LCD 패널을 탑재한 옥외 광고용 콘솔 개발에 관한 연구

System Engineering processes were applied to create a Cooling Fan System Noise Analysis Tool for a back-hoe loader machine. The Cooling Fan System Noise Analysis Tool combined elements of aeroacoustic theory, Fan Law, sound power measurements and particle image velocimetry into a single computer analysis tool. The cooling fan system consisted of a cooling fan, multiple radiators in front of the cooling fan, a shroud, a mock engine behind the cooling fan, and a simulated engine compartment. A vortex flow structure was measured in front of the cooling fan. The cooling fan system sound power spectrum was measured. The radiated sound power spectrum for the vortex interaction with the fan blades was calculated. Measured and predicted cooling fan system sound power results were compared. The overall structure and approach will be presented along with an overview of the theory and initial results.

In the current era the speed and performance of the systems are the most required thing in all the industries due to development of automation in all the fields. Central Processing Unit is the heart of a system which consists of various electronics components in it, due the presence of these components and their continuous functioning the heat generated in enormous in quantity which badly affects the performance of the CPU. There are many designs of heat sink to improve the efficiency, the commonly used heat sink is cooling fans. The cooling fans are modified from the reference to the existing ones of high performing CPUs. The modified fan has been tested for its performance computationally for different conditions of speed and heats. The performance of all the conditions has been compared and with help of computational fluid dynamics software results. The best design has been opted from the results of computational work and the numerical work was carried out to find the efficiency of the newly modified fans.

The present work evaluates thermal exchange through a double-layered mini-channel heat sink used as a cooling system for electronic components. Different factors influencing heat exchange enhancement were investigated using ANSYS-Fluent<sup>©</sup> software, which enables the simulation of the fluid flow and heat transfer. The evaluation of thermal exchange between the cold fluid and heated solid with high thermal dissipation has been accurately analyzed under the effect of system geometry, fluid nature, and cooling system material. The numerical outcomes demonstrated that the heat transfer quality significantly increases with the variation of the system shape, where the cooling system presented a significant reduction of average temperature by around 62%-65%. In addition, using pure water as the system coolant improved the heat transfer rate by about 42%-47% for different Reynolds number values by comparing it with ethylene glycol. Concerning the cooling system materials, the selection of the materials depends on the analysis of their thermal properties with the evolution of temperature and thermal exchange. Therefore, using copper as a cooling material improves the overall performance of a cooling system, delivering higher efficiency and performance.

The objective of the present investigation is to perform a feasibility study of the working of a passive cooling device employing ferrofluid as a cooling medium and designing its heat sink. A computational study has been performed using COMSOL MultiPhysics, wherein a feasibility study was first done to check the working of a ferrofluid-based cooling device, and thereafter a design strategy was developed for selecting the number and height of annular fins for cooling of the ferrofluid in the closed channel. Ferrofluid was allowed to flow in the miniature cooling system in the presence of an external magnetic field produced by a permanent magnet. As ferrofluid flows through the loop, the thermal energy it absorbs should be dissipated so that colder ferrofluid is available for the next cycle of operation. Annular fins have been employed in the heat sink region to augment the heat dissipation rate. The effect of fin height and spacing on temperature drop across the heat sink has been studied, and it was found that the number of fins has a direct relation with the temperature drop across the heat sink. Fin height also contributes to the temperature drop, but, beyond a certain value, its effect was found to be insignificant.

This study is to investigate the optimal design of cooling fan of low voltage motor. The cooling fan serves to control the temperature rise that may occur by electric loss of the motor. Cooling fans may affect airflow, temperature rise, noise and loss of a machine, so it is necessary to select the optimal cooling fan for the machines. The main factors that affect to the performance of the cooling fan are the outer diameter, width, angle, cross section and the number of the blade. This study has investigated key factors that may affect to the performance of the cooling fan by numerical analysis. For the numerical analysis, it has adapted a universal ANSYS FLEUTN CFD program and applied the k - ɛ turbulence model as turbulent flow is expected. In order to verify the reliability of the results of numerical analysis, a cooling fan was fabricated using a 3D printer, and airflow, temperature rise, mechanical loss, and efficiency of the cooling fan were compared by performance tests of the motor. The results have indicated that cooling fans in this study is verified in terms of the accuracy and reliability within about 4% of tolerance in the performance test.

The design of a thermal management system for an airborne, infrared, optical telescope system is described. This system provides transient thermal management for the optical elements of the system beginning at a high-temperature soak condition of 71°C (159.8°F) on the ground to a low-temperature operating condition of −30°C (−22°F) to −40°C (−40° F) within 45 min after aircraft takeoff. An active cooling system is employed to enable this rapid cooldown. In addition to the low-temperature requirement, the mirrors and lenses must be cooled so that temperature gradients across the optical elements are on the order of 1°C (33.8 °F) to 2°C (35.6 °F). The ambient air available for ground cooling is specified by the military environment to be 55°C (131.0 °F). As the aircraft takes off and climbs to an altitude of 11,582.4 m (38 kft), the ambient air temperature decreases to a low-temperature of −22°C (−7.6 °F) for steady, level flight at at Mach 0.9, this ambient air temperature results in a ram air inlet temperature on the order of 13.5°C (56.3 °F), after the air is captured and diffused to Mach 0.2 prior to entry into a ram air heat exchanger. This ram air heat sink is used to provide a chilled liquid for cooling of optical elements and the turret housing the system. The low temperatures required for this system, which are on the order of −30°C (−22 °F) to −40°C (−40 °F), make the use of forced-convection, liquid-cooling problematic because of the tendancy of liquids to become quite viscous as they approach these low temperature levels. Furthermore, the use of a single-phase heat transfer process will result in temperature gradients within the system. For these reasons, cooling concepts employing single-phase cooling using chilled-liquids have been eliminated from consideration. A low-temperature, low-pressure refrigerant, R-404a, is used as the working fluid. The themal management system uses the optical elements as the evaporator of a two-phase cooling system. The liquid refrigerant is introduced into the optical elements at the saturation temperature and saturation pressure of the liquid. The flow rate of the refrigerant will be controlled in such a manner that all of the heat transfer takes place in the liquid-vapor mixture region of the thermodynamic diagram for R-404a with the refrigerant exiting the elements at an arbitraily determned quality of approximately 0.8. This will assure that all of the heat transfer will be by boiling heat transfer and will take place at a constant temperature and essentially a constant pressure. Since the heat transfer coefficients are large and the process takes place at essentially a constant temperature, the optical elements will be controlled at the saturation temperature of the refrigerant and will be essentially a constant temperature across the expanse of the optical surface. The thermal management system is comprised of an array of TECs configured as a condenser HX. This TEC HX uses ram air as the eventual heat sink and will provide chilled-liquid produced by a liquid-to-ram air HX as the heat sink for the hot side of the TEC array. This system utilizes the system mass as the evaporator and a TEC HX as the condenser in a two-phase heat transfer process to provide rapid cooldown of the system mass to low temperatures in a short period of time and maintain that mass at proper operating temperatures with essentially zero temperature gradients throughout the system.

There is an increase in the use of automated systems as technology moves forward towards the 21st century; people are trying to make use of their time the most with modern technology, with Microcontrollers becoming a necessity. Arduino, the popular portable microcontroller is one of the best currently in terms of making fast, efficient, automated devices that help in day-to-day life. This paper aims to present the ARDUINO-powered COOLING SYSTEMS, which can be applied in different areas including daily used objects. The use of this as COOLING will improve human life while educating people on the uses of microcontrollers. This book defines the Arduino microcontroller and the Arduino idea. Their methodology was to share microcontroller-based equipment and plan stages to share thoughts and advance development. To meet the wide group of onlookers, the document has been segmented to fulfill the need of everyone. The document contains numerous equipment guides to help the peruser ascertain all assortment of frameworks. Keywords: ARDUINO; cooling system; Liquid Crystal Display ( LCD); Microcontroller; sensor.

  Taiwan’s current thin film transistor liquid crystal display (TFT-LCD) industry provides a representative, real-world example of both the collaboration within, and the competition in technologies and capital orientation. To compete successfully in the market, companies in the industry require continuous technology innovations for new products. Further, a large amount of investment and output value in TFT-LCD industry becomes one of the most important industries which drove the relative industrial development. Hence, firms in Taiwan suffered difficult industrial environment. Companies compete with both Japanese and Korean companies, which are known as the leading manufacturers in TFT-LCD industry, and earn low or negative profits. The study uses analytic hierarchy process (AHP) to conclude the views of experts from industry, the government, and academic. The study conducted five critical success factors in new product development (NPD) for TFT-LCD industry: innovation of NPD strategy, application and exploitation of NPD strategy, supportive resource from CEO, establishment of cross-functional NPD team, and development of commodity survey planning. The results show that R and D strategy, and organizational contexts are the most important factors. Based on the factors identified, a hierarchy model of critical success factors is proposed, with which TFT-LCD firms can formulate action plans for NPD.   Key words: Thin film transistor liquid crystal display (TFT-LCD), new product development, analytic hierarchy process (AHP).

An Experimental investigation on the thermal performance of copper with aluminium based finned heat sinks for electronics cooling system was studied. The heat sinks have different material proportions containing major constituent of aluminium and minor constituent of copper. Considered with straight finned heat sink for the experiments for its easiness in fabrication and efficient heat transfer properties. The observational results for aluminium with copper alloy are compared with pure aluminium heat sink. Heat sink geometry, fin pitch and its height were taken from the commercially available heat sinks. In this research work best heat sink geometry is chosen and cooked up with different volume of copper added with aluminium. Selected four different spots of heat sinks and the temperature raising characteristics were measured for natural convection. also the temperature is raised to a fixed temperature and the temperature lowering characteristics were measured in forced convection as the air circulation takes more heat to keep the heat sink temperature within the desired level.

Efficient thermal management in brewing is critical for product quality, energy efficiency, and sustainability. At Nile Breweries Limited, Mbarara, Uganda, the Plate Heat Exchanger (PHE) cooling system has faced persistent challenges in achieving the target wort outlet temperature of 283 K (10 °C) or lower. Understanding and optimizing the thermodynamic and operational performance of this system is essential, particularly in resource-constrained Sub-Saharan production environments. An integrated optimization framework was developed by combining thermodynamic modeling, empirical diagnostics, and machine learning. Over 50 production batches were monitored using a high-resolution (1 Hz) dataset to assess short-term performance, while a longer dataset of 480 batches was analyzed for fouling trends. Statistical regression, LMTD analysis, and correlation tests were applied to evaluate thermal relationships, and a feedforward Artificial Neural Network (ANN) was trained on seven operational parameters in MATLAB/Simulink to enable predictive control. Only 14.60% of production batches achieved the cooling target (95% CI: 11.2%-18.7%). Regression analysis showed a significant positive association between wort mass flow rate and outlet temperature (slope = 1.24 K/(kg/s), p < 0.001, R 2 = 0.42), and a negative correlation with heat exchanger effectiveness (slope = -0.0037 per kg/s, p = 0.012, adjusted R 2 = 0.28). LMTD decreased with increasing wort flow (slope = -0.42 K/(kg/s), p = 0.002, R 2 = 0.36), revealing a throughput-efficiency trade-off. Water flow rate improvements diminished beyond 12.1 kg/s, showing no significant effect on effectiveness (p = 0.18) or LMTD (p = 0.15). Fouling analysis indicated a gradual decline in mass-corrected effectiveness across 480 batches (slope = -0.00001 per batch, p < 0.001, R 2 = 0.22), while wort pH exerted a minor negative effect on effectiveness (r = -0.1645). The ANN demonstrated strong predictive accuracy (R 2 = 0.8762, MSE = 0.0578, MAE = 0.0938), with residuals confirming minimal bias. Optimization identified optimal operating ranges of 16-17 kg/s for water flow and <16.5 kg/s for wort flow. The study highlights a significant performance shortfall in the brewery's cooling system, driven primarily by throughput-efficiency trade-offs, diminishing thermal returns, and progressive fouling. By integrating classical thermodynamic analysis with machine learning, the research demonstrates a robust and scalable framework for enhancing energy efficiency and adaptive process control in brewing and other energy-intensive industries. This work advances the application of intelligent thermal management strategies in Sub-Saharan industrial contexts, with future research recommended in real-time fouling detection, economic optimization of flow control, and hybrid predictive modeling for dynamic production environments.

Most of the time, people suffer from the high and low temperatures inside cars, throughout the various seasons. The cooling system used in cars does not allow proper air filtration and thus submits either cold or hot air depending on the external temperature. To avoid this problem, the air should be modulated to deliver the needed temperature. This raises the need to create a new system that can change the temperature in the car without damaging or affecting any other parts. This paper consists of integrating semiconductors that can affect the ability to light and heat. The connection of the semiconductors to a solar panel allows the conversion of the sunlight into electricity. Adding a fan to the system is crucial because colder air can be drawn into the car from the outside and expels air from the inside. This addition can also cool the intimate car atmosphere by moving air across a heat sink. After the structure had been created, many experiments are tested. These tests reflect good performance under temperature changes causing different incoming currents related to time.

Airplane cooling process can be performed with the help of two different techniques. One is global cooling system and the other is local cooling system. The goal of present paper is to investigate both cooling systems which may be good candidates for a future hybrid airplane. In the parametric study of global cooling section, the present research determines the parameters which affect air mass flow rate required to provide the necessary cooling for the electrical components necessary to make a hybrid plane a reality. The analysis is performed for a cooling process based on an open cycle Reverse Brayton cycle or at times called an air refrigeration system. The main components of the cooling system will be a compressor, a heat exchanger and a turbine. Outside air will be drawn and pressurized to a certain pressure using a compressor, and the compressed air will be forced through a heat exchanger to reduce its temperature as low as possible to provide necessary cooling. After that, the air will expand through an expansion device (most cases a turbine) to reduce pressure and temperature to a cycle minimum. Finally, the processed air will now be available to cool the electrical components. We will analyze the above-mentioned options to determine the most economical and or feasible systems by comparing the processed air efficiency with the ram air that may also be used for cooling purposes. The novelty of the present work lies on the concept that, the cooling fluid is air and does not have a weight penalty for the airplane. The later section we discuss an example of a local cooling system. A classic local cooling technique discussed is based on a heat pipe technology. Theoretically, heat pipes can transport heat from a heat source and release it to an ambient heat sink. The paper investigates the thermal performance of thermosiphons of different percentage fills. By detecting various thermal parameters of the manufactured thermosiphons, a general relation between the thermal performance and the percentage fill is drawn. Thermal parameters analyzed include thermal resistance, heat transfer coefficient, and Nusselt number. The present paper shows that as the amount of working fluid increases in a heat pipe, the thermal performance improves till it reaches a limit at 50% fill. As the percentage fill increases beyond 50%, the thermal performance of a thermosiphon remains constant.

Some Thoughts About Data Type, Distribution, and Statistical Significance

This paper describes an experimental study of the cooling capabilities of microchannel and micro-pin-fin based on-chip cooling systems. The on-chip cooling systems integrated with a micro heat sink, simulated power IC (integrated circuit) and temperature sensors are fabricated by micromachining and silicon-to-silicon direct bonding. Three micro heat sink structures: a microchannel heat sink (MCHS), an inline micro-pin-fin heat sink (I-MPFHS) and a staggered micro-pin-fin heat sink (S-MPFHS) are tested in the Reynolds number range of 79.2 to 882.3. The results show that S-MPFHS is preferred if the water pump can provide enough pressure drop. However, S-MPFHS has the worst performance when the rated pressure drop of the pump is lower than 1.5 kPa because the endwall effect under a low Reynolds number suppresses the disturbance generated by the staggered micro pin fins but S-MPFHS is still preferred when the rated pressure drop of the pump is in the range of 1.5 to 20 kPa. When the rated pressure drop of the pump is higher than 20 kPa, I-MPFHS will be the best choice because of high heat transfer enhancement and low pressure drop price brought by the unsteady vortex street.

The battery Pack is an important component used as a source of electrical energy in E-Inobus. Therefore, an effective cooling system is required to ensure optimal conditions. So, to maintain the performance and safety of the battery pack, a system that can control the air in the battery box is needed. The purpose of this final project is to design a tool known as functional and performance testing. This research uses the R&amp;D method that refers to the ADDIE model. The object of this research is the optimization of the cooling system in the battery box. Data collection and testing of this tool are carried out functionally, and the performance of the tool is tested. Testing the performance of the tool. The result of this research is to successfully make a cooling system optimization tool that is made using a reconditioned box and cooling system optimization tool made using a reconditioned box and Wemos Mega 2560 as a microcontroller, with testing and functional testing on DHT22 has an average difference of 0.65°C. Average difference of 0.65 ° C on the DHT22 sensor (1) and 0.32 ° C on the DHT sensor (2), then the performance test of the device. DHT sensor (2) then tests the performance when working optimally at a fan speed of 6000 Rpm with a temperature of 25 ° C, and getting optimal results can reduce the temperature by 5 ° C.