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  • https://doi.org/10.1093/ietele/e88-c.8.1552Copy DOI Icon

Novel Stacked Packaging Structure Using Silica-Based PLC with Integrated Micro-Mirrors and Its Application to 8ch PD Array Module

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Abstract

We propose and demonstrate a new stacked packaging structure using silica-based planar lightwave circuits (PLCs) with integrated micro-mirrors. This structure enables us to integrate active devices on PLCs with certain flexibility as regards optical coupling design and device selection. To achieve this, we developed an integrated micromirror with an accurate reflection angle and shielding structures to prevent crosstalk, and successfully demonstrated an 8-channel photodiode array module with excellent characteristics consisting of a high responsivity of > 0.85 A/W and a low crosstalk of < -65 dB.

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