [1]. This is due to its excellent digital and analog capabilities as well as the variety of I/O’s it offers. Consequently, this made the design process, using the BiCMOS technology, a very flexible one. However, lately due to the ever increasing complexity of telecommunication switches, the need has arisen for novel circuits with low on-chip power consumption. This is particularly important in two classes of circuits which conventionally consumed the most power; signal translation circuits, and I/O circuits. Moreover, since the DSP portions of telecommunication chips are usually implemented using CMOS logic, the supply voltages will have to be scaled down for future submicron and deep submicron BiCMOS technologies to maintain a high reliability for the CMOS circuits. Also, many of the recently reported low-voltage-swing driver circuits have a compatibility problem. These circuits range from reduced-swing CMOS [2], and CMOS pseudo-ECL or CMOS 100K ECL [3], [4], to CMOS GTL [5]. While the CMOS reduced-swing transceivers have limited speed, the CMOS true or pseudo ECL are complicated to design and have high power consumption, and the GTL requires different reference and termination voltages. Each of these transceivers as well as the true or pseudo Bipolar ECL or CML transceivers requires a different termination voltage and hence the incompatibility problem arises. This means that signal conversion parts as well as multiple termination and reference voltages would be required in systems using parts with different transceiver types, thus increasing the overall system cost and complexity.

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